Solar cell with silicon oxynitride dielectric layer
Solar cells with silicon oxynitride dielectric layers and methods of forming silicon oxynitride dielectric layers for solar cell fabrication are described. For example, an emitter region of a solar cell includes a portion of a substrate having a back surface opposite a light receiving surface. A silicon oxynitride (SiO x N y , 0<x, y) dielectric layer is disposed on the back surface of the portion of the substrate. A semiconductor layer is disposed on the silicon oxynitride dielectric layer.
1. An emitter region of a solar cell, the emitter region comprising:
a portion of a substrate having a back surface opposite a front surface;
a silicon oxynitride (SiOxNy, 0<x, y) dielectric layer disposed on the back surface of the portion of the substrate, wherein the silicon oxynitride dielectric layer has a non-homogeneous distribution of nitrogen, wherein the silicon oxynitride dielectric layer has only one nitrogen concentration maxima, wherein a concentration of nitrogen at the maxima is 2-5% and equal to or greater than twice the a nitrogen concentration in another portion of the silicon oxynitride dielectric layer is 0-1%, and wherein the silicon oxynitride dielectric layer is a silicon oxynitride tunnel dielectric layer for the emitter region, wherein the silicon oxynitride dielectric layer has a first surface in contact with the back surface of the portion of the substrate, and a second surface opposite the first surface, and wherein the maxima is at the first surface of the silicon oxynitride dielectric layer; and
a semiconductor layer disposed on the silicon oxynitride dielectric layer.
2. The emitter region of claim 1 , wherein the front surface is a light receiving surface of the solar cell.
3. The emitter region of claim 1 , wherein the silicon oxynitride dielectric layer has a thickness approximately in the range of 10-20 Angstroms.
4. The emitter region of claim 1 , wherein the silicon oxynitride dielectric layer has a composition wherein x>y.
5. The emitter region of claim 1 , wherein the semiconductor layer disposed on the silicon oxynitride dielectric layer is a boron-doped silicon layer, and wherein the silicon oxynitride dielectric layer comprises boron atoms.
6. An emitter region of a solar cell, the emitter region comprising:
a portion of a substrate having a back surface opposite a front surface;
a silicon oxynitride (SiOxNy, 0<x, y) dielectric layer disposed on the back surface of the portion of the substrate, wherein the silicon oxynitride dielectric layer has a non-homogeneous distribution of nitrogen, wherein the silicon oxynitride dielectric layer has only one nitrogen concentration maxima, wherein a concentration of nitrogen at the maxima is 2-5% and equal to or greater than twice the a nitrogen concentration in another portion of the silicon oxynitride dielectric layer is 0-1%, and wherein the silicon oxynitride dielectric layer is a silicon oxynitride tunnel dielectric layer for the emitter region, wherein the silicon oxynitride dielectric layer has a first surface in contact with the back surface of the portion of the substrate, and a second surface opposite the first surface, wherein the maxima is at the first surface of the silicon oxynitride dielectric layer, wherein the silicon oxynitride dielectric layer has a thickness approximately in the range of 10-20 Angstroms, and wherein the silicon oxynitride dielectric layer has a composition wherein x>y; and
a semiconductor layer disposed on the silicon oxynitride dielectric layer.
7. The emitter region of claim 6 , wherein the front surface is a light receiving surface of the solar cell.
8. The emitter region of claim 6 , wherein the semiconductor layer disposed on the silicon oxynitride dielectric layer is a boron-doped silicon layer, and wherein the silicon oxynitride dielectric layer comprises boron atoms.
9. An emitter region of a solar cell, the emitter region comprising:
a portion of a substrate having a back surface opposite a front surface;
a silicon oxynitride (SiOxNy, 0<x, y) dielectric layer disposed on the back surface of the portion of the substrate, wherein the silicon oxynitride dielectric layer has a non-homogeneous distribution of nitrogen, wherein the silicon oxynitride dielectric layer has only one nitrogen concentration maxima, wherein a concentration of nitrogen at the maxima is 2-5% and equal to or greater than twice the a nitrogen concentration in another portion of the silicon oxynitride dielectric layer is 0-1%, and wherein the silicon oxynitride dielectric layer is a silicon oxynitride tunnel dielectric layer for the emitter region, wherein the silicon oxynitride dielectric layer has a first surface in contact with the back surface of the portion of the substrate, and a second surface opposite the first surface, wherein the maxima is at the first surface of the silicon oxynitride dielectric layer, and wherein the silicon oxynitride dielectric layer has a composition wherein x>y; and
a semiconductor layer disposed on the silicon oxynitride dielectric layer, wherein the semiconductor layer disposed on the silicon oxynitride dielectric layer is a boron-doped silicon layer, and wherein the silicon oxynitride dielectric layer comprises boron atoms.
10. The emitter region of claim 9 , wherein the front surface is a light receiving surface of the solar cell.
11. The emitter region of claim 9 , wherein the silicon oxynitride dielectric layer has a thickness approximately in the range of 10-20 Angstroms.