Magnetic small footprint inductor array module for on-package voltage regulator

1. An electronic assembly including:

a first IC including contact pads and a voltage regulator circuit; and

an inductor module including:

a module substrate including a magnetic dielectric material;

a first surface at the top of the inductor module and a second surface at the bottom of the inductor module;

a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil oriented to extend in the direction from the first surface to the second surface and including a first end and a second end and a core, wherein the coil core includes the magnetic dielectric material; and

a plurality of conductive contact pads electrically coupled to the first and second coil ends, wherein contact pads electrically coupled to the first coil ends are arranged on the first surface, and the contact pads electrically coupled to the second coil ends are arranged on the second surface;

wherein the first IC is arranged on a surface of the inductor module and wherein at least a portion of the contact pads of the inductor module are electrically coupled to the contact pads of the voltage regulator circuit.

2. The electronic assembly of claim 1 , including:

a second IC including a processor circuit and contact pads; and

a package substrate for an electronic package assembly, wherein the inductor module and the second IC are arranged on a first surface of the package substrate and the first IC is arranged on the inductor module, and wherein the package substrate includes conductive interconnect between contact pads of the inductor module and contact pads of the second IC.

3. The electronic assembly of claim 1 ,

a second IC including a processor circuit and contact pads; and

a package substrate of an electronic package assembly, wherein the first IC and the inductor module are arranged on a first surface of the package substrate and the second IC is arranged on a second surface of the package substrate, wherein the package substrate includes conductive interconnect between contact pads of the inductor module and contact pads of the second IC.

4. The electronic assembly of claim 1 , including:

a second IC including a processor circuit and contact pads; and

a package substrate of an electronic package assembly, wherein the inductor module is embedded in the package substrate, wherein the first IC is arranged on a first surface of the package substrate, the second IC is arranged on a second surface of the package substrate, and the inductor module includes one or more vias electrically coupled to one or more contact pads of the first IC and one or more contacts pads of the second IC.

5. The electronic assembly of claim 4 , wherein a coefficient of thermal expansion (CTE) of the module substrate of the inductor module matches the CTE of the package substrate of the electronic package assembly.

6. The apparatus of claim 1 , wherein the inductor module includes a thru module topology, and an inductive circuit element of the plurality of inductive circuit elements extends from a contact pad arranged on the first surface at the top of the inductor module to a contact pad arranged on the bottom surface of the inductor module.

7. The apparatus of claim 1 , wherein the module substrate includes the magnetic dielectric in a first region and a non-magnetic dielectric region in a second region, wherein the first region includes the inductive circuit elements and the second region includes one or more signal vias, wherein a signal via is electrically coupled to a contact pad on the first surface of the inductor module and a contact pad on the second surface of the inductor module.

8. The apparatus of claim 1 , wherein the magnetic dielectric material includes a magnetic particle polymer composite resin.