Imaging device

1. An imaging device comprising a plurality of pixels two-dimensionally disposed,

at least part of the plurality of pixels including:

a first photoelectric conversion unit and a second photoelectric conversion unit provided in a semiconductor substrate and each including a first semiconductor region of a first conductivity type for accumulating a signal charge generated by photoelectric conversion;

a first isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a second semiconductor region forming a first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit; and

a second isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a trench isolation forming a second potential barrier higher than the first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit,

wherein the first photoelectric conversion unit and the second photoelectric conversion unit are arranged adjacent to each other in a first direction in a plan view,

wherein the first isolation region and the second isolation region are arranged adjacent to each other in a second direction intersecting the first direction in the plan view,

wherein the trench isolation comprises an insulating material, and

wherein the first isolation region does not include the trench isolation.

2. The imaging device according to claim 1 , wherein the at least part of the plurality of pixels includes two second isolation regions, and

the two second isolation regions are arranged across the first isolation region in the second direction.

3. The imaging device according to claim 1 , wherein the first isolation region is arranged at a center of the pixel in the plan view.

4. The imaging device according to claim 1 , wherein a location of the first isolation region in the pixel is set according to a location of the pixel in a pixel region.

5. The imaging device according to claim 1 , wherein a length of the first isolation region in a plan view is equal to or smaller than a length of the second isolation region in the plan view.

6. The imaging device according to claim 1 , wherein a width of the second isolation region in a plan view is narrower than a width of the first isolation region in the plan view.

7. The imaging device according to claim 1 , wherein the at least part of the plurality of pixels further includes a third isolation region provided between another adjacent pixel and the first photoelectric conversion unit, and

a potential barrier of the third isolation region for the signal charge between the first semiconductor region of the first photoelectric conversion unit of one pixel and the first semiconductor region of the second photoelectric conversion unit of the another adjacent pixel is higher than the first potential barrier.

8. The imaging device according to claim 7 , wherein a width of the third isolation region in a plan view is wider than the width of the first isolation region in the plan view.

9. The imaging device according to claim 7 , wherein at least part of the third isolation region is a trench isolation.

10. The imaging device according to claim 7 , wherein the third isolation region is provided throughout a depth deeper than a depth from a first surface of the semiconductor substrate to the location where each of the first semiconductor regions of the first and second photoelectric conversion units, the first isolation region and the second isolation region are provided.

11. The imaging device according to claim 7 , wherein the second semiconductor region is a second conductivity type, and

the third isolation region includes a third semiconductor region of the second conductivity type with a carrier concentration higher than the second semiconductor region.

12. The imaging device according to claim 1 , wherein the second semiconductor region is the first conductivity type, and

a carrier concentration of the second semiconductor region is lower than a carrier concentration of the first semiconductor region.

13. The imaging device according to claim 1 , further comprising:

a fourth semiconductor region of the second conductivity type around the second isolation region, wherein a carrier concentration of the fourth semiconductor region is higher than a carrier concentration of the second semiconductor region.

14. The imaging device according to claim 1 , wherein the insulating material is selected from among silicon oxide, silicon nitride, silicon oxynitride and silicon carbide.

15. The imaging device according to claim 1 , wherein the first isolation region and the second isolation region are provided throughout a depth deeper than the depth from a first surface of the semiconductor substrate to the location where each of the first semiconductor regions of the first and second photoelectric conversion units is provided.

16. The imaging device according to claim 1 , wherein the semiconductor substrate includes a first surface and a second surface,

the first isolation region is provided from the first surface to the second surface of the semiconductor substrate, and

the second isolation region is provided on a part closer to the first surface in the region from the first surface to the second surface of the semiconductor substrate.

17. The imaging device according to claim 15 , wherein the at least part of the plurality of pixels further includes one microlens closer to the first surface of the semiconductor substrate, the microlens configured to condense light on the first photoelectric conversion unit and the second photoelectric conversion unit.

18. An imaging system comprising:

an imaging device including a plurality of pixels two-dimensionally disposed, at least part of the plurality of pixels including:

a first photoelectric conversion unit and a second photoelectric conversion unit provided in a semiconductor substrate and each including a first semiconductor region of a first conductivity type for accumulating a signal charge generated by photoelectric conversion;

a first isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a second semiconductor region forming a first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit; and

a second isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a trench isolation forming a second potential barrier higher than the first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit,

wherein the first photoelectric conversion unit and the second photoelectric conversion unit are arranged adjacent to each other in a first direction in a plan view,

wherein the first isolation region and the second isolation region are arranged adjacent to each other in a second direction intersecting the first direction in the plan view,

wherein the trench isolation comprises an insulating material, and

wherein the first isolation region does not include the trench isolation; and

a signal processing unit that processes a signal output from the imaging device,

wherein the signal processing unit calculates a defocus amount based on a first signal based on a signal charge generated by the first photoelectric conversion unit and a second signal based on a signal charge generated by the second photoelectric conversion unit.

19. The imaging system according to claim 18 , wherein the signal processing unit generates an image based on a third signal based on a signal charge generated by the first photoelectric conversion unit and the second photoelectric conversion unit.

20. An imaging device comprising a plurality of pixels two-dimensionally disposed,

at least part of the plurality of pixels including:

a first photoelectric conversion unit and a second photoelectric conversion unit provided in a semiconductor substrate and each including a first semiconductor region of a first conductivity type for accumulating a signal charge generated by photoelectric conversion;

a first isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a second semiconductor region forming a first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit; and

a second isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a trench isolation forming a second potential barrier higher than the first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit,

wherein the first photoelectric conversion unit and the second photoelectric conversion unit are arranged adjacent to each other in a first direction in a plan view,

wherein the first isolation region and the second isolation region are arranged adjacent to each other in a second direction intersecting the first direction in the plan view,

wherein the at least part of the plurality of pixels includes two second isolation regions, and

wherein the two second isolation regions are arranged across the first isolation region in the second direction.

21. An imaging device comprising a plurality of pixels two-dimensionally disposed,

at least part of the plurality of pixels including

a first photoelectric conversion unit and a second photoelectric conversion unit provided in a semiconductor substrate and each including a first semiconductor region of a first conductivity type for accumulating a signal charge generated by photoelectric conversion;

a first isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a second semiconductor region forming a first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit; and

a second isolation region provided in the semiconductor substrate between the first photoelectric conversion unit and the second photoelectric conversion unit and including a trench isolation forming a second potential barrier higher than the first potential barrier for the signal charge between the first semiconductor region of the first photoelectric conversion unit and the first semiconductor region of the second photoelectric conversion unit,

wherein the first photoelectric conversion unit and the second photoelectric conversion unit are arranged adjacent to each other in a first direction in a plan view,

wherein the first isolation region and the second isolation region are arranged adjacent to each other in a second direction intersecting the first direction in the plan view,

wherein the first isolation region is arranged at a center of the pixel in the plan view.