Memory device and method of manufacturing the same
A memory device includes: a memory layer that is isolated for each memory cell and stores information by a variation of a resistance value; an ion source layer that is formed to be isolated for each memory cell and to be laminated on the memory layer, and contains at least one kind of element selected from Cu, Ag, Zn, Al and Zr and at least one kind of element selected from Te, S and Se; an insulation layer that isolates the memory layer and the ion source layer for each memory cell; and a diffusion preventing barrier that is provided at a periphery of the memory layer and the ion source layer of each memory cell to prevent the diffusion of the element.
1. A memory cell comprising:
an insulation layer and a polysilicon plug buried in the insulation layer;
a first electrode and a second electrode, the second electrode being embedded in an upper portion of the insulation layer and on the polysilicon plug and, in a cross-section, the second electrode is tapered;
an ion source layer between the first and the second electrodes;
a memory layer between the ion source layer and the second electrode, the second electrode being between the memory layer and the polysilicon plug, the second electrode having an upper surface facing the memory layer that is wider than an outer periphery of the memory layer, the memory layer having a cavity within which is received the ion source layer; and
a diffusion preventing barrier surrounding a periphery of the memory layer.
2. The memory cell according to claim 1 , further comprising an interlayer insulation layer surrounding the memory layer and the diffusion preventing barrier, wherein the diffusion preventing barrier is provided between the interlayer insulation layer and a sidewall of the memory layer.
3. The memory cell according to claim 1 , wherein the diffusion preventing barrier is made from an oxide film or nitride film of a metal element selected from Ti, Ta, Ru, Mn, Al, Co and W or an alloy of these metal elements.
4. The memory cell according to claim 1 , wherein the diffusion preventing barrier is made from amorphous SiN or amorphous SiCN.
5. The memory cell according to claim 1 , wherein the second electrode has a concavity at an upper surface thereof in which is received a portion of the memory layer.
6. The memory cell according to claim 1 , wherein the memory layer is U-shaped in the cross section.
7. The memory cell according to claim 1 , wherein the memory layer is U-shaped in the cross section and the second electrode has a planar upper surface against which the memory layer abuts.
8. The memory cell according to claim 1 , wherein the memory layer includes an oxide layer.
9. The memory cell according to claim 1 , wherein the ion source layer contains at least one kind of element selected from Cu, Ag, Zn, Al and Zr and at least one kind of element selected from Te, S and Se.
10. The memory cell according to claim 1 , wherein the memory layer stores information by a variation of a resistance value.
11. A memory apparatus comprising:
an under layer;
a common electrode; and
a plurality of memory cells each in accordance with claim 1 ,
wherein,
the under layer comprises the polysilicon plugs and insulating layers of the memory cells, and
the common electrode is comprised of the first electrodes of the memory cells.
12. The memory apparatus according to claim 11 , further comprising an interlayer insulating layer isolating the memory cells from each other.
13. The memory apparatus according to claim 11 , wherein, for each memory device, the diffusion preventing barrier is made from an oxide film or nitride film of a metal element selected from Ti, Ta, Ru, Mn, Al, Co and W or an alloy of these metal elements.
14. The memory apparatus according to claim 11 , wherein, for each memory cell, the diffusion preventing barrier is made from amorphous SiN or amorphous SiCN.
15. The memory apparatus according to claim 11 , wherein for each memory cell, the second electrode has a concavity at an upper surface thereof in which is received a portion of the memory layer.
16. The memory apparatus according to claim 11 , wherein, for each memory cell, the insulation layer is made from an oxide film.
17. The memory apparatus according to claim 14 , wherein, for each memory cell, the insulation layer is made from an oxide film.
18. The memory apparatus according to claim 11 , wherein, for each memory cell, the memory layer includes an oxide layer.
19. The memory apparatus according to claim 11 , wherein, for each memory cell, the ion source layer contains at least one kind of element selected from Cu, Ag, Zn, Al and Zr and at least one kind of element selected from Te, S and Se.
20. The memory apparatus according to claim 11 , wherein, for each memory cell, the memory layer stores information by a variation of a resistance value.
21. A memory apparatus comprising a plurality of memory cells, each memory cell comprising:
a portion of an under layer comprising an insulation layer and a polysilicon plug buried in the insulation layer;
a first electrode and a second electrode, the second electrode being embedded in the insulation layer and on the polysilicon plug;
an ion source layer between the first and the second electrodes;
a memory layer between the ion source layer and the second electrode, the second electrode being between the memory layer and the polysilicon plug, the second electrode having an upper surface facing the memory layer that is wider than an outer periphery of the memory layer, the memory layer having a cavity within which is received the ion source layer, the memory layer having a U-shape in a cross section; and
a diffusion preventing barrier surrounding a periphery of the memory layer,
wherein,
the under layer is comprised of all of the insulation layers and polysilicon plugs of the memory cells, and
the first electrodes form a common electrode.
22. The memory apparatus of claim 21 , wherein, for each memory cell, the second electrode has a concavity in the upper surface within which the memory layer is received.