IP Library › Granted Patent US 10,354,376
Granted Patent B2
US 10,354,376 · App. 15/918,570 · Granted Jul 16, 2019

Technique for measuring overlay between layers of a multilayer structure

Inventors: Yakov Weinberg (Modi'in, IL); Ishai Schwarzband (Or-Yehuda, IL); Roman Kris (Jerusalem, IL); Itay Zauer (Rehovot, IL); Ran Goldman (Hod Hasharon, IL); Olga Novak (Tel Aviv, IL); Dhananjay Singh Rathore (Boise, ID); Ofer Adan (Rehovot, IL); Shimon Levi (Tivon, IL)
Assignee: APPLIED MATERIALS ISRAEL LTD.
G06T7/0006G06K9/525G06T7/001G06T7/10G06T7/11G06T7/12G06T7/143G06T7/194G06T7/30G06T7/337G06T2207/10061G06T2207/20116G06T2207/30148
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Quick Facts
Patent No.
US 10,354,376
App. No.
15/918,570
Granted
Jul 16, 2019
Kind
B2
Abstract

A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.

Claims (61)

1. A method for determining overlay between layers of a multilayer structure, the method comprising:

receiving a given image representative of the multilayer structure;

receiving expected images of layers of the multilayer structure;

generating, based on the expected images, a combined expected image of the multilayer structure;

registering the given image against the combined expected image;

identifying safe areas within the expected images based on probable occlusions and distortions between the expected images and the given image; and

computing an overlay measurement between two layers of the multilayer structure based at least partially on the identified safe areas.

2. The method according to claim 1 , further comprising:

generating segmentation data for the given image; and

correcting the segmentation data based at least partially on the computed overlay measurement.

3. The method according to claim 2 , further comprising:

re-computing the overlay measurement using the corrected segmentation data.

4. The method according to claim 1 , wherein computing the overlay measurement between the two layers of the multilayer structure further comprises:

performing per-layer registration between a map of a specific layer of the two layers with a respective expected image of the specific layer;

for each of the two layers, measuring a shift of the specific layer by comparing the respective map of the specific layer with the respective expected image of the specific layer; and

determining the overlay measurement between the two layers based at least partially on a difference between the measured shifts.

5. The method according to claim 4 , further comprising:

performing the per-layer registration based at least partially on the identified safe areas.

6. The method according to claim 1 , wherein one or more of the expected images of the layers or the combined expected image are design images processed by simulation.

7. The method according to claim 1 , wherein the multilayer structure is a three-dimensional integrated circuit, and wherein the given image is a scanning electron micrograph of the three-dimensional integrated circuit.

8. A system for image processing comprising:

a memory to store a given image representative of a multilayer structure and expected images of layers of the multilayer structure; and

a processor configured to:

receive the given image representative of the multilayer structure;

receive the expected images of layers of the multilayer structure;

generate, based on the expected images, a combined expected image of the multilayer structure;

register the given image against the combined expected image;

identify safe areas within the expected images based on probable occlusions and distortions between the expected images and the given image; and

compute an overlay measurement between two layers of the multilayer structure based at least partially on the identified safe areas.

9. The system according to claim 8 , wherein the processor is further configured to:

generate segmentation data for the given image; and

correct the segmentation data based at least partially on the computed overlay measurement.

10. The system according to claim 9 , wherein the processor is further configured to:

re-compute the overlay measurement using the corrected segmentation data.

11. The system according to claim 8 , wherein to compute the overlay measurement between the two layers of the multilayer structure, the processor is further configured to:

perform per-layer registration between a map of a specific layer of the two layers with a respective expected image of the specific layer;

for each of the two layers, measure a shift of the specific layer by comparing the respective map of the specific layer with the respective expected image of the specific layer; and

determine the overlay measurement between the two layers based at least partially on a difference between the measured shifts.

12. The system according to claim 11 , wherein the processor is further configured to:

perform the per-layer registration based at least partially on the identified safe areas.

13. The system according to claim 8 , wherein one or more of the expected images of the layers or the combined expected image are design images processed by simulation.

14. The system according to claim 8 , wherein the multilayer structure is a three-dimensional integrated circuit, and wherein the given image is a scanning electron micrograph of the three-dimensional integrated circuit.

15. A non-transitory computer-readable medium having instructions encoded thereon that, when executed by a processor, cause the processor to:

receive given image representative of a multilayer structure;

receive expected images of layers of the multilayer structure;

generate, based on the expected images, a combined expected image of the multilayer structure;

register the given image against the combined expected image;

identify safe areas within the expected images based on probable occlusions and distortions between the expected images and the given image; and

compute an overlay measurement between two layers of the multilayer structure based at least partially on the identified safe areas.

16. The non-transitory computer-readable medium according to claim 15 , wherein the processor is to further:

generate segmentation data for the given image; and

correct the segmentation data based at least partially on the computed overlay measurement.

17. The non-transitory computer-readable medium according to claim 16 , wherein the processor is to further:

re-compute the overlay measurement using the corrected segmentation data.

18. The non-transitory computer-readable medium according to claim 15 , wherein to compute the overlay measurement between the two layers of the multilayer structure, the processor is to further:

perform per-layer registration between a map of a specific layer of the two layers with a respective expected image of the specific layer;

for each of the two layers, measure a shift of the specific layer by comparing the respective map of the specific layer with the respective expected image of the specific layer; and

determine the overlay measurement between the two layers based at least partially on a difference between the measured shifts.

19. The non-transitory computer-readable medium according to claim 18 , wherein the processor is to further:

perform the per-layer registration based at least partially on the identified safe areas.

20. The non-transitory computer-readable medium according to claim 15 , wherein one or more of the expected images of the layers or the combined expected image are design images processed by simulation.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2018
From: WEINBERG, YAKOV; SCHWARZBAND, ISHAI; KRIS, ROMAN; ZAUER, ITAY; GOLDMAN, RAN; NOVAK, OLGA; RATHORE, DHANANJAY SINGH; ADAN, OFER; LEVI, SHIMON
To: APPLIED MATERIALS ISRAEL LTD.
Reel/Frame 046085/0780 →
Continuity (3)
Continuation 15390663 · Dec 26, 2016
Continuation 14798283 · Jul 13, 2015
Related Publication 20180268539A1 · Sep 20, 2018
Cited By (1)
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