Semiconductor device and method for producing semiconductor device
Hydrogen atoms and crystal defects are introduced into an n-semiconductor substrate by proton implantation. The crystal defects are generated in the n-semiconductor substrate by electron beam irradiation before or after the proton implantation. Then, a heat treatment for generating donors is performed. The amount of crystal defects is appropriately controlled during the heat treatment for generating donors to increase a donor generation rate. In addition, when the heat treatment for generating donors ends, the crystal defects formed by the electron beam irradiation and the proton implantation are recovered and controlled to an appropriate amount of crystal defects. Therefore, for example, it is possible to improve a breakdown voltage and reduce a leakage current.
1. A semiconductor device, comprising:
a semiconductor substrate having a first and a second side, and comprising a singular donor layer with a doping concentration profile in a depth direction from the first side to the second side of the substrate;
the doping concentration profile comprising:
at least a first peak in said doping concentration profile, situated at a first distance Rp 1 from the first side of said substrate;
a region adjacent to the first peak and extending in the depth direction from the first peak toward the first side, which has a doping concentration greater than the doping concentration of the semiconductor substrate,
a second peak in said doping concentration profile, situated at a second distance Rp 2 from the first side of said substrate, wherein said second distance Rp 2 is less than said first distance Rp 1 and greater than zero; and
a region adjacent to the second peak and extending in the depth direction from the second peak toward the first side of the substrate, which has a doping concentration greater than the doping concentration of the semiconductor substrate.
2. A semiconductor device according to claim 1 , wherein doping concentration in a region between the first peak and the second peak is higher than the doping concentration of the semiconductor substrate.
3. A semiconductor device according to claim 1 , wherein doping concentration profile in a region between the first peak and the second peak is substantially uniform.
4. A semiconductor device according to claim 1 , wherein doping concentration in a region between the first peak and the second peak is at least 10 14 /cm 3 .
5. A semiconductor device according to claim 1 , wherein doping concentration in the region between the second peak and the first side of the substrate is greater than doping concentration in the region between the first peak and the second peak.
6. A semiconductor device according to claim 1 , wherein doping concentration profile at a distance beyond Rp 1 toward the second side of the substrate in the depth direction is substantially uniform.
7. A semiconductor device according to claim 1 , wherein doping concentration at the distance beyond Rp 1 toward the second side of the substrate is less than doping concentration in the region between the first peak and the second peak.
8. A semiconductor device according to claim 1 , wherein the region between the first peak and the second peak has crystal defects which have silicon atom dangling bonds terminated by hydrogen.
9. A semiconductor device according to claim 1 , wherein the region between the second peak and the first side of the substrate has crystal defects which have silicon atom dangling bonds terminated by hydrogen.
10. A semiconductor device according to claim 1 , wherein the region between the first peak and the second peak is a donor of a vacancy-oxygen-hydrogen complex defect.
11. A semiconductor device according to claim 1 , wherein the region between the second peak and the first side of the substrate is a donor of a vacancy-oxygen-hydrogen complex defect.
12. A semiconductor device according to claim 1 , wherein Rp 2 <0.5Rp 1 .
13. A semiconductor device according to claim 1 , wherein Rp 1 is at least 15 μm.
14. A semiconductor device, comprising:
a semiconductor substrate having a first and a second side, and comprising a singular donor layer with a doping concentration profile in a depth direction from the first side to the second side of the substrate;
the doping concentration profile comprising:
at least a first peak in said doping concentration profile, situated at a first distance Rp 1 from the first side of said substrate;
a region adjacent to the first peak and extending in the depth direction from the first peak toward the first side, which has a doping concentration which is greater than a doping concentration at the distance beyond Rp 1 toward the second side of the substrate;
a second peak in said doping concentration profile, situated at a second distance Rp 2 from the first side of said substrate, wherein said second distance Rp 2 is less than said first distance Rp 1 and greater than zero; and
a region adjacent to the second peak and extending in the depth direction from the second peak toward the first side of the substrate, which has a doping concentration which is greater than the doping concentration of the region adjacent to the first peak and extending in the depth direction from the first peak toward the first side.
15. A semiconductor device according to claim 14 , wherein doping concentration profile in a region between the first peak and the second peak is substantially uniform.
16. A semiconductor device according to claim 14 , wherein doping concentration in a region between the first peak and the second peak is at least 10 14 /cm 3 .
17. A semiconductor device according to claim 14 , wherein doping concentration profile at a distance beyond Rp 1 toward the second side of the substrate in the depth direction is substantially uniform.
18. A semiconductor device according to claim 14 , wherein the region between the first peak and the second peak is a donor of a vacancy-oxygen-hydrogen complex defect.
19. A semiconductor device according to claim 14 , wherein the region between the second peak and the first side of the substrate is a donor of a vacancy-oxygen-hydrogen complex defect.
20. A semiconductor device according to claim 1 , wherein the doping concentration profile in a region between the second peak and the first side of the substrate includes a substantially uniform portion.
21. A semiconductor device according to claim 14 , wherein the doping concentration profile in a region between the second peak and the first side of the substrate includes a substantially uniform portion.