Methods for removing barrier coatings, bondcoat and oxide layers from ceramic matrix composites
The disclosure relates generally to methods for removing coatings and bond coats of ceramic matrix composites. More specifically, the disclosure relates to, for example, methods of removing a bond coat from a ceramic matrix composite by contacting a ceramic matrix composite with at least one hydroxide at particular temperatures and removing the bond coat from said ceramic matrix composite.
1. A method of removing a bond coat from an article, the article comprising a ceramic matrix composite substrate and a bond coat comprising elemental silicon and silica disposed on the ceramic matrix composite substrate, said method comprising: contacting the article with a solution comprising at least 5 weight percent of at least one hydroxide for a sufficient time necessary for said at least one hydroxide to react with the bond coat and remove the bond coat from said ceramic matrix composite substrate.
2. The method of claim 1 , wherein substantially all of the bond coat is removed from the ceramic matrix composite substrate without damaging the ceramic matrix composite substrate.
3. The method of claim 1 , wherein said at least one hydroxide is selected from a group consisting of potassium hydroxide, sodium hydroxide, ammonium hydroxide, lithium hydroxide, and tetramethylammonium hydroxide.
4. The method of claim 1 , wherein said at least one hydroxide is sodium hydroxide.
5. The method of claim 1 , wherein the ceramic matrix composite substrate comprises SiC fibers in a SiC matrix, SiC fibers in a suicide containing matrix, SiC fibers in a Si—SiC matrix, carbon fibers in a carbon matrix, carbon fibers in a SiC matrix, or Alumina fibers in a SiC matrix.
6. The method of claim 5 , wherein the ceramic matrix composite substrate comprises SiC fibers in a Si—SiC matrix.
7. The method of claim 1 , wherein the solution further comprises water.
8. The method of claim 1 , wherein the solution comprises about 10 weight % to about 40% of sodium hydroxide.
9. The method of claim 1 , wherein the contacting and removing steps are: performed at an elevated temperature and pressure above ambient.
10. The method of claim 9 , wherein an elevated temperature is at least about 120 degrees Celsius and an elevated pressure of about 0.1 to 1 MPa.
11. The method of claim 1 , wherein the solution is at a temperature of at least about 50 degrees Celsius.
12. The method of claim 1 , wherein the contacting and removing steps are performed simultaneously with providing ultrasonic energy to said solution.
13. The method of claim 1 , wherein the article is contacted with the solution for 30 seconds or more.
14. The method of claim 1 , further including the step of contacting the substrate with water at a lower temperature than the temperature of said solution following the step of contacting with said solution.
15. The method of claim 1 , wherein the contacting step comprises immersing the article in the solution, wherein the solution is contained in a vessel open to ambient atmosphere.