Substrate treatment method, computer storage medium and substrate treatment system
A substrate treatment method of performing a plurality of predetermined treatments on a substrate to form a plurality of patterns stacked on the substrate, the substrate treatment method includes: a calculation step of calculating, about patterns in two layers stacked on the substrate, a mutual pattern displacement amount being a displacement amount between the patterns in the two layers, based on an end portion positional displacement of a pattern in an upper layer, an end portion positional displacement of a pattern in a lower layer, and an overlay of the patterns in the two layers; and a correction step of correcting, when the mutual pattern displacement amount exceeds a predetermined threshold, treatment conditions in the predetermined treatments to make the mutual pattern displacement amount fall within the predetermined threshold.
1. A substrate treatment method of performing a plurality of predetermined treatments on a substrate to form a plurality of patterns stacked on the substrate, the substrate treatment method comprising:
a calculation step of calculating, about patterns in two layers stacked on the substrate, a mutual pattern displacement amount being a displacement amount between the patterns in the two layers, based on an end portion positional displacement of a pattern in an upper layer, an end portion positional displacement of a pattern in a lower layer, and an overlay of the patterns in the two layers; and
a correction step of correcting, when the mutual pattern displacement amount exceeds a predetermined threshold, treatment conditions in the predetermined treatments to make the mutual pattern displacement amount fall within the predetermined threshold.
2. The substrate treatment method according to claim 1 ,
wherein the correction step is feedforward control of correcting treatment conditions in subsequent treatments for the substrate under treatment.
3. The substrate treatment method according to claim 1 ,
wherein the correction step is feedback control of correcting treatment conditions for a substrate to be treated next to the substrate under treatment.
4. The substrate treatment method according to claim 1 ,
wherein in the calculation step, the end portion positional displacement is calculated based on variation in critical dimension of the pattern and variation in barycentric position.
5. The substrate treatment method according to claim 1 ,
wherein the threshold of the mutual pattern displacement amount is calculated by following Expression (1)
IPFE
=
(
OVL
+
Δ
L
2
+
Δ
D
2
)
+
n
(
σ
OVL
+
σ
L
2
+
σ
D
2
)
(
1
)
where IPFE (Interactive Pattern Fidelity Error): the mutual pattern displacement amount, OVL: a value of the overlay, ΔL: a difference between a target value and an average value of the critical dimension of the pattern in the lower layer, ΔD: a difference between a target value and an average value of the critical dimension of the pattern in the upper layer, n: a positive coefficient, σ OVL : a standard deviation of the overlay, σ L : a standard deviation to of the critical dimension of the pattern in the lower layer, and σ D : a standard deviation of the critical dimension of the pattern in the upper layer.
6. The substrate treatment method according to claim 1 ,
wherein the predetermined threshold of the mutual pattern displacement amount is set based on an allowable positional displacement amount of the pattern in the upper layer to the pattern in the lower layer.
7. A computer-readable storage medium storing a program running on a computer of a control unit configured to control a substrate treatment system so as to cause the substrate treatment system to execute a substrate treatment method of performing a plurality of predetermined treatments on a substrate to form a plurality of patterns stacked on the substrate,
the substrate treatment method comprising:
a calculation step of calculating, about patterns in two layers stacked on the substrate, a mutual pattern displacement amount being a displacement amount between the patterns in the two layers, based on an end portion positional displacement of a pattern in an upper layer, an end portion positional displacement of a pattern in a lower layer, and an overlay of the patterns in the two layers; and
a correction step of correcting, when the mutual pattern displacement amount exceeds a predetermined threshold, treatment conditions in the predetermined treatments to make the mutual pattern displacement amount fall within the predetermined threshold.
8. A substrate treatment system configured to form a plurality of patterns stacked on a substrate, the substrate treatment system comprising:
a plurality of treatment apparatuses configured to perform predetermined treatments on the substrate; and
a control unit configured to set treatment conditions of the predetermined treatments,
wherein the control unit is configured to perform, through control of the control unit:
a calculation step of calculating, about patterns in two layers stacked on the substrate, a mutual pattern displacement amount being a displacement amount between the patterns in the two layers, based on an end portion positional displacement of a pattern in an upper layer, an end portion positional displacement of a pattern in a lower layer, and an overlay of the patterns in the two layers; and
a correction step of correcting, when the mutual pattern displacement amount exceeds a predetermined threshold, treatment conditions in treatments on the substrate to make the mutual pattern displacement amount fall within the predetermined threshold.