Three-dimensional phase change memory array including discrete middle electrodes and methods of making the same
Alternating stacks of insulating strips and sacrificial material strips are formed over a substrate. A laterally alternating sequence of pillar cavities and pillar structures can be formed within each of the line trenches. A phase change memory cell including a discrete metal portion, a phase change memory material portion, and a selector material portion is formed at each level of the sacrificial material strips at a periphery of each of the pillar cavities. Vertical bit lines are formed in the two-dimensional array of pillar cavities. Remaining portions of the sacrificial material strips are replaced with electrically conductive word line strips. Pathways for providing an isotropic etchant for the sacrificial material strips and a reactant for a conductive material of the electrically conductive word line strips may be provided by a backside trench, or by removing the pillar structures to provide backside openings.
1. A three-dimensional phase change memory device, comprising:
a first group of alternating stacks of insulating strips and electrically conductive strips located over a substrate, wherein each of the insulating strips and electrically conductive strips within the first group of alternating stacks laterally extends along a first horizontal direction, and the alternating stacks within the first group are laterally spaced apart along a second horizontal direction;
laterally alternating sequences of vertical bit lines and dielectric isolation pillars located between each neighboring pair of alternating stacks; and
a phase change memory cell including a discrete metal portion, a phase change memory material portion, and a selector material portion located in each intersection region between the electrically conductive strips and the vertical bit lines.
2. The three-dimensional phase change memory device of claim 1 , further comprising:
a second group of alternating stacks of insulating strips and electrically conductive strips located over the substrate; and
a backside trench laterally extending along the second horizontal direction and including a dielectric wall structure therein located between the first and the second groups of alternating stacks;
wherein:
the dielectric wall structure includes a first lengthwise sidewall that contacts sidewalls of each insulating strip and sidewalls of each electrically conductive strip within the first group of alternating stacks, and a second lengthwise sidewall that contacts sidewalls of each insulating strip and sidewalls of each electrically conductive strip within the second group of alternating stacks; and
each of the insulating strips and electrically conductive strips within the second group of alternating stacks laterally extends along the first horizontal direction, and the alternating stacks within the second group are laterally spaced apart along the second horizontal direction.
3. The three-dimensional phase change memory device of claim 2 , wherein:
each of the electrically conductive strips comprises a respective conformal metallic liner, and a respective metallic fill material portion that is not in direct contact with any of the dielectric isolation pillars;
each conformal metallic liner contacts a respective area of the first lengthwise sidewall of the dielectric wall structure; and
each metallic fill material portion contacts a respective area of the first lengthwise sidewall of the dielectric wall structure.
4. The three-dimensional phase change memory device of claim 1 , wherein the phase change memory cell further comprises a carbon portion located between the selector material portion and the phase change memory material portion.
5. The three-dimensional phase change memory device of claim 1 , wherein each of the dielectric isolation pillars contacts at least one vertical stack of phase change memory cells located at each level of the electrically conductive strips.
6. The three-dimensional phase change memory device of claim 1 , wherein each of the discrete metal portions is in direct contact with a respective one of the electrically conductive strips.
7. The three-dimensional phase change memory device of claim 1 , wherein each of the discrete metal portions is located between a phase change memory material portion and a selector material portion within a respective phase change memory cell.
8. The three-dimensional phase change memory device of claim 1 , wherein each phase change memory material portion is a respective portion within a phase change memory material layer that laterally surrounds a respective one of the vertical bit lines and continuously extends vertically along the respective one of the vertical bit lines from a bottommost level of the electrically conductive strips to a topmost level of the electrically conductive strips.
9. The three-dimensional phase change memory device of claim 1 , wherein each phase change memory material portion is a discrete phase change memory material portion having a maximum vertical extent that is equal to, or less than, a thickness of an electrically conductive strip located at a same level as the phase change memory material portion.
10. The three-dimensional phase change memory device of claim 1 , wherein each selector material portion is a respective portion within a selector material layer that laterally surrounds a respective one of the vertical bit lines and continuously extends vertically from a bottommost level of the electrically conductive strips to a topmost level of the electrically conductive strips.
11. The three-dimensional phase change memory device of claim 1 , wherein each selector material portion contacts only a single one of the discrete metal portions.
12. A method of forming a three-dimensional phase change memory device, comprising:
forming a vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers over a substrate;
forming line trenches laterally extending along a first horizontal direction through the vertically alternating sequence, wherein patterned portions of the vertically alternating sequence comprise alternating stacks of insulating strips and sacrificial material strips that laterally extend along the first horizontal direction, and the alternating stacks within the first group are laterally spaced apart along a second horizontal direction;
forming a laterally alternating sequence of pillar cavities and dielectric isolation pillars within each of the line trenches;
forming a phase change memory cell including a discrete metal portion, a phase change memory material portion, and a selector material portion at each level of the sacrificial material strips at a periphery of each of the pillar cavities;
forming a backside trench laterally extending along the second horizontal direction through each of the alternating stacks of insulating strips and sacrificial material strips;
replacing remaining portions of the sacrificial material strips with material portions that include electrically conductive strips; and
forming vertical bit lines in the two-dimensional array of pillar cavities.
13. The method of claim 12 , further comprising:
forming a forming dielectric rails in the line trenches;
forming a two-dimensional array of pillar cavities through the dielectric rails, wherein remaining portions of the dielectric rails comprise dielectric isolation pillars.
14. The method of claim 12 , wherein:
the line trenches are formed as a one-dimensional periodic array;
the pillar cavities are formed as a two-dimensional periodic array; and
each phase change memory cell is formed on a respective sacrificial material strip around a respective pillar cavity among the two-dimensional array of pillar cavities.
15. The method of claim 12 , further comprising:
removing the sacrificial material strips employing an isotropic etch process in which an isotropic etchant that etches the sacrificial material strips selective to the insulating strips is introduced into the backside trench and etches the sacrificial material strips to form backside cavities;
forming the electrically conductive strips by introducing at least one reactant for depositing at least one conductive material through the backside trench into the backside cavities, whereby the electrically conductive strips are formed; and
removing a collaterally deposited conductive material from inside the backside trenches.
16. The method of claim 12 , wherein a vertical stack of phase change memory cells is formed directly on each of the dielectric isolation pillars, wherein the vertical stack of phase change memory cells comprises a set of phase change memory cells formed at each level of the electrically conductive strips.
17. The method of claim 12 , wherein each of the discrete metal portions is formed directly on a respective one of the sacrificial material strips.
18. The method of claim 12 , wherein each of the discrete metal portions is formed between a phase change memory material portion and a selector material portion within a respective phase change memory cell.
19. The method of claim 12 , wherein:
each phase change memory material portion is a respective portion within a phase change memory material layer formed at a periphery of a respective one of the pillar cavities; and
each vertical bit line is formed directly on a respective one of the phase change memory material layer.
20. The method of claim 12 , further comprising:
laterally recessing the sacrificial material strips selective to the insulating strips to form lateral recesses prior to formation of the electrically conductive strips;
filling at least a portion of each lateral recess with a respective phase change memory material layer; and
etching back portions of the phase change memory material layers from volumes of the pillar cavities employing an etch back process, wherein the phase change memory material portions comprise discrete remaining phase change memory material portions after the etch back process.
21. The method of claim 12 , wherein each selector material portion is formed as a respective portion within a selector material layer that laterally surrounds a respective one of the vertical bit lines and continuously extends vertically from a bottommost level of the electrically conductive strips to a topmost level of the electrically conductive strips.
22. The method of claim 12 , wherein each selector material portion is formed as a discrete selector material portion that contacts only a single one of the discrete metal portions.