Light-emitting device and electronic device
A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
1. A light-emitting device comprising:
a pixel portion;
a first driver circuit;
a second driver circuit; and
an FPC,
wherein the pixel portion comprises:
a transistor over a first flexible substrate;
a planarization layer over the first flexible substrate and the transistor;
an organic EL element over the planarization layer, wherein the organic EL element is electrically connected to the transistor;
an adhesive layer over the planarization layer and the organic EL element; and
a second flexible substrate over the adhesive layer,
wherein a first thickness from the first flexible substrate to the planarization layer is 0.8 to 1.2 times as large as a second thickness from the second flexible substrate to the adhesive layer,
wherein the first driver circuit and the second driver circuit are over the first flexible substrate,
wherein the second driver circuit is provided on an opposite side of the first driver circuit across the pixel portion, and
wherein the FPC does not comprise a region sandwiched between the first flexible substrate and the second flexible substrate.
2. The light-emitting device according to claim 1 ,
wherein each of the first driver circuit and the second driver circuit is a scan line driver circuit.
3. The light-emitting device according to claim 1 , further comprising:
an electrode terminal over the first flexible substrate,
wherein the FPC is electrically connected to the electrode terminal.
4. An electronic device comprising the light-emitting device according to claim 1 .
5. A light-emitting device comprising:
a pixel portion;
a first driver circuit;
a second driver circuit; and
an FPC,
wherein the pixel portion comprises:
a transistor over a first surface of a first flexible substrate;
a planarization layer over the first flexible substrate and the transistor;
an organic EL element over the planarization layer, wherein the organic EL element is electrically connected to the transistor;
an adhesive layer over the planarization layer and the organic EL element; and
a second flexible substrate over the adhesive layer,
wherein the first flexible substrate comprises a second surface opposite to the first surface;
wherein the second flexible substrate comprises a third surface at the adhesive layer side and a fourth surface opposite to the third surface,
wherein a first distance from an interface between the planarization layer and the adhesive layer to the second surface is 0.8 to 1.2 times as large as a second distance from the interface to the fourth surface,
wherein the first driver circuit and the second driver circuit are over the first flexible substrate,
wherein the pixel portion is between the second driver circuit and the first driver circuit, and
wherein the FPC does not comprise a region sandwiched between the first flexible substrate and the second flexible substrate.
6. The light-emitting device according to claim 5 ,
wherein each of the first driver circuit and the second driver circuit is a scan line driver circuit.
7. The light-emitting device according to claim 5 , further comprising:
an electrode terminal over the first flexible substrate,
wherein the FPC is electrically connected to the electrode terminal.
8. An electronic device comprising the light-emitting device according to claim 5 .
9. A light-emitting device comprising:
a pixel portion;
a first driver circuit;
a second driver circuit; and
an FPC,
wherein the pixel portion comprises:
a transistor over a first flexible substrate;
a planarization layer over the first flexible substrate and the transistor;
an organic EL element over the planarization layer, wherein the organic EL element is electrically connected to the transistor;
an adhesive layer over the planarization layer and the organic EL element; and
a second flexible substrate over the adhesive layer,
wherein a first thickness from the first flexible substrate to the planarization layer is 0.8 to 1.2 times as large as a second thickness from the second flexible substrate to the adhesive layer,
wherein a neutral plane is positioned in the planarization layer, in the transistor, in the organic EL element, or near both the transistor and the organic EL element,
wherein the first driver circuit and the second driver circuit are over the first flexible substrate,
wherein the second driver circuit is provided on an opposite side of the first driver circuit across the pixel portion, and
wherein the FPC does not comprise a region sandwiched between the first flexible substrate and the second flexible substrate.
10. The light-emitting device according to claim 9 ,
wherein each of the first driver circuit and the second driver circuit is a scan line driver circuit.
11. The light-emitting device according to claim 9 , further comprising:
an electrode terminal over the first flexible substrate,
wherein the FPC is electrically connected to the electrode terminal.
12. An electronic device comprising the light-emitting device according to claim 9 .