IP Library › Granted Patent US 10,388,381
Granted Patent B2
US 10,388,381 · App. 15/973,865 · Granted Aug 20, 2019

Semiconductor memory device and operating method thereof

Inventors: Jae Hyeon Shin (Gyeonggi-do, KR); Sung Hyun Hwang (Seoul, KR)
Assignee: SK hynix Inc.
G11C16/10G11C16/0483G11C16/08G11C16/30G11C16/3427G11C16/0466G11C16/32
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Quick Facts
Patent No.
US 10,388,381
App. No.
15/973,865
Granted
Aug 20, 2019
Kind
B2
Abstract

A semiconductor memory device includes a memory cell array coupled to a plurality of word lines, a voltage generator generating a program voltage and first and second pass voltages in response to voltage generation control signals, an address decoder selectively applying the program voltage and the first and second pass voltages to the plurality of word lines in response to address decoder control signals, and a control logic controlling the voltage generator and the address decoder to perform a program operation.

Claims (40)

1. A semiconductor memory device, comprising:

a memory cell array coupled to a plurality of word lines;

a voltage generator generating a program voltage and first and second pass voltages in response to voltage generation control signals;

an address decoder selectively applying the program voltage and the first and second pass voltages to the plurality of word lines in response to address decoder control signals; and

a control logic controlling the voltage generator and the address decoder to perform a program operation,

wherein the control logic comprises:

a voltage generation control circuit generating the voltage generation control signals for controlling the peripheral circuit to generate the first pass voltage and the second pass voltage having rising periods different from each other; and

an address decoder control circuit generating the address decoder control signals for controlling the peripheral circuit to apply the program voltage to a selected word line, among the plurality of word lines, to apply the first pass voltage to first word lines adjacent to the selected word line, and to apply the second pass voltage to second word lines, except the first word lines and the selected word line.

2. The semiconductor memory device of claim 1 , wherein a potential level of each of the first pass voltage and the second pass voltage increases from a first level to a second level during each of the rising periods.

3. The semiconductor memory device of claim 2 , wherein the program voltage includes a first program voltage and a second program voltage having a higher potential level than the first program voltage, and

the peripheral circuit continuously applies the first program voltage and the second program voltage to the selected word line.

4. The semiconductor memory device of claim 3 , wherein a potential level of the first program voltage is the same as the first level of each of the first and second pass voltages.

5. The semiconductor memory device of claim 1 , wherein the control logic includes an algorithm for general operations and further includes a read only memory (ROM) outputting a plurality of internal control signals in response to an externally input command.

6. The semiconductor memory device of claim 5 , wherein the voltage generation control circuit comprises:

a selected word line voltage control circuit generating a first control signal for controlling the voltage generator to control a potential level of the program voltage applied to the selected word line in response to the plurality of internal control signals;

an adjacent word line voltage control circuit generating a second control signal for controlling the voltage generator to control a potential level of the first pass voltage applied to the first word lines in response to the plurality of internal control signals; and

an unselected word line voltage control circuit generating a third control signal for controlling the voltage generator to control a potential level of the second pass voltage applied to the second word lines in response to the plurality of internal control signals.

7. The semiconductor memory device of claim 6 , wherein the unselected word line voltage control circuit controls the voltage generator to apply the second pass voltage having a second level to the second word lines after a predetermined time when the first pass voltage having the second level is applied to the first word lines.

8. A semiconductor memory device, comprising:

a memory cell array including a plurality of memory cells coupled to a plurality of word lines, respectively;

a voltage generator outputting a program voltage, a first pass voltage, and a second pass voltage during a program operation;

an address decoder selectively applying the program voltage and the first and second pass voltages output from the voltage generator in response to the plurality of word lines; and

a control logic controlling the voltage generator and the address decoder to apply the program voltage to a selected word line, among the plurality of word lines, the first pass voltage to first word lines adjacent to the selected word line, and the second pass voltage to second word lines, among the plurality of word lines, except the selected word line and the first word lines, during the program operation,

wherein the control logic controls the voltage generator so that the first pass voltage and the second pass voltage increase from a first level to a second level and have rising slopes different from each other.

9. The semiconductor memory device of claim 8 , wherein the control logic controls the voltage generator to output the second pass voltage having the second level to which the second pass voltage is gradually increased by a step voltage from the first level.

10. The semiconductor memory device of claim 8 , wherein the control logic controls the voltage generator to output the second pass voltage having the second level to which the second pass voltage is linearly increased from the first level.

11. The semiconductor memory device of claim 8 , wherein the program voltage includes a first program voltage and a second program voltage having a higher potential level than the first program voltage, and

the address decoder continuously applies the first program voltage and the second program voltage to the selected word line.

12. The semiconductor memory device of claim 9 , wherein the first program voltage has the same potential level as the second pass voltage having the first level.

13. The semiconductor memory device of claim 8 , wherein the control logic controls the voltage generator to generate a first pass voltage having the second level by increasing the first pass voltage having the first level applied to the first word lines according to a first slope, and to generate the second pass voltage having the second level by increasing the second pass voltage having the first level applied to the second word lines according to a second slope, wherein the first slope is greater than the second slope.

14. The semiconductor memory device of claim 8 , wherein the control logic controls the voltage generator so that the second pass voltage applied to the second word lines reaches a flat section of the second level later than the first pass voltage applied to the first word lines.

15. A method of operating a semiconductor memory device, the method comprising:

applying a program voltage consisting of a first program voltage and a second program voltage to a selected memory cell; and

applying a first pass voltage to memory cells adjacent to the selected memory cell and applying a second pass voltage to remaining unselected memory cells,

wherein the first pass voltage and the second pass voltage have rising periods increasing from a first level to a second level and differing from each other.

16. The method of claim 15 , wherein the rising period of the first pass voltage is earlier than the rising period of the second pass voltage.

17. The method of claim 15 , wherein the first pass voltage has a first slope in the rising period, and the second pass voltage has a second slope in the rising period.

18. The method of claim 17 , wherein the first slope is higher than the second slope.

19. The method of claim 17 , wherein the second pass voltage is gradually increased by a step voltage from the first level to the second level or linearly increased from the first level to the second level.

20. The method of claim 15 , wherein the first pass voltage reaches a flat section of the second level earlier than the second pass voltage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2018
From: SHIN, JAE HYEON; HWANG, SUNG HYUN
To: SK HYNIX INC.
Reel/Frame 046100/0025 →
Priority Claims (1)
KR 10-2017-0110270 · Aug 30, 2017 · national
Continuity (1)
Related Publication 20190066793A1 · Feb 28, 2019
Cited By (1)
US 12,646,577