Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate
A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.
1. A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate, the method comprising:
forming an alteration layer that penetrates the wiring substrate and is patterned;
forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed;
removing the alteration layer to form a hole that extends continuously with straight sides through the wiring substrate; and
filling an electrode material in the hole, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and a wiring on a back surface side thereof.
2. The method of manufacturing a wiring substrate according to claim 1 , wherein
the glass substrate is formed of photosensitive glass in which the patterned alteration layer is capable of being formed by exposure and a heat treatment through a mask.
3. The method of manufacturing a wiring substrate according to claim 1 , wherein
the glass substrate is formed of non-photosensitive glass, and by exposure and a heat treatment through a mask, the patterned alteration layer is formed therein.
4. The method of manufacturing a wiring substrate according to claim 1 , wherein
the patterned alteration layer is formed by collected laser pulse irradiation.
5. The method of manufacturing a wiring substrate according to claim 1 , wherein
the patterned alteration layer is removed by using a chemical having selectivity with the glass.
6. The method of manufacturing a wiring substrate according to claim 1 , wherein
the wiring substrate includes an active element in addition to the through glass via and the wiring.
7. The method of manufacturing a wiring substrate according to claim 6 , wherein
a difference between a thermal expansion coefficient of the patterned alteration layer and a thermal expansion coefficient of a non-alteration layer other than the alteration layer is smaller than approximately 5 ppm/° C.
8. The method of manufacturing a wiring substrate according to claim 1 , further comprising an additional glass wiring substrate that is bonded to the wiring substrate with a light curing resin.
9. The method of manufacturing a wiring substrate according to claim 8 , wherein
when a resin is applied to bond the wiring substrate and the additional glass wiring substrate by pressure, a structure for preventing expansion of an applied area, which has one of a protruded shape and a depressed shape is formed on one of the wiring substrate and the additional glass wiring substrate.
10. The method of manufacturing a wiring substrate according to claim 8 , wherein
a base material of each of the wiring substrate and the additional glass wiring substrate is photosensitive glass.
11. The method of manufacturing a wiring substrate according to claim 1 , wherein
a component mounted on the wiring substrate includes entire surface-mountable components necessary for a semiconductor apparatus, a passive element, and a system structure, and includes a connection portion for mounting a component incapable of being mounted on a surface.
12. The method of manufacturing a wiring substrate according to claim 1 , wherein
the wiring substrate further comprises an outer layer surface that forms a casing surface of an electronic apparatus.
13. A device, comprising:
a wiring substrate comprising a glass substrate, a wiring, and a through glass via;
an alteration layer that penetrates the wiring substrate, wherein the alteration layer is patterned; and
an electrode material that is within a hole in the wiring substrate that was previously occupied by the alteration layer, wherein the hole extends continuously with straight sides through the wiring substrate from a front surface to a back surface of the wiring substrate;
wherein the wiring is on the front surface of the wiring substrate in which the alteration layer is formed, and
wherein the through glass via connects the wiring on the front surface of the wiring substrate and the wiring on the back surface of the wiring substrate.
14. The device according to claim 13 , wherein
the wiring substrate includes an active element in addition to the through glass via and the wiring.
15. The device according to claim 13 , wherein
a difference between a thermal expansion coefficient of the patterned alteration layer and a thermal expansion coefficient of a non-alteration layer other than the alteration layer is smaller than approximately 5 ppm/° C.
16. The device according to claim 13 , further comprising an additional glass wiring substrate that is bonded to the wiring substrate with a light curing resin.
17. The device according to claim 16 , wherein
when a resin is applied to bond the wiring substrate and the additional glass wiring substrate by pressure, a structure for preventing expansion of an applied area, which has one of a protruded shape and a depressed shape is formed on one of the wiring substrate and the additional glass wiring substrate.
18. The device according to claim 17 , wherein
a base material of each of the wiring substrate and the additional glass wiring substrate is photosensitive glass.
19. The device according to claim 13 , wherein
a component mounted on the wiring substrate includes entire surface-mountable components necessary for a semiconductor apparatus, a passive element, and a system structure, and includes a connection portion for mounting a component incapable of being mounted on a surface.
20. An electronic apparatus, comprising:
a device comprising:
a wiring substrate comprising a glass substrate, a wiring, and a through glass via;
an alteration layer that penetrates the wiring substrate, wherein the alteration layer is patterned; and
an electrode material that is within a hole in the wiring substrate that was previously occupied by the alteration layer, wherein the hole extends continuously with straight sides through the wiring substrate from a front surface to a back surface of the wiring substrate;
wherein the wiring is on the front surface of the wiring substrate in which the alteration layer is formed, and
wherein the through glass via connects the wiring on the front surface of the wiring substrate and a wiring on the back surface of the wiring substrate.