Cooling system, substrate processing system and flow rate adjusting method for cooling medium
Examples of a cooling system include a flow channel through which a cooling medium flows, a valve that is provided in the flow channel and configured to adjusts a flow rate of the cooling medium, a thermometer for measuring temperature of the cooling medium, a flowmeter for measuring a flow rate of the cooling medium passing through the valve, and a controller for determining cooling capacity of the cooling medium from measurement results of the thermometer and the flowmeter, and adjusting the valve so that the cooling capacity of the cooling medium approaches to a target value when the determined cooling capacity is different from the target value.
1. A cooling system comprising:
a flow channel through which a cooling medium flows;
a valve that is provided in the flow channel and configured to adjusts a flow rate of the cooling medium;
a thermometer for measuring temperature of the cooling medium;
a flowmeter for measuring a flow rate of the cooling medium passing through the valve; and
a controller that includes a processor and a storage device, the storage device storing a table or a function, such that the cooling capacity of the cooling medium is configured to be derived, using the table or the function, from values of the temperature and the flow rate, wherein
the processor determines cooling capacity of the cooling medium by comparing measurement results of the thermometer and the flowmeter to the table or the function stored by the storage device, and adjusts the valve so that the cooling capacity of the cooling medium approaches to a target value when the determined cooling capacity is different from the target value.
2. The cooling system according to claim 1 , wherein the storage device stores the table, and the processor determines the cooling capacity of the cooling medium by using the table.
3. The cooling system according to claim 1 , wherein the storage device stores the function, and the processor determines the cooling capacity of the cooling medium by using the function.
4. The cooling system according to claim 1 , further comprising a comparator for comparing the cooling capacity determined by the controller with the target value, and decreasing an opening degree of the valve when the cooling capacity is larger than the target value and increasing the opening degree of the valve when the cooling capacity is smaller than the target value.
5. A substrate processing system comprising:
a cooling system including a flow channel through which a cooling medium flows, a valve that is provided in the flow channel and configured to adjusts a flow rate of the cooling medium, a thermometer for measuring temperature of the cooling medium, a flowmeter for measuring a flow rate of the cooling medium passing through the valve, and a controller including a processor and a storage device, the storage device storing a table or a function, such that the cooling capacity of the cooling medium is configured to be derived, using the table or the function, from values of the temperature and the flow rate, wherein the processor determines cooling capacity of the cooling medium by comparing measurement results of the thermometer and the flowmeter to the table or the function stored by the storage device, and adjusts the valve so that the cooling capacity of the cooling medium approaches to a target value when the determined cooling capacity is different from the target value; and
a cooled portion to be cooled with the cooling medium that is adjusted in the flow rate by the cooling system.
6. The substrate processing system according to claim 5 , wherein the cooled portion is a susceptor.
7. The substrate processing system according to claim 6 , further comprising a heater provided in the susceptor.
8. The substrate processing system according to claim 7 , wherein the heater has a first heater and a second heater, and the cooling medium flows between the first heater and the second heater in plan view.
9. The substrate processing system according to claim 8 , wherein the susceptor has a groove between the first heater and the second heater, and the cooling medium cools a lower portion of the groove.
10. The substrate processing system according to claim 5 , further comprising:
a reactor chamber for processing a substrate;
a wafer handling chamber connected to the reactor chamber;
a load lock device connected to the wafer handling chamber; and
an EFEM (Equipment Front End Module) connected to the load lock device, wherein the cooled portion is the load lock device.
11. The substrate processing system according to claim 5 , further comprising:
an EFEM (Equipment Front End Module); and
a cooling stage provided in the EFEM, wherein the cooled portion is the cooling stage.