Hybrid-on-chip and package antenna
Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.
1. A method for fabricating an antenna device comprising: forming at least one antenna in an antenna layer structure onto a transparent support structure; mounting an antenna chip layer on a side opposite the transparent support structure on a transparent wafer; and releasing the transparent support structure from the antenna chip layer onto a carrier layer including at least one integrated ground plane.
2. The method of claim 1 , wherein the mounting comprises attaching the antenna chip layer to the transparent support structure with a polymer adhesive that is sensitive to light at a given wavelength (λ polymer ).
3. The method of claim 2 , wherein the releasing comprises illuminating the adhesive with said light.
4. The method of claim 2 , wherein releasing includes irradiating the polymer adhesive through the transparent wafer with laser light to break a bond of the polymer adhesive.
5. The method of claim 1 , wherein the at least one antenna is configured to transmit electromagnetic waves with a microwave or lower wavelength (λ).
6. The method of claim 5 , wherein the mounting comprises mounting the antenna chip layer onto the carrier layer such that the at least one ground plane is disposed at a distance (d) of between
1
20
λ
<
d
≤
1
4
λ
from the at least one antenna to implement a reflection of at least a portion of electromagnetic waves by the at least one ground plane.
7. The method of claim 1 , wherein the antenna layer structure includes a semiconductor chip.
8. The method of claim 1 , wherein the carrier layer includes a printed circuit board.
9. The method of claim 1 , wherein the antenna chip layer and the wafer attached to the antenna chip layer form a first chip, wherein the carrier layer includes a second chip, wherein the mounting further comprises mounting the first chip and second chip on a circuit board such that the circuit board and the first chip are electrically connected through the second chip.
10. The method of claim 9 , wherein the first chip is electrically connected through the second chip with a through silicon via (TSV).
11. The method of claim 9 , wherein the first chip is electrically connected through the second chip with a through glass via (TGV).
12. The method of claim 1 , wherein the transparent wafer includes glass.