Field-effect transistor with protection diodes
A field-effect transistor with protection diodes includes: a field-effect transistor; and a two-terminal electrostatic protection circuit connected between a gate and a source of the field-effect transistor, wherein the two-terminal electrostatic protection circuit comprises: a first diode that is positioned on a reverse-biased side when a voltage lower than a potential of the source is applied to the gate and has a reverse withstand voltage lower than a reverse withstand voltage between the gate and the source of the field-effect transistor; a second diode that is positioned on a forward-biased side when a voltage lower than a potential of the source is applied to the gate and is connected in anti-series to the first diode; and a resistor that is connected in series to a diode pair comprising the first diode and the second diode and formed using a same channel layer as that of the field-effect transistor.
1. A field-effect transistor with protection diodes, comprising:
a field-effect transistor; and
a two-terminal electrostatic protection circuit connected between a gate and a source of the field-effect transistor,
wherein the two-terminal electrostatic protection circuit comprises:
a first diode that is positioned on a reverse-biased side when a voltage lower than a potential of the source is applied to the gate and has a reverse withstand voltage lower than a reverse withstand voltage between the gate and the source of the field-effect transistor;
a second diode that is positioned on a forward-biased side when a voltage lower than a potential of the source is applied to the gate and is connected in anti-series to the first diode; and
a resistor that is connected in series to a diode pair comprising the first diode and the second diode, wherein the resistor is formed using a same channel layer as that of the field-effect transistor, the same channel layer in which the field-effect transistor and the resistor are formed comprising plural layers of different materials.
2. The field-effect transistor with protection diodes according to claim 1 , wherein the first diode is connected in plurality in series with a same polarity in a direction in which a current flows.
3. The field-effect transistor with protection diodes according to claim 1 , wherein a Schottky junction area of the second diode is within a range of ½ to ¼ of a Schottky junction area of the first diode.
4. The field-effect transistor with protection diodes according to claim 1 , wherein in a layout of an anode electrode of the first diode, both an area of an overlapping portion between the anode electrode and a lead wire of the anode electrode and an area of a contact hole that connects the anode electrode to the lead wire occupy ⅔ or more of an area of the anode electrode.
5. The field-effect transistor with protection diodes according to claim 1 , wherein the diode pair, the resistor and the field-effect transistor are manufactured on an identical III-V group semiconductor substrate.
6. The field-effect transistor with protection diodes according to claim 1 , wherein the diode pair and the resistor are manufactured on a semiconductor substrate different from a semiconductor substrate on which the field-effect transistor is manufactured.
7. The field-effect transistor with protection diodes according to claim 1 , wherein the field-effect transistor is a GaN field-effect transistor, and the diode pair and the resistor are manufactured on a GaAs or InP or Si or glass or sapphire substrate.
8. The field-effect transistor with protection diodes according to claim 1 , wherein
the resistor is a channel resistor, and has a current saturation characteristic wherein current saturation caused by the current saturation characteristic is performed after reverse breakdown of the first or second diodes starts.
9. The field-effect transistor with protection diodes according to claim 1 , wherein the plural layers comprise an AlGaN layer and a GaN layer.
10. A field-effect transistor with protection diodes, comprising:
a first field-effect transistor; and
a two-terminal electrostatic protection circuit connected between a first gate and a first source of the first field-effect transistor,
wherein the two-terminal electrostatic protection circuit comprises:
a first diode that is positioned on a reverse-biased side when a voltage lower than a potential of the first source is applied to the first gate and has a reverse withstand voltage lower than a reverse withstand voltage between the first gate and the first source of the first field-effect transistor;
a second diode that is positioned on a forward-biased side when a voltage lower than a potential of the first source is applied to the first gate and is connected in anti-series to the first diode;
a second field-effect transistor that is connected in series to a diode pair comprising the first diode and the second diode and has a second gate and a second source which are connected to each other; and
a resistor formed using a same channel layer as that of the first field-effect transistor and connected in series to the two-terminal electrostatic protection circuit, the same channel layer in which the first field-effect transistor and the resistor are formed comprising plural layers of different materials.
11. The field-effect transistor with protection diodes according to claim 10 , wherein a Schottky junction area of the second diode is within a range of ½ to ¼ of a Schottky junction area of the first diode.
12. The field-effect transistor with protection diodes according to claim 10 , wherein in a layout of an anode electrode of the first diode, both an area of an overlapping portion between the anode electrode and a lead wire of the anode electrode and an area of a contact hole that connects the anode electrode to the lead wire occupy ⅔ or more of an area of the anode electrode.
13. The field-effect transistor with protection diodes according to claim 10 , wherein the diode pair, and the first field-effect transistor, and the second field-effect transistor are manufactured on an identical III-V group semiconductor substrate.
14. The field-effect transistor with protection diodes according to claim 10 , wherein the diode pair and the second field-effect transistor are manufactured on a semiconductor substrate different from a semiconductor substrate on which the first field-effect transistor is manufactured.
15. The field-effect transistor with protection diodes according to claim 10 , wherein the first field-effect transistor is a GaN field-effect transistor, and the diode pair and the second field-effect transistor are manufactured on a GaAs or InP or Si or glass or sapphire substrate.
16. The field-effect transistor with protection diodes according to claim 10 , wherein
the second field-effect transistor has a current saturation characteristic wherein current saturation caused by the current saturation characteristic is performed after reverse breakdown of the first or second diodes starts.
17. The field-effect transistor with protection diodes according to claim 10 , wherein plural layers comprise an AlGaN layer and a GaN layer.