Laser welded glass packages
A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ tensile stress location )/(σ interface laser weld ))<<1 or <1 and σ interface laser weld >10 MPa or >1 MPa where σ tensile stress location is the stress present in the first substrate and σ interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.
1. An apparatus comprising:
a first substrate having a first surface;
an inorganic film formed over the first surface of the first substrate;
a second substrate adjacent the first substrate, wherein the inorganic film is between the first substrate and the second substrate; and
a weld formed by the inorganic film at an interface between the first substrate and the adjacent second substrate bonding the first substrate and the second substrate,
wherein the weld is characterized by
(
σ
tensile
stress
location
σ
interface
laser
weld
)
<
1
and σ tensile laser weld >1 MPa
wherein σ tensile stress location is the stress present in the first substrate and σ tensile laser weld is the stress present at the interface,
wherein each of the inorganic film, the first substrate and the second substrate are transmissive at approximately 420 nm to approximately 750 nm.
2. An apparatus comprising:
a first substrate having a first surface;
an inorganic film formed over the first surface of the first substrate;
a second substrate adjacent the first substrate, wherein the inorganic film is between the first substrate and the second substrate; and
a weld formed by the inorganic film at an interface between the first substrate and the adjacent second substrate bonding the first substrate and the second substrate,
wherein the weld is characterized by
(
σ
tensile
stress
location
σ
interface
laser
weld
)
⪡
1
and σ interface laser weld >10 MPa
wherein σ tensile stress location is the stress present in the first substrate and σ tensile laser weld is the stress present at the interface,
wherein each of the inorganic film, the first substrate and the second substrate are transmissive at approximately 420 nm to approximately 750 nm.
3. The apparatus of claim 2 or 1 further comprising:
a device protected between the first substrate and the second substrate wherein the inorganic film is in contact with the second substrate.
4. The apparatus of claim 3 , wherein absorption by the inorganic film is more than 10% at a predetermined laser wavelength.
5. The apparatus of claim 3 , wherein the composition of the inorganic film is selected from the group consisting of SnO 2 , ZnO, TiO 2 , ITO, Zn, Ti, Ce, Pb, Fe, Va, Cr, Mn, Mg, Ge, SnF 2 , ZnF 2 and combinations thereof.
6. The apparatus of claim 3 , wherein the composition of the inorganic film is selected to lower the activation energy for inducing creep flow of the first substrate, the second substrate, or both the first and second substrates.
7. The apparatus of claim 3 , wherein the composition of the inorganic film is laser absorbing low liquidus temperature material with a liquidus temperature less than or equal to about 1000° C.
8. The apparatus of claim 3 , wherein the composition of the inorganic film comprises:
20-100 mol % SnO;
0-50 mol % SnF 2 ; and
0-30 mol % P 2 O 5 or B 2 O 3 .
9. The apparatus of claim 3 , wherein the inorganic film and the first and second substrates have a combined internal transmission of more than 80% at approximately 420 nm to approximately 750 nm.