Methods for laser bonding optical elements to substrates and optical assemblies fabricated by the same
View Patent ↗Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.
1. A method of bonding an optical element to a substrate, the method comprising:
electrostatically affixing at least one optical element to a surface of the substrate; and
directing a laser beam into the at least one optical element, wherein:
a material of the at least one optical element has an optical element change temperature, which is a melting point of the material of the optical element when it is fabricated from a crystalline material and a softening point of the material of the optical element when it is fabricated from an amorphous material;
a material of the substrate has a substrate change temperature, which is a melting point of the substrate material when it is fabricated from a crystalline material and a softening point of the substrate material when it is fabricated from an amorphous material;
the laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area, and
the laser beam has a fluence that does not modify the substrate at regions of the substrate that are outside of a contact area of the substrate, the contact area of the substrate being in direct contact with the at least one optical element, wherein the laser beam is an astigmatically shaped laser beam.
2. The method of claim 1 , wherein electrostatically affixing at least one optical element to the surface of the substrate comprises subjecting at least one optical element and the substrate to a plasma treatment.
3. The method of claim 1 , further comprising applying a cover substrate over at least one optical element and the surface of the substrate.
4. The method of claim 3 , wherein electrostatically affixing at least one optical element to the surface of the substrate comprises applying a voltage between the cover substrate and the substrate.
5. The method of claim 4 , wherein the voltage is greater than or equal to 700 volts.
6. The method of claim 3 , wherein the cover substrate comprises at least one groove, and the at least one optical element is positioned within the at least one groove.
7. The method of claim 3 , wherein the cover substrate comprises a window, and the laser beam passes through the window.
8. The method of claim 1 , further comprising translating the laser beam in a direction parallel to at least one optical element to form a plurality of bond areas along a length of at least one optical element.
9. The method of claim 1 , wherein at least one optical element is a curved optical element.
10. The method of claim 1 , wherein:
the at least one optical element comprises a plurality of optical elements; and
the laser beam is the astigmatically shaped laser beam having a line focus that passes through each optical element of the plurality of optical elements.
11. The method of claim 1 , wherein the at least one optical element is an optical fiber.
12. The method of claim 1 , wherein the substrate comprises silicon.
13. The method of claim 1 , wherein the substrate comprises glass having a surface and an electrically conductive film that is absorbing at a wavelength of the laser beam and is disposed on the surface.
14. The method of claim 1 , wherein:
the laser beam produces a modified area on the substrate; and
the bond area extends beyond the modified area.
15. A method of bonding an optical fiber to a substrate, the method comprising:
disposing at least one optical fiber onto a surface of the substrate;
applying a cover substrate comprising at least one groove to the substrate such that the at least one optical fiber is disposed within the at least one groove;
electrostatically affixing the at least one optical fiber to the surface of the substrate by applying a voltage between the cover substrate and the substrate; and
directing an astigmatically shaped laser beam into the optical element, wherein:
the laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of an optical element change temperature, which is a melting point of the material of the optical element when it is fabricated from a crystalline material and a softening point of the material of the optical element when it is fabricated from an amorphous material, and a substrate change temperature, which is a melting point of the substrate material when it is fabricated from a crystalline material and a softening point of the substrate material when it is fabricated from an amorphous material, thereby forming a bond between at least one optical element and the substrate at a bond area, and
the laser beam has a fluence that does not modify the substrate at regions of the substrate that are outside of a contact area of the substrate, the contact area of the substrate being in direct contact with the at least one optical element.
16. The method of claim 15 , wherein the voltage is greater than or equal to 700 volts.
17. The method of claim 15 , wherein the cover substrate comprises a window, and the laser beam passes through the window.
18. The method of claim 15 , wherein:
the at least one optical fiber comprises a plurality of optical fibers; and
the laser beam has a line focus that passes through each optical fiber of the plurality of optical fibers.
19. The method of claim 15 , wherein the substrate comprises silicon.
20. The method of claim 15 , wherein the substrate comprises glass having a surface and an electrically conductive film that is absorbing at a wavelength of the laser beam and is disposed on the surface.
21. The method of claim 15 , wherein:
the laser beam produces a modified area on the substrate; and
the bond area extends beyond the modified area.