Method for the bonding and debonding of substrates
A method for bonding a product substrate to a carrier substrate via a connection layer, wherein a soluble layer is applied between the connection layer and the product substrate, and wherein a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are at least predominantly transparent to the electromagnetic radiation. A method for debonding a product substrate from a carrier substrate bonded to the product substrate via a connection layer, wherein a soluble layer is applied between the connection layer and the product substrate, and wherein a) the soluble layer is dissolved through an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are at least predominantly transparent to the electromagnetic radiation. A corresponding product-substrate-to-carrier-substrate bond is also disclosed.
1. A method for debonding a product substrate from a carrier substrate, said method comprising:
providing a carrier substrate bonded to a product substrate via a connection layer, wherein a soluble layer is applied between the connection layer and the product substrate;
dissolving the soluble layer through an interaction with an electromagnetic radiation of a radiation source, the soluble layer applied to the full and continuous surface of the product substrate, wherein
(a) the connection layer and the carrier substrate are at least predominantly transparent to the electromagnetic radiation, and
(b) a material of the soluble layer and the electromagnetic radiation are chosen such that an increase of temperature of the soluble layer caused by the interaction with the electromagnetic radiation is less than 50° C.
2. The method according to claim 1 , wherein an absorption of photons of the electromagnetic radiation in the connection layer is less than 50%.
3. The method according to claim 1 , wherein an absorption of photons of the electromagnetic radiation in the soluble layer is more than 50%.
4. The method according to claim 1 , wherein a temperature of the connection layer increases by less than 50° C. during debonding of the product substrate from the carrier substrate.
5. The method according to claim 1 , wherein the soluble layer is sublimated by the electromagnetic radiation.
6. The method according to claim 1 , wherein the soluble layer is applied between the connection layer and the product substrate with a layer thickness less than 10 μm.