Circuit substrate with embedded heat sink
An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
1. An apparatus, comprising:
a main substrate, configured for mounting a component in a mounting location thereon and having a first cavity located below the mounting location;
a secondary substrate that is coupled to the main substrate and has a second cavity therein at the mounting location;
a device, mounted in the second cavity; and
a heat spreader comprising a ceramic compound, which is fitted into the first cavity and attached to the secondary substrate, and which is coupled to the device and to a heat sink, wherein the heat spreader is configured to protrude from the first cavity, beyond a surface of the main substrate that faces the heat sink.
2. The apparatus according to claim 1 , wherein the main substrate is configured to provide electrical interconnections to the device.
3. The apparatus according to claim 1 , wherein the device is configured to emit light.
4. The apparatus according to claim 1 , wherein the main substrate comprises a printed circuit board (PCB).
5. The apparatus according to claim 1 , wherein the ceramic compound comprises aluminum nitride (AlN).
6. The apparatus according to claim 1 , wherein the secondary substrate is configured for mounting a peripheral device.
7. The apparatus according to claim 6 , wherein the secondary substrate is configured to provide electrical interconnection between the peripheral device and the main substrate.
8. The apparatus according to claim 6 , wherein the secondary substrate is configured to provide electrical interconnection between the device and the main substrate.
9. A method for production, comprising:
producing a main substrate having a mounting location for mounting a component thereon and having a first cavity located below the mounting location;
coupling a secondary substrate to the main substrate, wherein the secondary substrate has a second cavity therein at the mounting location;
mounting a device in the second cavity; and
fitting a heat spreader comprising a ceramic compound into the first cavity, attaching the secondary substrate to the heat spreader, and coupling the heat spreader to the device and to a heat sink, wherein the heat spreader conducts heat from the device to the heat sink and protrudes from the first cavity, beyond a surface of the main substrate that faces the heat sink.
10. The method according to claim 9 , wherein producing the main substrate comprises providing on the main substrate electrical interconnections to the device.
11. The method according to claim 9 , wherein mounting the device comprises mounting a light emitter.
12. The method according to claim 9 , wherein producing the main substrate comprises producing a printed circuit board (PCB).
13. The method according to claim 9 , wherein the ceramic compound comprises aluminum nitride (AlN).
14. The method according to claim 9 , and comprising mounting a peripheral device on the secondary substrate.
15. The method according to claim 14 , wherein coupling the secondary substrate comprises providing on the secondary substrate electrical interconnection between the peripheral device and the main substrate.
16. The method according to claim 14 , wherein coupling the secondary substrate comprises providing on the secondary substrate electrical interconnection between the device and the main substrate.