Reducing thickness of module in solid state imaging device
A semiconductor package includes: a sheet-like thin plate on which a semiconductor chip is secured; and a substrate including a wiring layer, disposed on the thin plate to extend over a part of a region surrounding the region where the semiconductor chip is secured or over the entire surrounding region, wherein the semiconductor chip and the substrate are electrically connected.
1. A camera module, comprising:
a metal plate;
an image sensor on the metal plate;
a wiring substrate on the metal plate, wherein
the wiring substrate includes a plurality of wiring layers,
the wiring substrate comprises one of a ceramic material or organic material,
the metal plate comprises copper,
the metal plate has no wiring layer of the plurality of wiring layers,
the wiring substrate is in contact with the metal plate,
the wiring substrate extends entirely over a first region of the metal plate that surrounds a second region of the metal plate,
the image sensor is on the second region,
the image sensor is electrically connected to the wiring substrate,
the wiring substrate includes a first edge and a second edge, and
the wiring substrate is on the metal plate such that a width between the first edge and the second edge of the wiring substrate is equal to a width of the metal plate in a sectional view; and
a lens unit on the wiring substrate.
2. The camera module according to claim 1 , wherein the lens unit is above the metal plate such that a width of the lens unit is equal to the width between the first edge and the second edge of the wiring substrate.
3. The camera module according to claim 1 , wherein a wiring layer of the plurality of wiring layers includes a plurality of wiring patterns.
4. The camera module according to claim 1 , wherein the plurality of wiring layers is a multi-layer structure.
5. The camera module according to claim 1 , wherein the image sensor comprises a plurality of pixels.
6. The camera module according to claim 1 , wherein
the image sensor is bonded to a surface of the metal plate by a bonding material, and
the bonding material is an insulating material.
7. The camera module according to claim 1 , wherein
the image sensor is bonded to a surface of the metal plate by a bonding material, and
the bonding material is a conductive material.
8. The camera module according to claim 1 , wherein the metal plate has a thickness of 0.1 mm.
9. The camera module according to claim 1 , wherein the image sensor is connected to the metal plate.
10. An electronic apparatus, comprising:
a camera module that comprises:
a metal plate;
an image sensor on the metal plate;
a wiring substrate on the metal plate, wherein
the wiring substrate includes a plurality of wiring layers,
the wiring substrate comprises one of a ceramic material or organic material,
the metal plate comprises copper,
the metal plate has no wiring layer of the plurality of wiring layers,
the wiring substrate is in contact with the metal plate,
the wiring substrate extends entirely over a first region of the metal plate that surrounds a second region of the metal plate,
the image sensor is on the second region,
the image sensor is electrically connected to the wiring substrate,
the wiring substrate includes a first edge and a second edge, and
the wiring substrate is on the metal plate such that a width between the first edge and the second edge of the wiring substrate is equal to a width of the metal plate in a sectional view; and
a lens unit on the wiring substrate.
11. The electronic apparatus according to claim 10 , wherein the lens unit is above the metal plate such that a width of the lens unit is equal to the width between the first edge and the second edge of the wiring substrate.
12. The electronic apparatus according to claim 10 , wherein a wiring layer of the plurality of wiring layers includes a plurality of wiring patterns.
13. The electronic apparatus according to claim 10 , wherein the plurality of wiring layers is a multi-layer structure.
14. The electronic apparatus according to claim 10 , wherein the image sensor comprises a plurality of pixels.
15. The electronic apparatus according to claim 10 , wherein
the image sensor is bonded to a surface of the metal plate by a bonding material, and
the bonding material is an insulating material.
16. The electronic apparatus according to claim 10 , wherein
the image sensor is bonded to a surface of the metal plate by a bonding material, and
the bonding material is a conductive material.
17. The electronic apparatus according to claim 10 , wherein the metal plate has a thickness of about 0.1 mm.
18. The electronic apparatus according to claim 10 , wherein the image sensor is connected to the metal plate.