IP Library Granted Patent US 10,494,713
Granted Patent B2
US 10,494,713 · App. 15/093,160 · Granted Dec 3, 2019

Method of forming an optically-finished thin diamond film, diamond substrate, or diamond window of high aspect ratio

Inventors: Wen-Qing Xu (Medfield, MA); Thomas E. Anderson (Convent Station, NJ); Giovanni Barbarossa (Saratoga, CA); Elgin E. Eissler (Renfrew, PA); Chao Liu (Butler, PA); Charles D. Tanner (Saxonburg, PA)
Assignee: II-VI Incorporated
C23C16/274C23C16/01C23C16/511C23C16/56
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Quick Facts
Patent No.
US 10,494,713
App. No.
15/093,160
Granted
Dec 3, 2019
Kind
B2
Abstract

In a method of forming a diamond film, diamond substrate, or diamond window, a silicon substrate is provided and the diamond film, diamond substrate, or diamond window is CVD grown on a surface of the silicon substrate. The grown diamond film, diamond substrate, or diamond window has an aspect ratio ≥100, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, diamond substrate, or diamond window divided by a thickness of the diamond film, diamond substrate, or diamond window. The silicon substrate has a thickness greater than or equal to 2 mm. The silicon substrate can optionally be removed or separated from the grown diamond film, diamond substrate, or diamond window.

Claims (41)

1. A method of forming a planar, free-standing diamond film, diamond substrate, or diamond window comprising:

(a) CVD growing on a surface of a silicon substrate a diamond film, diamond substrate, or diamond window having an aspect ratio ≥100 and a thickness between 150-999 microns, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, diamond substrate, or diamond window divided by a thickness of the diamond film, diamond substrate, or diamond window; and

(b) chemically or mechanically removing the silicon substrate from the grown diamond film, diamond substrate, or diamond window.

2. The method of claim 1 , wherein the silicon substrate has a thickness ≥2 mm.

3. The method of claim 1 , further including, prior to step (a), polishing the surface of the silicon substrate to an optical finish having a surface roughness (Ra)≤20 nm.

4. The method of claim 3 , wherein:

a nucleation side of the as-grown diamond film, diamond substrate, or diamond window has an Ra greater than the Ra of the polished surface of the silicon substrate; and

for an Ra of the polished the surface of the silicon substrate ≤20 nm, the Ra of the nucleation side of the as-grown diamond film, diamond substrate, or diamond window is ≤50 nm.

5. The method of claim 3 , wherein:

a nucleation side of the as-grown diamond film, diamond substrate, or diamond window has an Ra greater than the Ra of the polished surface of the silicon substrate; and

for an Ra of the polished the surface of the silicon substrate ≤15 nm, the Ra of the nucleation side of the as-grown diamond film, diamond substrate, or diamond window is ≤30 nm.

6. The method of claim 3 , wherein:

a nucleation side of the as-grown diamond film, diamond substrate, or diamond window has an Ra greater than the Ra of the polished surface of the silicon substrate; and

for an Ra of the polished the surface of the silicon substrate ≤2 nm, the Ra of the nucleation side of the as-grown diamond film, diamond substrate, or diamond window is ≤10 nm.

7. The method of claim 1 , wherein the surface of the silicon substrate and a nucleation side of the as-grown diamond film, diamond substrate, or diamond window each have a surface roughness (Ra)≥750 nm.

8. The method of claim 1 , further including, while the diamond film, diamond substrate, or diamond window is still on the silicon substrate, polishing a growth surface of the diamond film, diamond substrate, or diamond window to a surface roughness (Ra)≤50 nm.

9. The method of claim 1 , wherein:

a shape of the nucleation side of the as-grown diamond film, diamond substrate, or diamond window is a conformal negative of the shape of the surface of the silicon substrate.

10. The method of claim 1 , wherein a growth side of the as-grown diamond film, diamond substrate, or diamond window has a greater thermal conductivity than the nucleation side of the as-grown diamond film, diamond substrate, or diamond window.

11. The method of claim 1 , further including at least one of the following:

applying a light management coating to a growth surface of the grown diamond film, diamond substrate, or diamond window; and

after removing the silicon substrate from the grown diamond film, diamond substrate, or diamond window, applying the light management coating to a nucleation side of the grown diamond film, diamond substrate, or diamond window.

12. The method of claim 1 , further including cutting the silicon substrate having the diamond film, diamond substrate, or diamond window grown thereon into one or more pieces.

13. The method of claim 1 , wherein step (a) includes CVD growing the diamond film, diamond substrate, or diamond window in an atmosphere that includes at least one of the following: oxygen, carbon monoxide, carbon dioxide, nitrogen, and boron.

14. The method of claim 1 , wherein, prior to step (a), the surface of the silicon substrate is seeded with diamond particles.

15. The method of claim 14 , wherein the silicon substrate is seeded with diamond particles via at least one of the following processes: (1) ultrasonic treatment of the silicon substrate in a ultrasonic bath comprised of a submicron or micron-sized diamond powder in a liquid suspension solution; and (2) ultrasonic treatment of the silicon substrate in a ultrasonic bath comprised of nano-crystal diamond powder having an average particle size <100 nm in a liquid suspension solution.

16. The method of claim 15 , wherein the liquid suspension solution comprises one or more of the following: water, alcohol, hydrocarbon, and organic solvent.

17. The method of claim 14 , wherein the silicon substrate is seeded with diamond particles via a least one of the following processes: (1) ultrasonic treatment of the silicon substrate in a bath of aqueous diamond slurries or organic diamond slurries, or (2) rubbing the silicon substrate with diamond powders.

18. The method of claim 1 , wherein the largest dimension of the silicon substrate is ≥30 mm.

19. The method of claim 18 , wherein the largest dimension of the silicon substrate is a diameter of the silicon substrate.

20. The method of claim 1 , wherein the silicon substrate has a thickness ≥8 mm.

21. The method of claim 1 , further including, prior to step (a), polishing the surface of the silicon substrate to an optical finish having a surface roughness (Ra)≤2 nm.

22. The method of claim 1 , further including, while the diamond film, diamond substrate, or diamond window is still on the silicon substrate, polishing a growth surface of the diamond film, diamond substrate, or diamond window to a surface roughness (Ra)≤10 nm.

23. The method of claim 1 , wherein the largest dimension of the silicon substrate is ≥50.8 mm.

24. The method of claim 1 , wherein the largest dimension of the silicon substrate is ≥127 mm.

25. A method of forming a planar, free-standing diamond film, diamond substrate, or diamond window comprising:

(a) CVD growing on a surface of a silicon substrate polished to an optical finish having a surface roughness (Ra)≤20 nm a diamond film, diamond substrate, or diamond window having an aspect ratio ≥100 and a thickness between 150-999 microns, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, diamond substrate, or diamond window divided by a thickness of the diamond film, diamond substrate, or diamond window; and

(b) chemically or mechanically removing the silicon substrate from the grown diamond film, diamond substrate, or diamond window.

26. A method of forming a planar, free-standing diamond film, diamond substrate, or diamond window comprising:

(a) CVD growing on a surface of a silicon substrate a diamond film, diamond substrate, or diamond window having an aspect ratio ≥100 and a thickness between 150-999 microns, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, diamond substrate, or diamond window divided by a thickness of the diamond film, diamond substrate, or diamond window, wherein the surface is seeded with diamond particles via ultrasonic treatment of the silicon substrate in a ultrasonic bath comprised of (1) submicron or micron-sized diamond powder in a liquid suspension solution; or (2) nano-crystal diamond powder having an average particle size <100 nm in a liquid suspension solution; and

(b) chemically or mechanically removing the silicon substrate from the grown diamond film, diamond substrate, or diamond window.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2019
From: II-VI INCORPORATED
To: II-VI DELAWARE, INC.
Reel/Frame 051210/0411 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2016
From: XU, WEN-QING; ANDERSON, THOMAS E.; BARBAROSSA, GIOVANNI; EISSLER, ELGIN E.; LIU, CHAO; TANNER, CHARLES D.
To: II-VI INCORPORATED
Reel/Frame 038600/0754 →
Continuity (2)
Provisional Application 62148339 · Apr 16, 2015
Related Publication 20160333472A1 · Nov 17, 2016
Cited By (2)
US 12,209,306 US 12,650,564