Dual-sided module with land-grid array (LGA) footprint
A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The packaging substrate may include a first component mounted on the first side of the packaging substrate and a first overmold structure implemented on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component. The packaging substrate may further include a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement redundant ground pins and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.
1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side;
a first component mounted on the first side of the packaging substrate;
a first overmold structure implemented on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component;
a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins;
a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement redundant ground pins; and
a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.
2. The radio-frequency module of claim 1 wherein the first side includes one or more shielding features.
3. The radio-frequency module of claim 2 wherein the one or more shielding features include one or more grounding features.
4. The radio-frequency module of claim 1 wherein the second side includes one or more shielding features.
5. The radio-frequency module of claim 4 wherein the one or more shielding features include one or more grounding features.
6. The radio-frequency module of claim 1 wherein the set of through-mold connections implemented on the second side of the packaging substrate defines one or more regions on the second side for implementing one or more components.
7. The radio-frequency module of claim 1 wherein the set of through-mold connections includes a set of pillars configured to allow the packaged radio-frequency device to be mounted on a circuit board.
8. The radio-frequency module of claim 1 wherein the set of through-mold connections includes a set of pillars configured to allow the radio-frequency module to be mounted on a circuit board.
9. The radio-frequency module of claim 8 wherein the set of through-mold connections is configured to allow the packaged radio-frequency device to be mounted on a circuit board using a land grid array configuration.
10. The radio-frequency module of claim 1 wherein the packaging substrate includes a laminate substrate.
11. The radio-frequency module of claim 1 wherein the packaging substrate includes a ceramic substrate.
12. The radio-frequency module of claim 11 wherein the ceramic substrate includes a low-temperature co-fired ceramic substrate.
13. The radio-frequency module of claim 1 wherein the second component includes a semiconductor die.
14. A wireless device comprising:
a circuit board configured to receive a plurality of packaged modules; and
a radio-frequency module mounted on the circuit board, the radio-frequency module including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side, the packaging substrate including a first component mounted on the first side of the packaging substrate, a first overmold structure implemented on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component, a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement redundant ground pins, and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.
15. The wireless device of claim 14 wherein the packaging substrate includes a laminate substrate.
16. The wireless device of claim 14 wherein the packaging substrate includes a ceramic substrate.