Methods related to dual-sided module with land-grid array (LGA) footprint
In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.
1. A method for manufacturing one or more packaged radio-frequency devices, the method comprising:
providing a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side;
mounting a first component on the first side of the packaging substrate;
implementing a first overmold structure on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component;
mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located;
implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and
implementing a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.
2. The method of claim 1 further comprising removing a portion of the second overmold structure.
3. The method of claim 2 wherein the removing the portion of the second overmold structure includes exposing the set of through-mold connections.
4. The method of claim 1 further comprising determining a set of through-mold connections not to implement on the second side of the packaging substrate.
5. The method of claim 4 further comprising determining the set of through-mold connections not to implement based in part on the mounting of the second component.
6. The method of claim 1 wherein the first side includes one or more shielding features.
7. The method of claim 6 wherein the one or more shielding features include one or more grounding features.
8. The method of claim 1 wherein the second side includes one or more shielding features.
9. The method of claim 8 wherein the one or more shielding features include one or more grounding features.
10. The method of claim 1 wherein the set of through-mold connections implemented on the second side of the packaging substrate defines one or more regions on the second side for implementing one or more components.
11. The method of claim 1 wherein the set of through-mold connections includes a set of pillars or a ball grid array configured to allow a packaged radio-frequency device to be mounted on a circuit board.
12. The method of claim 11 wherein the set of through-mold connections is configured to allow the packaged radio-frequency device to be mounted on the circuit board using a land grid array configuration.
13. The method of claim 1 wherein the packaging substrate includes a laminate substrate.
14. The method of claim 1 wherein the packaging substrate includes a ceramic substrate.
15. The method of claim 14 wherein the ceramic substrate includes a low-temperature co-fired ceramic substrate.
16. The method of claim 1 wherein the second component includes a semiconductor die.
17. A method of implementing a wireless device, the method comprising:
providing a circuit board configured to receive a plurality of packaged modules; and
providing a radio-frequency module mounted on the circuit board, the radio-frequency module including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side, the packaging substrate including a first component mounted on the first side of the packaging substrate, a first overmold structure implemented on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component, a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement one or more redundant ground pins, a redundant ground pad, or a redundant portion of a ground pad, and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.
18. The method of claim 17 wherein the first side includes one or more shielding features.
19. The method of claim 18 wherein the second side includes one or more shielding features.
20. The method of claim 19 wherein the one or more shielding features of the first side and the one or more shielding features of the second side include one or more grounding features.