Thin film inductor and manufacturing method thereof
A thin film inductor includes a body including a coil part disposed therein, wherein the coil part includes a patterned insulating film disposed on a substrate and a coil pattern formed between the patterned insulating films, the coil pattern having a lower height than the insulating film, such that the coil pattern may be formed in a structure with a high aspect ratio while having a uniform thickness, thereby increasing a cross-sectional area of the coil part and improving direct current resistance (Rdc) characteristics.
1. A thin film inductor comprising:
a body including a coil part disposed therein,
wherein the coil part includes:
a patterned insulating film disposed on a substrate; and
a coil pattern disposed between portions of the patterned insulating film, the coil pattern including a first plating layer disposed on the substrate and a second plating layer disposed on the first plating layer,
wherein the body further includes a cover insulating layer enclosing the coil part, the cover insulating layer comprising a polymer insulating material,
wherein the coil pattern has a lower height, in a thickness direction, than the patterned insulating film, and
wherein the first plating layer directly contacts a side surface of the patterned insulating film.
2. The thin film inductor of claim 1 , further comprising a conductive via disposed in the substrate, the conductive via having upper and lower surfaces that are respectively exposed from upper and lower surfaces of the substrate.
3. The thin film inductor of claim 1 , wherein the cover insulating layer and the patterned insulating film are composed of different materials from each other.
4. The thin film inductor of claim 1 , wherein the body is composed of a magnetic material,
the magnetic material being filled in a space between portions of the patterned insulating film and above the coil pattern.
5. The thin film inductor of claim 1 , wherein the patterned insulating film has a thickness of 200 μm or more.
6. The thin film inductor of claim 1 , wherein the coil pattern has a thickness of 200 μm or more.
7. The thin film inductor of claim 1 , wherein the coil pattern has an aspect ratio of 3.0 or more.