3D vertical FET with top and bottom gate contacts
A method for forming a semiconductor device includes forming bottom side metallization structures having at least one connection to a bottom side of a vertical transistor disposed on a substrate, the bottom side metallization structures including a power rail and a ground rail. After forming the bottom side metallization structures, the substrate is removed and the vertical transistor is flipped. Top side metallization structures are formed. The top side metallization structures having at least one connection to the vertical transistor on a top side of the vertical transistor.
1. A method for forming a semiconductor device, comprising:
forming bottom side metallization structures having at least one connection to a bottom side of a vertical transistor disposed on a substrate, the bottom side metallization structures including a power rail and a ground rail;
after forming the bottom side metallization structures, removing the substrate and flipping the vertical transistor; and
after flipping the vertical transistor, forming top side metallization structures, the top side metallization structures having at least one connection to the vertical transistor on the top side.
2. The method as recited in claim 1 , further comprising forming a gate structure disposed about a channel region of the vertical transistor.
3. The method as recited in claim 2 , wherein the gate structure is contacted on the top side and the bottom side by gate contacts.
4. The method as recited in claim 1 , further comprising forming gate contacts to the gate structure on the top side and the bottom side.
5. The method as recited in claim 4 , wherein the gate contacts are formed on opposite sides of a same gate structure on the top side and the bottom side.
6. The method as recited in claim 1 , wherein the vertical transistor is contacted on the top side and the bottom side.
7. The method as recited in claim 1 , wherein the top side includes front end of the line (FEOL) structures and the bottom side includes back end of the line (BEOL) structures.
8. The method as recited in claim 1 , wherein the top side metallization structures have at least one connection to the vertical transistor on the top side.
9. The method as recited in claim 1 , wherein the vertical transistor is a part of a logic device and the logic device connects to the bottom side and the top side metallization structures.
10. The method as recited in claim 9 , wherein the logic device includes a logic device from a five track cell library.
11. A method for forming a semiconductor device, comprising:
forming bottom side metallization structures having at least one connection to the vertical transistor on the bottom side;
after forming the bottom side metallization structures, removing the substrate and flipping the vertical transistor; and
after flipping the vertical transistor, forming top side metallization structures.
12. The method as recited in claim 11 , further comprising forming a gate structure disposed about a channel region of the vertical transistor.
13. The method as recited in claim 12 , wherein the gate structure is contacted on the top side and the bottom side by gate contacts.
14. The method as recited in claim 11 , further comprising forming gate contacts to the gate structure on the top side and the bottom side.
15. The method as recited in claim 14 , wherein the gate contacts are formed on opposite sides of a same gate structure on the top side and the bottom side.
16. The method as recited in claim 11 , wherein the vertical transistor is contacted on the top side and the bottom side.
17. The method as recited in claim 11 , wherein the top side includes front end of the line (FEOL) structures and the bottom side includes back end of the line (BEOL) structures.
18. The method as recited in claim 11 , the top side metallization structures have at least one connection to the vertical transistor on the top side.
19. The method as recited in claim 11 , wherein the vertical transistor is a part of a logic device and the logic device connects to the bottom side and the top side metallization structures.
20. The method as recited in claim 19 , wherein the logic device includes a logic device from a five track cell library.