Handler bonding and debonding for semiconductor dies
Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
1. A bonded semiconductor package comprising:
a handler;
at least one packaged semiconductor device bonded to the handler;
a release layer, vulnerable to ablation by laser radiation, provided directly on and in contact with the handler
an adhesive layer in contact with the release layer, wherein the adhesive layer and the release layer are separate layers; and
an insulating layer disposed between the at least one packaged semiconductor device and the release layer.
2. The bonded semiconductor package of claim 1 , wherein the release layer comprises one or more additive materials, wherein the additive materials adjust a frequency of light absorption property of the release layer.
3. The bonded semiconductor package of claim 1 , wherein the handler is transparent.
4. The bonded semiconductor package of claim 1 , wherein the release layer comprises an adhesive.
5. The bonded semiconductor package of claim 1 , wherein the handler is one of:
a handle wafer;
a panel; and
a roll of handler material.
6. The bonded semiconductor package of claim 1 , wherein the insulating layer is a dielectric layer formed on the adhesive layer.
7. The bonded semiconductor package of claim 6 , wherein the dielectric layer contacts the release layer and the at least one packaged semiconductor device.
8. The bonded semiconductor package of claim 1 , wherein the release layer absorbs a frequency of light radiated from a light source.
9. The bonded semiconductor package of claim 1 , wherein the release layer is substantially transparent to visible light.
10. A bonded semiconductor package comprising:
a handler;
at least one singulated semiconductor device bonded to the handler; and
a release layer, vulnerable to ablation by laser radiation, provided directly on and in contact with the handler; and
an insulating layer disposed between the at least one singulated semiconductor device and the release layer, wherein the insulating layer is separate from any adhesive layer within and/or in contact with the release layer.
11. The bonded semiconductor package of claim 10 , wherein the release layer comprises one or more additive materials, wherein the additive materials adjust a frequency of light absorption property of the release layer.
12. The bonded semiconductor package of claim 10 , wherein the handler is transparent.
13. The bonded semiconductor package of claim 10 , wherein the release layer comprises an adhesive.
14. The bonded semiconductor package of claim 10 , further comprising:
an adhesive layer in contact with the release layer, wherein the adhesive layer and the release layer are separate layers.
15. The bonded semiconductor package of claim 10 , wherein the handler is one of:
a handle wafer;
a panel; and
a roll of handler material.
16. The bonded semiconductor package of claim 10 , further comprising:
a dielectric layer formed on the release layer.
17. The bonded semiconductor package of claim 10 , wherein the release layer absorbs a frequency of light radiated from a light source.
18. The bonded semiconductor package of claim 10 , wherein the release layer is substantially transparent to visible light.
19. A bonded semiconductor package comprising:
a handler;
at least one packaged semiconductor device bonded to the handler;
a release layer, vulnerable to ablation by laser radiation, provided directly on and in contact with the handler
an adhesive layer in contact with the release layer, wherein the adhesive layer and the release layer are separate layers; and
an insulating layer in contact with the adhesive layer and the at least one packaged semiconductor device.