IP Library › Granted Patent US 10,579,768
Granted Patent B2
US 10,579,768 · App. 15/502,950 · Granted Mar 3, 2020

Process compatibility improvement by fill factor modulation

Inventors: Vladimir Levinski (Migdal HaEmek, IL); Eitan Hajaj (Ashqelon, IL); Tal Itzkovich (Kfar Uriya, IL); Sharon Aharon (Hanaton, IL); Michael E. Adel (Zichron Ya'akov, IL); Yuri Paskover (Caesarea, IL); Daria Negri (Haifa, IL); Yuval Lubashevsky (Haifa, IL); Amnon Manassen (Haifa, IL); Myungjun Lee (San Jose, CA); Mark D. Smith (San Jose, CA)
Assignee: KLA-Tencor Corporation
G06F17/5081G03F7/705G03F7/70625G03F7/70683H01L21/027
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Quick Facts
Patent No.
US 10,579,768
App. No.
15/502,950
Granted
Mar 3, 2020
Kind
B2
Abstract

Metrology targets and target design methods are provided, in which target elements are defined by replacing elements from a periodic pattern having a pitch p, by assist elements having at least one geometric difference from the replaced elements, to form a composite periodic structure that maintains the pitch p as a single pitch. Constructing targets within the bounds of compatibility with advanced multiple patterning techniques improves the fidelity of the targets and fill factor modulation enables adjustment of the targets to produce sufficient metrology sensitivity for extracting the overlay while achieving process compatibility of the targets.

Claims (9)

1. A composite periodic target structure comprising:

a wafer;

a plurality of target elements on the wafer; and

a plurality of assist elements on the wafer between the target elements, wherein the assist elements differ from the target elements by at least one geometric feature, wherein the target elements and the assist elements are positioned at a single pitch p such that a fill factor of the wafer is modulated to optimize a contrast between target or assist elements and the wafer detectable by a metrology sensor, and wherein the at least one geometric feature is a critical dimension;

wherein the fill factor is a ratio, for an area on the wafer, of an area occupied by target elements or assist elements to the area on the wafer.

2. The composite periodic target structure of claim 1 , wherein spaces between the target elements and/or the pitch p avoid a forbidden lithographic pitch.

3. The composite periodic target structure of claim 1 , wherein edge placements of the target elements are designed using lithography simulation.

4. The composite periodic target structure of claim 1 , wherein spaces between the target elements and/or the pitch p obtain a close match in diffraction patterns of the composite periodic target structure with respect to a model device.

5. The composite periodic target structure of claim 1 , wherein at least one of the assist elements is configured to obtain a close match in diffraction patterns of the composite periodic target structure with respect to a model device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2017
From: LEVINSKI, VLADIMIR; HAJAJ, EITAN; ITZKOVICH, TAL; AHARON, SHARON; ADEL, MICHAEL E.; PASKOVER, YURI; NEGRI, DARIA; LUBASHEVSKY, YUVAL; MANASSEN, AMNON; LEE, MYUNGJUN; SMITH, MARK D.
To: KLA-TENCOR CORPORATION
Reel/Frame 043582/0600 →
Continuity (2)
Provisional Application 62318086 · Apr 4, 2016
Related Publication 20180157784A1 · Jun 7, 2018
Cited By (1)
US 12,411,420