Micro light emitting diode module and manufacturing method thereof
A micro light emitting diode module contains: multiple flip-chip LEDs and a dielectric layer. The multiple flip-chip LEDs are arranged side by side. The flip-chip LEDs have a light emitting side and an electrical connecting side. The electrical connecting side of the flip-chip LEDs has a p-contact pad and an n pad. The dielectric layer is formed on the electrical connecting side of the flip-chip LEDs. The dielectric layer has multiple electric channels in which multiple electrical circuits are formed. The electrical circuits are corresponded to the p-contact pads and the n-contact pads of the flip-chip LEDs respectively, and each electrical circuit is electrically connected to its corresponding p-contact pad or n-contact pad. By reconstruction of circuits on LED array, the present invention not only has high processing yield, but also significantly reduces the manufacturing time. A method for making the micro light emitting diode module is also provided.
1. A micro light emitting diode module comprising:
multiple flip-chip LEDs arranged side by side, each of the flip-chip LEDs having a light emitting side and an electrical connecting side, the electrical connecting side of each flip-chip LED having a p-contact pad and an n-contact pad; and
a dielectric layer formed on the electrical connecting side of the flip-chip LEDs, the dielectric layer having multiple electric channels in which multiple electrical circuits are formed, the multiple electrical circuits being corresponded to the p-contact pads and the n-contact pads of the flip-chip LEDs respectively, and each electrical circuit being electrically connected to its corresponding p-contact pad or n-contact pad, wherein the dielectric layer directly contacts the p-contact pads and the n-contact pads of the flip-chip LEDs;
wherein the dielectric layer has a first side facing the flip-chip LEDs and a second side away from the flip-chip LEDs, the micro light emitting diode module further comprises a solder mask layer covering the second side of the dielectric layer;
wherein a part of the electrical circuits is exposed from the second side of the dielectric layer, the part of the electrical circuits exposed from the second side of the dielectric layer has an outer surface facing opposite to the first side of the dielectric layer, and the solder mask layer fully covers the outer surface of the part of the electrical circuits exposed from the second side of the dielectric layer.