IP Library › Granted Patent US 12,568,855
Granted Patent B2
US 12,568,855 · App. 17/723,034 · Granted Mar 3, 2026

Display module

Inventors: Myunghee Kim (Suwon-si, KR); Youngki Jung (Suwon-si, KR); Donghwan Kim (Suwon-si, KR); Yong Namkung (Suwon-si, KR); Chulgyu Jung (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L25/167H01L24/02H01L24/05H01L24/06H01L24/08H01L24/24H01L24/32H01L24/33H01L24/95H01L2224/02377H01L2224/02381H01L2224/05548H01L2224/05558H01L2224/05573H01L2224/0603H01L2224/06102H01L2224/08147H01L2224/24147H01L2224/32145H01L2224/33181H01L2224/95101H01L2224/95144H10H20/85
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Quick Facts
Patent No.
US 12,568,855
App. No.
17/723,034
Filed
Apr 18, 2022
Granted
Mar 3, 2026
Kind
B2
Art Unit
2893
USPC
257/391
Abstract

A display module is disclosed. The display module includes a substrate; a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes including an inorganic light-emitting diode that has a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad provided around the mounting groove.

Claims (44)

1 . A display module, comprising:

a substrate;

a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes comprising an inorganic light-emitting diode that has a first chip electrode and a second chip electrode;

a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode;

a third substrate electrode pad and a fourth substrate electrode pad provided on an insulating layer, wherein the insulating layer is provided on the substrate, and wherein the mounting groove is provided between the third substrate electrode pad and the fourth substrate electrode pad;

a fifth substrate electrode pad and a sixth substrate electrode pad provided at a bottom surface of another mounting groove from among the plurality of mounting grooves that is adjacent to the mounting groove, the fifth substrate electrode pad being electrically coupled to the first substrate electrode pad and the sixth substrate electrode pad being electrically coupled to the second substrate electrode pad; and

an insulator filling the another mounting groove.

2 . The display module of claim 1 , wherein at least one of the third substrate electrode pad and the fourth substrate electrode pad extends along a side wall of the mounting groove.

3 . The display module of claim 1 , wherein the third substrate electrode pad and the fourth substrate electrode pad are symmetrically provided with respect to a center of the mounting groove.

4 . The display module of claim 1 , wherein the third substrate electrode pad and the fourth substrate electrode pad are asymmetrically provided with respect to a center of the mounting groove.

5 . The display module of claim 1 , wherein the substrate comprises an insulating layer provided on the third substrate electrode pad and the fourth substrate electrode pad, and

wherein the insulating layer extends in the mounting groove between the third substrate electrode pad and the bottom surface of the mounting groove.

6 . The display module of claim 1 , wherein the third substrate electrode pad is electrically coupled to the first chip electrode by a first conductor, and

wherein the fourth substrate electrode pad is electrically coupled to the second chip electrode of the inorganic light-emitting diode by a second conductor.

7 . The display module of claim 1 , wherein a post is provided on a light-emitting surface of the inorganic light-emitting diode, and

wherein the post comprises a magnetic layer.

8 . The display module of claim 7 , wherein the magnetic layer is formed of Germanium (Ge).

9 . The display module of claim 7 , wherein the post is offset from a center of the light-emitting surface.

10 . The display module of claim 9 , wherein the post is provided at a position corresponding to one of the first chip electrode and the second chip electrode.

11 . A display module, comprising:

a substrate;

a thin-film transistor (TFT) layer provided on the substrate;

a plurality of mounting grooves being provided in the TFT layer;

a plurality of inorganic light-emitting diodes provided in the plurality of mounting grooves, the plurality of inorganic light-emitting diodes comprising an inorganic light-emitting diode that has a first chip electrode and a second chip electrode;

a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode;

a third substrate electrode pad and a fourth substrate electrode pad provided on a side wall of the mounting groove;

a fifth substrate electrode pad and a sixth substrate electrode pad provided at a bottom surface of another mounting groove from among the plurality of mounting grooves that is adjacent to the mounting groove, the fifth substrate electrode pad being electrically coupled to the first substrate electrode pad and the sixth substrate electrode pad being electrically coupled to the second substrate electrode pad; and

an insulator filling the another mounting groove,

wherein the first substrate electrode pad, the third substrate electrode pad and the fifth substrate electrode pad are electrically coupled to a first electrode wiring provided on the TFT layer, and

wherein the second substrate electrode pad, the fourth substrate electrode pad and the sixth substrate electrode pad are electrically coupled to a second electrode wiring provided on the TFT layer.

12 . The display module of claim 11 , further comprising an insulating layer covering the third substrate electrode pad and the fourth substrate electrode pad,

wherein the insulating layer extends in the mounting groove between the third substrate electrode pad and the bottom surface of the mounting groove.

13 . A display module comprising:

a substrate;

a plurality of mounting grooves being provided in the substrate;

a first substrate electrode pad and a second substrate electrode pad provided in a first groove of the plurality of mounting grooves;

an inorganic light-emitting diode provided in the first groove and electrically connected to the first substrate electrode pad and the second substrate electrode pad;

a third substrate electrode pad provided on the substrate and electrically connected to the first substrate electrode pad;

a fourth substrate electrode pad provided on the substrate and electrically connected to the second substrate electrode pad;

a fifth substrate electrode pad and a sixth substrate electrode pad provided in a second groove of the plurality of mounting grooves, the fifth substrate electrode pad being electrically coupled to the first substrate electrode pad and the sixth substrate electrode pad being electrically coupled to the second substrate electrode pad; and

an insulator filling the another mounting groove.

14 . The display module of claim 13 , wherein the third substrate electrode pad is provided on an upper surface of the substrate and extends along a side wall of the first groove.

15 . The display module of claim 13 , wherein the third substrate electrode pad is provided on an upper surface of the substrate and extends along a side wall of the first groove and a side wall of a third groove adjacent the first groove.

16 . The display module of claim 1 , wherein the insulator fills the another mounting groove to a height corresponding to a surface of the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2022
From: KIM, MYUNGHEE; JUNG, YOUNGKI; KIM, DONGHWAN; NAMKUNG, YONG; JUNG, CHULGYU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 060109/0989 →
Priority Claims (2)
KR 10-2020-0134891 · Oct 19, 2020 · national
KR 10-2021-0040332 · Mar 29, 2021 · national
Continuity (2)
Continuation PCTKR2021014142 · Oct 13, 2021
Related Publication 20220238503A1 · Jul 28, 2022
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