Encapsulated emissive element for fluidic assembly
A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.
1. An encapsulated emissive element comprising:
a micro-light emitting diode (micro-LED), with a maximum cross-section of 100 microns or less, having a profile selected from a group consisting of differing horizontal profile shapes, as defined from a plan, top-down view orthogonal to the micro-LED top surface and sidewall surfaces, or differing vertical thicknesses between the micro-LED top and bottom surfaces, and comprising a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, and a pair of electrical contacts, and wherein each micro-LED profile is associated with a different wavelength of emissive element light emission;
a fluidic assembly key exposing the micro-LED electrical contacts while at least partially encapsulating the micro-LED to form a profile, different than the micro-LED profile, made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials;
wherein a first micro-LED has first thickness between its top and bottom surfaces and is associated with a first wavelength of micro-LED light emission;
wherein a second micro-LED has second thickness between its top and bottom surfaces, less than the first thickness, and is associated with a second wavelength of micro-LED light emission;
wherein a first fluidic assembly key encapsulates the first micro-LED top and bottom surfaces to form an overall encapsulated emissive element third thickness; and,
wherein a second fluidic assembly key encapsulates the second micro-LED top and bottom surfaces to form the overall encapsulated emissive element third thickness.
2. The encapsulated emissive element of claim 1 wherein the micro-LED has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a vantage orthogonal to the micro-LED sidewalls and micro-LED top surface.
3. The encapsulated emissive element of claim 2 wherein the fluidic assembly key has a vertical profile slope formed between a fluidic assembly key bottom surface, aligned with the micro-LED bottom surface, and a fluidic assembly key top surface aligned with the micro-LED top surface; and,
wherein the fluidic assembly key top surface width is greater than or equal to the fluidic assembly key bottom surface width.
4. The encapsulated emissive element of claim 3 wherein the micro-LED top and bottom surfaces are substantially planar in a horizontal orientation; and,
wherein the micro-LED sidewalls form a vertically oriented slope between a micro-LED top surface width less than or equal to a micro-LED bottom surface width.
5. The encapsulated emissive element of claim 1 wherein the micro-LED further comprises a keel extending from the micro-LED bottom surface.
6. The encapsulated emissive element of claim 1 wherein the micro-LED electrical contacts are arranged in an orientation selected from the group consisting of vertical, with a first electrical contact mounted on the micro-LED top surface and a second electrical contact mounted on the micro-LED bottom surface, and surface mount, with both the first and second electrical contacts mounted on the micro-LED top surface.
7. The encapsulated emissive element of claim 1 wherein the micro-LED is a surface mount micro-LED with a first and a second electrical contact mounted on micro-LED top surface; and,
wherein the fluidic assembly key is an electrical insulator isolating the first electrical contact from the second electrical contact.
8. A fluidic assembly emissive display comprising:
a substrate comprising:
a top surface;
a plurality of trap sites formed in the substrate top surface, with each trap site having sidewalls and an opening with a horizontal shape, defined from a view orthogonal to the substrate top surface and trap site sidewalls, and a bottom surface with at least a first electrical interface connected to a corresponding intersection in an underlying row/column enablement matrix;
an encapsulated emissive element occupying each trap site, each encapsulated emissive element comprising:
a micro-light emitting diode (micro-LED), with a maximum cross-section of 100 microns or less, comprising a profile, a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, a first electrical contact mounted on the micro-LED top surface and connected to a corresponding trap site first electrical interface, and a second electrical contact;
a fluidic assembly key exposing the micro-LED electrical contacts while at least partially encapsulating the micro-LED to form a profile, different than the micro-LED profile, made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing material;
wherein a first micro-LED type has first thickness between its top and bottom surfaces and is associated with a first wavelength of micro-LED light emission;
wherein a second micro-LED type has second thickness between its top and bottom surfaces, less than the first thickness, and is associated with a second wavelength of micro-LED light emission;
wherein a first fluidic assembly key type encapsulates the first micro-LED top and bottom surfaces to form an overall encapsulated emissive element third thickness; and,
wherein a second fluidic assembly key type encapsulates the second micro-LED top and bottom surfaces to form the overall encapsulated emissive element third thickness.
9. The fluidic assembly emissive display of claim 8 wherein each micro-LED top surface is substantially planar in a horizontal orientation;
wherein each micro-LED has a horizontal profile and the fluidic assembly key has a differing horizontal profile, as defined from a plan, top-down view orthogonal to the micro-LED top surface and sidewall surfaces; and,
wherein the display substrate top surface is substantially planar in the horizontal orientation and each trap site opening shape matches the horizontal profile of its occupying encapsulated emissive element fluidic assembly key.
10. The fluidic assembly display of claim 8 wherein each micro-LED has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a view orthogonal to the micro-LED sidewalls and micro-LED top surface.
11. The fluidic assembly display of claim 10 wherein the fluidic assembly keys have a vertical profile slope formed between a fluidic assembly key bottom surface, aligned with the micro-LED bottom surface, and a fluidic assembly key top surface aligned with the micro-LED top surface; and,
wherein the fluidic assembly key top surface width is greater than or equal to the fluidic assembly key bottom surface width.
12. The fluidic assembly display of claim 11 wherein the substrate trap sites comprise sidewalls with a vertical profile slope formed between the trap site opening and the trap site bottom surface; and,
wherein a width of the substrate trap site bottom surface is less than or equal to a width of the trap site opening.
13. The fluidic assembly display of claim 11 wherein the micro-LED top and bottom surfaces are substantially planar in a horizontal orientation; and,
wherein the micro-LED sidewalls form a vertically oriented slope between a micro-LED top surface width less than or equal to a micro-LED bottom surface width.
14. The fluidic assembly display of claim 8 wherein each micro-LED further comprises a keel extending from the micro-LED bottom surface.
15. The fluidic assembly display of claim 8 wherein the micro-LED electrical contacts are arranged in an orientation selected from the group consisting of vertical, with a second electrical contact mounted on the micro-LED bottom surface, and surface mount, with the second electrical contact mounted on the micro-LED top surface and connected to a second electrical interface mounted on the trap site bottom surface.
16. The fluidic assembly display of claim 8 wherein the micro-LEDs are surface mount emissive elements with a first and a second electrical contact mounted to the micro-LED top surface; and,
wherein the fluidic assembly keys are an electrical insulator isolating the first electrical contact from the second electrical contact.
17. An encapsulated emissive element comprising:
a micro-light emitting diode (micro-LED), with a maximum cross-section of 100 microns or less, having a horizontal profile and comprising a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, and a pair of electrical contacts, where a horizontal profile is defined from a plan, top-down view orthogonal to the micro-LED top surface and sidewall surfaces;
a fluidic assembly key at least partially encapsulating the micro-LED to form a horizontal profile, different than the micro-LED horizontal profile, the fluidic assembly key having top surface and a bottom surface;
wherein the fluidic assembly key bottom surface is formed in a same horizontal plane as the micro-LED bottom surface, and the fluidic assembly key top surface overlies the micro-LED top surface with at least one opening exposing the micro-LED electrical contacts;
wherein the micro-LED profile also includes differing vertical thicknesses between the micro-LED top and bottom surfaces; and,
wherein each micro-LED profile is associated with a different wavelength of micro-LED light emission.
18. The encapsulated emissive element of claim 17 wherein the micro-LED is capable of emitting light having a first wavelength, and wherein the first wavelength is associated with a first fluidic assembly key horizontal profile.
19. The encapsulated emissive element of claim 18 wherein the fluidic assembly key horizontal profile is selected from a plurality of different horizontally oriented shapes; and,
wherein each horizontally oriented shape is associated with a different wavelength of micro-LED light emission.
20. The encapsulated emissive element of claim 17 wherein a first micro-LED has first thickness between its top and bottom surfaces and is associated with a first wavelength of micro-LED light emission;
wherein a second micro-LED has second thickness between its top and bottom surfaces, less than the first thickness, and is associated with a second wavelength of micro-LED light emission;
wherein a first fluidic assembly key encapsulates the first micro-LED top and bottom surfaces to form an overall encapsulated emissive element third thickness; and,
wherein a second fluidic assembly key encapsulates the second micro-LED top and bottom surfaces to form the overall encapsulated emissive element third thickness.
21. The encapsulated emissive element of claim 17 wherein the micro-LED has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a view orthogonal to the micro-LED sidewalls and micro-LED top surface.
22. The encapsulated emissive element of claim 21 wherein the fluidic assembly key has a vertical profile slope formed between a fluidic assembly key bottom surface, aligned with the micro-LED bottom surface, and a fluidic assembly key top surface aligned with the micro-LED top surface; and,
wherein the fluidic assembly key top surface width is greater than or equal to the fluidic assembly key bottom surface width.
23. The encapsulated emissive element of claim 22 wherein the micro-LED top and bottom surfaces are substantially planar in a horizontal orientation; and,
wherein the micro-LED sidewalls form a vertically oriented slope between a micro-LED top surface width less than or equal to a micro-LED bottom surface width.
24. The encapsulated emissive element of claim 17 wherein the micro-LED further comprises a keel extending from the micro-LED bottom surface.
25. The encapsulated emissive element of claim 17 wherein the micro-LED electrical contacts are arranged in an orientation selected from the group consisting of vertical, with a first electrical contact mounted on the micro-LED top surface and a second electrical contact mounted on the micro-LED bottom surface, and surface mount, with both the first and second electrical contacts mounted on the micro-LED top surface.
26. The encapsulated emissive element of claim 17 wherein the micro-LED is a surface mount emissive element with a first and a second electrical contact mounted on the micro-LED top surface; and,
wherein the fluidic assembly key is an electrical insulator isolating the first electrical contact from the second electrical contact.
27. An encapsulated emissive element comprising:
a micro-light emitting diode (micro-LED), with a maximum cross-section of 100 microns or less, having a profile and comprising a top surface, a bottom surface, a keel extending from the bottom surface, sidewall surfaces between the top and bottom surfaces, and a pair of electrical contacts; and,
a fluidic assembly key exposing the micro-LED electrical contacts while at least partially encapsulating the micro-LED to form a profile, different than the micro-LED profile, made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials.
28. The encapsulated emissive element of claim 27 wherein the micro-LED top surface is substantially planar in a horizontal orientation; and,
wherein the micro-LED has a horizontal profile and the fluidic assembly key has a differing horizontal profile, as defined from a plan, top-down view orthogonal to the micro-LED top surface and sidewall surfaces.
29. The encapsulated emissive element of claim 28 wherein the micro-LED is capable of emitting light having a first wavelength, and wherein the first wavelength is associated with a first fluidic assembly key horizontal profile.
30. The encapsulated emissive element of claim 29 wherein the fluidic assembly key horizontal profile is selected from a plurality of different horizontally oriented shapes; and,
wherein each horizontally oriented shape is associated with a different wavelength of micro-LED light emission.
31. The encapsulated emissive element of claim 27 wherein the micro-LED profile is selected from a group consisting of differing horizontal profile shapes, as defined from a plan, top-down view orthogonal to the micro-LED top surface and sidewall surfaces, or differing vertical thicknesses between the micro-LED top and bottom surfaces; and,
wherein each micro-LED profile is associated with a different wavelength of emissive element light emission.
32. The encapsulated emissive element of claim 27 wherein the micro-LED has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a vantage orthogonal to the micro-LED sidewalls and micro-LED top surface.
33. The encapsulated emissive element of claim 32 wherein the fluidic assembly key has a vertical profile slope formed between a fluidic assembly key bottom surface, aligned with the micro-LED bottom surface, and a fluidic assembly key top surface aligned with the micro-LED top surface; and,
wherein the fluidic assembly key top surface width is greater than or equal to the fluidic assembly key bottom surface width.
34. A fluidic assembly emissive display comprising:
a substrate comprising:
a top surface;
a plurality of trap sites formed in the substrate top surface, with each trap site having sidewalls and an opening with a horizontal shape, defined from a view orthogonal to the substrate top surface and trap site sidewalls, and a bottom surface with at least a first electrical interface connected to a corresponding intersection in an underlying row/column enablement matrix;
an encapsulated emissive element occupying each trap site, each encapsulated emissive element comprising:
a micro-light emitting diode (micro-LED), with a maximum cross-section of 100 microns or less, comprising a profile, a top surface, a bottom surface, a keel extending from the bottom surface, sidewall surfaces between the top and bottom surfaces, a first electrical contact mounted on the micro-LED top surface and connected to a corresponding trap site first electrical interface, and a second electrical contact; and,
a fluidic assembly key exposing the micro-LED electrical contacts while at least partially encapsulating the micro-LED to form a profile, different than the micro-LED profile, made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing material.
35. A fluidic assembly emissive display comprising:
a substrate comprising:
a top surface;
a plurality of trap sites formed in the substrate top surface, with each trap site having sidewalls and an opening with a horizontal shape, defined from a view orthogonal to the substrate top surface and trap site sidewalls, and a bottom surface with at least a first electrical interface connected to a corresponding intersection in an underlying row/column enablement matrix;
an encapsulated emissive element occupying each trap site, each encapsulated emissive element comprising:
a micro-light emitting diode (micro-LED), with a maximum cross-section of 100 microns or less, comprising a profile, a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, a first electrical contact mounted on the micro-LED top surface and connected to a corresponding trap site first electrical interface, and a second electrical contact;
a fluidic assembly key exposing the micro-LED electrical contacts while at least partially encapsulating the micro-LED to form a profile, different than the micro-LED profile, made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing material;
wherein each micro-LED has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a view orthogonal to the micro-LED sidewalls and micro-LED top surface;
wherein the fluidic assembly keys have a vertical profile slope formed between a fluidic assembly key bottom surface, aligned with the micro-LED bottom surface, and a fluidic assembly key top surface aligned with the micro-LED top surface; and,
wherein the fluidic assembly key top surface width is greater than or equal to the fluidic assembly key bottom surface width.
36. The fluidic assembly display of claim 35 wherein the substrate trap sites comprise sidewalls with a vertical profile slope formed between the trap site opening and the trap site bottom surface; and,
wherein a width of the substrate trap site bottom surface is less than or equal to a width of the trap site opening.
37. The fluidic assembly display of claim 35 wherein the micro-LED top and bottom surfaces are substantially planar in a horizontal orientation; and,
wherein the micro-LED sidewalls form a vertically oriented slope between a micro-LED top surface width less than or equal to a micro-LED bottom surface width.
38. An encapsulated emissive element comprising:
a micro-light emitting diode (micro-LED), with a maximum cross-section of 100 microns or less, having a horizontal profile and comprising a top surface, a bottom surface, a keel extending from the bottom surface, sidewall surfaces between the top and bottom surfaces, and a pair of electrical contacts, where a horizontal profile is defined from a plan, top-down view orthogonal to the micro-LED top surface and sidewall surfaces;
a fluidic assembly key at least partially encapsulating the micro-LED to form a horizontal profile, different than the micro-LED horizontal profile, the fluidic assembly key having top surface and a bottom surface; and,
wherein the fluidic assembly key bottom surface is formed in a same horizontal plane as the micro-LED bottom surface, and the fluidic assembly key top surface overlies the micro-LED top surface with at least one opening exposing the micro-LED electrical contacts.