Devices and methods related to radio-frequency switches having improved on-resistance performance

1. A method for fabricating a radio-frequency (RF) switching device, the method comprising:

providing a semiconductor substrate;

forming a plurality of switching elements on the semiconductor substrate such that the switching elements have a non-uniform distribution of a lateral-dimension-based parameter; and

connecting the switching elements to form a stack, such that the non-uniform distribution results in the stack having a first ON-resistance (Ron) value that is less than a second ON-resistance value corresponding to a similar stack having a uniform distribution of the lateral-dimension-based parameter.

2. The method of claim 1 wherein the stack further has a first maximum voltage handling capacity that is at least as high as a second maximum voltage handling capacity corresponding to the similar stack.

3. The method of claim 1 wherein the stack further has a first radio-frequency linearity performance that is better than a second radio-frequency linearity performance corresponding to the similar stack.

4. The method of claim 1 wherein each of the plurality of switching elements includes a field-effect transistor (FET) having a source, a drain, and a gate formed on the active region.

5. The method of claim 4 wherein the field-effect transistor is implemented as a silicon-on-insulator (SOI) device.

6. The method of claim 4 wherein the lateral-dimension-based parameter includes a length of the gate.

7. The method of claim 6 wherein the non-uniform distribution of the gate length is based on a non-uniform distribution of another lateral-dimension-based or external-voltage-based parameter associated with the field-effect transistors.

8. The method of claim 7 wherein the other parameter includes a distribution of a drain-to-source voltage across each field-effect transistor.

9. The method of claim 8 wherein the non-uniform distribution of the gate length is selected to yield a scaled version of the distribution of drain-to-source voltages.

10. The method of claim 9 wherein the scaled version of the distribution of drain-to-source voltages is based on scaling of the highest value of a respective distribution of drain-to-source voltages corresponding to a uniform distribution of the gate length.

11. The method of claim 10 wherein the highest value of the respective distribution of drain-to-source voltages is for the first field-effect transistor from a first terminal.

12. The method of claim 11 wherein the first terminal is configured as an input terminal for receiving a radio-frequency signal.

13. The method of claim 12 wherein the gate length of at least the first field-effect transistor is greater than the value of the uniform distribution of the gate length.

14. The method of claim 12 wherein at least some of the field-effect transistors have gate lengths that are less than the value of the uniform distribution of the gate length.

15. The method of claim 12 wherein the sum of the drain-to-source voltage values of the field-effect transistors for the non-uniform distribution of the gate length is greater than the sum of the drain-to-source voltage values of the field-effect transistors for the uniform distribution of the gate length.

16. The method of claim 15 wherein the sum of the gate lengths of the field-effect transistors for the non-uniform distribution of the gate length is greater than the sum of the gate length of the field-effect transistors for the uniform distribution of the gate length.

17. The method of claim 7 wherein the non-uniform distribution of the gate length includes a plurality of groups of gate length values, each group having a common value of the gate length.

18. The method of claim 6 wherein at least two of the field-effect transistors include different values of gate widths.