Gate cut with high selectivity to preserve interlevel dielectric layer
A method for preserving interlevel dielectric in a gate cut region includes recessing a dielectric fill to expose cap layers of gate structures formed in a device region and in a cut region and forming a liner in the recess on top of the recessed dielectric fill. The liner includes a material to provide etch selectivity to protect the dielectric fill. The gate structures in the cut region are recessed to form a gate recess using the liner to protect the dielectric fill from etching. A gate material is removed from within the gate structure using the liner to protect the dielectric fill from etching. A dielectric gap fill is formed to replace the gate material and to fill the gate recess in the cut region.
1. A method for preserving interlevel dielectric in a gate cut region, comprising:
forming a liner in a recess on top of a recessed dielectric fill recessed below a top surface of gate structures in a device region and in a cut region, the liner including a material to provide etch selectivity to protect the recessed dielectric fill,
wherein forming the liner includes:
conformally depositing the liner over the gate structures and on the top of the recessed dielectric fill, and
planarizing the liner to remove the liner over the gate structures; and
forming a dielectric gap fill to replace a gate material and to fill a gate recess in the cut region using the liner to protect the recessed dielectric fill from being etched.
2. The method as recited in claim 1 , wherein forming the liner includes: forming the liner from a material that resists etching during recessing the cap layer and removing the gate material.
3. The method as recited in claim 1 , wherein forming the liner includes: forming the liner from TiN.
4. The method as recited in claim 1 , further including recessing the gate structures in the cut region by patterning a mask layer to protect the device region and etching a cap layer of the gate structure in the cut region.
5. The method as recited in claim 1 , further including removing the gate material by removing a dummy gate.
6. The method as recited in claim 1 , further including removing the gate material by removing a gate first structure.
7. The method as recited in claim 1 , wherein forming the dielectric gap fill includes forming the dielectric gap fill between spacers formed in the gate structure.
8. The method as recited in claim 1 , further comprising:
forming gate structures in the device region and the cut region; and
forming source and drain regions in the device region.
9. The method as recited in claim 8 , wherein forming the source and drain regions in the device region includes epitaxially growing the source and drain regions between the gate structures.
10. The method as recited in claim 1 , further comprising:
depositing and planarizing a dielectric fill to fill in gaps between the gate structures in the device region and the cut region; and
recessing the dielectric fill to form the recessed dielectric fill and to expose a cap layer at a top portion f the gate structures.
11. A method for preserving interlevel dielectric in a gate cut region, comprising:
forming a liner in a device region and in a cut region between gate structures such that the liner is below a top surface of the gate structures, and the liner including a material to provide etch selectivity to protect a recessed dielectric fill; and
recessing the gate structures and removing gate material in the cut region to form a gate recess using the liner to protect the recessed dielectric fill from being etched, wherein recessing the gate structures in the cut region includes patterning a mask layer to protect the device region and etching a cap layer of the gate structure in the cut region.
12. The method as recited in claim 11 , wherein forming the liner includes:
conformally depositing the liner over the gate structures and on the top of the dielectric fill; and
planarizing the liner to remove the liner over the gate structures.
13. The method as recited in claim 11 , wherein forming the liner includes: forming the liner from TiN.
14. The method as recited in claim 11 , Wherein removing the gate material includes removing a dummy gate.
15. The method as recited in claim 11 , wherein removing the gate material includes removing a gate first structure.
16. The method as recited in claim 11 , further including forming the dielectric gap fill between spacers formed in the gate structure.
17. The method as recited in claim 11 , further comprising:
forming gate structures in the device region and the cut region; and
forming source and drain regions in the device region.
18. The method as recited in claim 11 , further comprising:
depositing and planarizing a dielectric fill to fill in gaps between the gate structures in the device region and the cut region; and
recessing the dielectric fill to form the recessed dielectric fill and to expose a cap layer at a top portion of the gate structures.