Solid-state image pickup device and electronic apparatus
The present disclosure relates to a solid-state image pickup device and an electronic apparatus by which a phase-difference detection pixel that avoids defects such as lowering of sensitivity to incident light and lowering of phase-difference detection accuracy can be realized. A solid-state image pickup device as a first aspect of the present disclosure is a solid-state image pickup device in which a normal pixel that generates a pixel signal of an image and a phase-difference detection pixel that generates a pixel signal used in calculation of a phase-difference signal for controlling an image-surface phase difference AF function are arranged in a mixed manner, in which, in the phase-difference detection pixel, a shared on-chip lens for condensing incident light to a photoelectric converter that generates a pixel signal used in calculation of the phase-difference signal is formed for every plurality of adjacent phase-difference detection pixels. The present disclosure is applicable to a backside illumination CMOS image sensor and an electronic apparatus equipped with the same.
1. An imaging device comprising:
a semiconductor substrate comprising first to third photoelectric conversion regions, the first to third photoelectric conversion regions being disposed along a first direction, the first photoelectric conversion region being disposed adjacent to the second photoelectric conversion region, and the second photoelectric conversion region being disposed adjacent to the third photoelectric conversion region;
a first on-chip lens disposed above the first photoelectric conversion region;
a second on-chip lens disposed above the second and third photoelectric conversion regions; and
a first color filter disposed above the first to third photoelectric conversion regions and below the first on-chip lens and the second on-chip lens,
wherein the first on-chip lens has a different size from the second on-chip lens.
2. The imaging device according to claim 1 , wherein the first to third photoelectric conversion regions are configured to receive light transmitted through the first color filter.
3. The imaging device according to claim 1 , wherein the first on-chip lens is configured to focus incident light on the first photoelectric conversion region and the second on-chip lens is configured to focus incident light on the second and third photoelectric conversion regions.
4. The imaging device according to claim 1 , wherein the first color filter bandpasses green light.
5. The imaging device according to claim 1 , wherein the first photoelectric conversion region has the same size with one of the second and third photoelectric conversion regions.
6. The imaging device according to claim 1 , wherein the first on-chip lens is smaller than the second on-chip lens.
7. The imaging device according to claim 1 , wherein a phase difference is configured to be detected by outputs from the second photoelectric conversion region and the third photoelectric conversion region.
8. The imaging device according to claim 1 , wherein a first separation region is disposed between the first photoelectric conversion region and the second photoelectric conversion region and wherein a second separation region is disposed between the second photoelectric conversion region and the third photoelectric conversion region.
9. The imaging device according to claim 8 , wherein a light shield is disposed above the first separation region.
10. The imaging device according to claim 8 , wherein a light shield is not disposed above the second separation region.
11. The imaging device according to claim 1 , further comprising a wiring layer disposed below the semiconductor substrate.
12. A camera-equipped mobile apparatus comprising the imaging device according to claim 1 .
13. The imaging device according to claim 1 , wherein the first direction is a lateral direction of the semiconductor substrate.
14. The imaging device according to claim 1 , wherein the second on-chip lens has a hexagonal shape as viewed from above.
15. An imaging device comprising:
a semiconductor substrate comprising first to third photoelectric conversion regions, the first to third photoelectric conversion regions being disposed along a first direction, the first photoelectric conversion region being disposed adjacent to the second photoelectric conversion region, and the second photoelectric conversion region being disposed adjacent to the third photoelectric conversion region;
a first on-chip lens disposed above the first photoelectric conversion region;
a second on-chip lens disposed above the second and third photoelectric conversion regions;
a first color filter disposed above the first photoelectric conversion region and below the first on-chip lens; and
a second color filter disposed above the second and third photoelectric conversion regions and below the second on-chip lens,
wherein the first on-chip lens has a different size from the second on-chip lens.
16. The imaging device according to claim 15 , wherein the first photoelectric conversion region is configured to receive light transmitted through the first color filter and the second and third photoelectric conversion regions are configured to receive light transmitted through the second color filter.
17. The imaging device according to claim 15 , wherein the first on-chip lens is configured to focus incident light on the first photoelectric conversion region and the second on-chip lens is configured to focus incident light on the second and third photoelectric conversion regions.
18. The imaging device according to claim 15 , wherein the first color filter and the second color filter bandpass green light.
19. The imaging device according to claim 15 , wherein the first photoelectric conversion region has the same size with one of the second and third photoelectric conversion regions.
20. The imaging device according to claim 15 , wherein the first on-chip lens is smaller than the second on-chip lens.
21. The imaging device according to claim 15 , wherein a phase difference is configured to be detected by outputs from the second photoelectric conversion region and the third photoelectric conversion region.
22. The imaging device according to claim 15 , wherein a first separation region is disposed between the first photoelectric conversion region and the second photoelectric conversion region and wherein a second separation region is disposed between the second photoelectric conversion region and the third photoelectric conversion region.
23. The imaging device according to claim 22 , wherein a light shield is disposed above the first separation region.
24. The imaging device according to claim 22 , wherein a light shield is not disposed above the second separation region.
25. The imaging device according to claim 15 , further comprising a wiring layer disposed below the semiconductor substrate.
26. A camera-equipped mobile apparatus comprising the imaging device according to claim 15 .
27. The imaging device according to claim 15 , wherein the first direction is a lateral direction of the semiconductor substrate.
28. The imaging device according to claim 15 , wherein the second on-chip lens has a hexagonal shape as viewed from above.
29. An imaging device comprising:
a semiconductor substrate comprising first to third photoelectric conversion regions, the first to third photoelectric conversion regions being disposed along a first-line direction, the first photoelectric conversion region being disposed adjacent to the second photoelectric conversion region, and the second photoelectric conversion region being disposed adjacent to the third photoelectric conversion region;
a first on-chip lens disposed above the first photoelectric conversion region; and
a second on-chip lens disposed above the second and third photoelectric conversion regions,
wherein the first to third photoelectric conversion regions are configured to receive light filtered to a first spectrum,
wherein the first on-chip lens has a different size from the second on-chip lens.
30. The imaging device according to claim 29 , wherein the first to third photoelectric conversion regions are configured to receive green light.
31. The imaging device according to claim 29 , wherein the first on-chip lens is configured to focus incident light on the first photoelectric conversion region and the second on-chip lens is configured to focus incident light on the second and third photoelectric conversion regions.
32. The imaging device according to claim 29 , wherein the first photoelectric conversion region has the same size with one of the second and third photoelectric conversion regions.
33. The imaging device according to claim 29 , wherein the first on-chip lens is smaller than the second on-chip lens.
34. The imaging device according to claim 29 , wherein a phase difference is configured to be detected by outputs from the second photoelectric conversion region and the third photoelectric conversion region.
35. The imaging device according to claim 29 , wherein a first separation region is disposed between the first photoelectric conversion region and the second photoelectric conversion region and wherein a second separation region is disposed between the second photoelectric conversion region and the third photoelectric conversion region.
36. The imaging device according to claim 35 , wherein a light shield is disposed above the first separation region.
37. The imaging device according to claim 35 , wherein a light shield is not disposed above the second separation region.
38. The imaging device according to claim 29 , further comprising a wiring layer disposed below the semiconductor substrate.
39. A camera-equipped mobile apparatus comprising the imaging device according to claim 29 .
40. The imaging device according to claim 29 , wherein the first direction is a lateral direction of the semiconductor substrate.
41. The imaging device according to claim 29 , wherein the second on-chip lens has a hexagonal shape as viewed from above.