IP Library › Granted Patent US 1,060,313
Granted Patent S1
US 1,060,313 · App. 29/868,919 · Granted Feb 4, 2025

Headphone

Inventors: Pohsun Lee (Shenzhen, CN); Laurent Lindenberger (Shenzhen, CN)
Assignee: Harman International Industries, Incorporated
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Quick Facts
Patent No.
US 1,060,313
App. No.
29/868,919
Granted
Feb 4, 2025
Kind
S1
Claims (1)

The ornamental design for a headphone as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2023
From: LEE, POHSUN; LINDENBERGER, LAURENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
Reel/Frame 063427/0289 →
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