IP Library › Granted Patent US 10,622,388
Granted Patent B2
US 10,622,388 · App. 16/249,251 · Granted Apr 14, 2020

Array substrate sensor and detection device

Inventor: Chia Chiang Lin (Beijing, CN)
Assignees: BOE TECHNOLOGY GROUP CO., LTD.; KA IMAGING INC.
H01L27/1443H01L21/31111H01L21/31116H01L21/32134H01L21/76802H01L23/3171H01L27/12H01L27/124H01L27/1248H01L27/1259H01L27/1262H01L29/45H01L29/4908H01L29/78633H01L31/022475H01L31/022483H01L31/1884H01L31/202H01L21/0273Y02E10/50Y02P70/521
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Quick Facts
Patent No.
US 10,622,388
App. No.
16/249,251
Granted
Apr 14, 2020
Kind
B2
Abstract

Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer; a passivation layer disposed on the TFT; a first metal layer disposed on the passivation layer; an insulating layer disposed on the first metal layer; a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and a detection unit being disposed on the insulating layer and including a second metal layer, wherein the second metal layer makes direct contact with the source electrode via the through hole structure.

Claims (21)

1. An array substrate, comprising:

a base substrate;

a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer;

a passivation layer disposed on the TFT;

a first metal layer disposed on the passivation layer;

an insulating layer disposed on the first metal layer;

a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and

a detection unit being disposed on the insulating layer and including a second metal layer, wherein

the second metal layer makes direct contact with the source electrode via the through hole structure,

the array substrate further comprises:

a recess running through the first metal layer and the passivation layer and being disposed between the through hole structure and the active layer in a direction parallel to the base substrate, in which the first metal layer is disconnected at the recess to form different arts s aced from each other.

2. The array substrate according to claim 1 , wherein a projection of the first metal layer on the base substrate is at least partially overlapped with a projection of the TFT on the base substrate.

3. The array substrate according to claim 1 , wherein the detection unit further includes a bias electrode spaced from the second metal layer, and a semiconductor layer making contact with both the second metal layer and the bias electrode.

4. The array substrate according to claim 1 , wherein a transparent conductive layer is disposed on the second metal layer.

5. The array substrate according to claim 4 , wherein the transparent conductive layer has a thickness greater than that of the second metal layer.

6. The array substrate according to claim 5 , wherein the transparent conductive layer includes any one of indium tin oxide (ITO) or indium zinc oxide (IZO).

7. The array substrate according to claim 1 , wherein a material of the insulating layer is any one of organic resin, silicon nitride or silicon oxide.

8. The array substrate according to claim 7 , wherein a thickness of the insulating layer is 1-4 μm.

9. The array substrate according to claim 1 , wherein a material of the first metal layer and the second metal layer is any one or a combination of molybdenum (Mo), aluminum (Al) or copper (Cu).

10. A sensor, comprising the array substrate according to claim 1 .

11. A detection device, comprising the sensor according to claim 10 .

Priority Claims (1)
CN 2016 1 0229060 · Apr 13, 2016 · national
Continuity (2)
Division 15544704
Related Publication 20190165007A1 · May 30, 2019