Counterbore pocket structure for fluidic assembly
A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.
1. A fluidic assembly substrate comprising:
a substrate comprising a top surface and a bottom surface;
a plurality of pocket structures extending from the substrate top surface into the substrate, wherein at least one of the pocket structures has a keyhole shape with a first portion overlying a through-hole and having a first diameter, and a second portion overlapping the first portion, the second portion having a crescent moon-shape with a second diameter, and wherein the second diameter is greater than the first diameter; and,
wherein the through-hole is formed between the at least one pocket structure and the substrate bottom surface.
2. The fluidic assembly substrate of claim 1 , wherein the substrate comprises:
a first layer with through-holes formed between a first layer top surface and a first layer bottom surface; and,
a second layer with pocket structure formed between a second layer top surface and a second layer bottom surface.
3. The fluidic assembly substrate of claim 1 , wherein the substrate is transparent.
4. A substrate assembly comprising:
a substrate comprising a top surface and a bottom surface;
a plurality of pocket structures formed in the substrate top surface, wherein the pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate an object diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter;
a through-hole formed between each pocket structure and the substrate bottom surface; and,
an object at least sliding fit positioned inside each pocket structure, wherein the sliding fit position includes the object being positioned in the pocket structure and outside of the through-hole.
5. The substrate assembly of claim 4 , wherein the through-hole is offset from the first diameter center, away from the second portion.
6. The substrate assembly of claim 4 , wherein the substrate is transparent.
7. The substrate assembly of claim 4 , wherein the objects are disks; and,
wherein the pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.
8. The substrate assembly of claim 4 , wherein the substrate is transparent; and,
wherein the objects are light emitting diodes (LEDs) in the form of disks.
9. A fluidic assembly apparatus, the substrate comprising:
a substrate including a top surface and a bottom surface;
at least one pocket structure extending from the substrate top surface into the substrate, wherein the pocket structure includes a first region having a first diameter and a second region having a second diameter, wherein the first diameter overlaps the second diameter, and wherein a portion of the first region extends beyond the second diameter; and
a through-hole extending from the first region of the pocket structure to the substrate bottom surface.
10. The apparatus of claim 9 , wherein the through-hole has a third diameter, wherein the third diameter is less than both the first diameter and the second diameter.
11. The apparatus of claim 9 , wherein the though-hole is off-center on the first diameter.
12. The apparatus of claim 9 , wherein the through via is entirely beyond the second diameter.
13. The apparatus of claim 9 , wherein the second region is larger than the first region.
14. The apparatus of claim 9 , wherein the first radius is less than the second radius.
15. The apparatus of claim 9 , wherein the through-hole is offset from a center of the first region and away from the second region.
16. The apparatus of claim 9 , wherein the substrate is transparent.
17. The apparatus of claim 9 , wherein the through-hole is centered on the first diameter.
18. A fluidic assembly method using a pocket structure, the method comprising:
providing a substrate comprising a top surface and a bottom surface, wherein the substrate includes a plurality of pocket structures extending from the substrate top surface into the substrate, wherein at least one of the pocket structures has a keyhole shape with a first portion overlying a through-hole and having a first diameter, and a second portion overlapping the first portion, the second portion having a crescent moon-shape with a second diameter, wherein the second diameter is greater than the first diameter, and wherein the through-hole is formed between the at least one pocket structure and the substrate bottom surface;
flowing a fluid carrying a plurality of objects over the substrate top surface;
creating a suction pressure at the substrate bottom surface; and,
in response to the suction pressure from the through-holes, drawing the objects into the pocket structures.
19. The method of claim 18 , wherein the substrate is transparent.
20. The method of claim 18 , wherein the objects are light emitting diodes (LEDs) in the form of disks.
21. The method of claim 18 , wherein flowing the fluid over the substrate top surface includes:
arranging the substrate top surface with a substrate first side higher than a substrate second side;
introducing the fluid carrying the plurality of objects to the substrate first side; and,
wherein drawing objects into the pocket structures includes drawing the objects in response to gravity as well as suction pressure.
22. The method of claim 18 , wherein flowing the fluid carrying the plurality of objects over the substrate top surface includes flowing a plurality of light emitting diodes (LEDs) over the substrate top surface.
23. A fluidic assembly method using a substrate including pocket structures, the method comprising:
providing a substrate comprising a top surface and a bottom surface, with a plurality of pocket structures extending from the substrate top surface into the substrate, with each pocket structure has a through-hole extending from the pocket structure to the substrate bottom surface, and wherein the pocket structures have a first diameter sliding fit to accommodate a disk diameter;
flowing a fluid carrying a plurality of disks over the substrate top surface;
creating a suction pressure at the substrate bottom surface; and,
in response to the suction pressure from the through-holes, drawing the disks into the pocket structures.
24. The method of claim 23 , wherein flowing the fluid over the substrate top surface includes:
arranging the substrate top surface with a substrate first side higher than a substrate second side;
introducing the fluid carrying the plurality of disks to the substrate first side; and,
wherein drawing disks into the pocket structures includes drawing the disks in response to gravity as well as suction pressure.
25. The method of claim 23 , wherein providing the substrate includes providing a transparent substrate; and,
wherein flowing the fluid carrying the plurality of disks over the substrate top surface includes flowing a plurality of light emitting diodes (LEDs) in the shape of a disk over the substrate top surface.