Method of manufacturing multilayer ceramic electronic component
A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.
1. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
a bonded laminate forming step including:
cutting a green mother laminate, in which ceramic layers and inner electrode layers are stacked, to form first sectional surfaces that intersect a main surface of the green mother laminate; and
after cutting, pressing the cut green mother laminate in a state in which the first sectional surfaces are in contact with each other to obtain the bonded laminate in which the first sectional surfaces are bonded to each other; and
a separating step of separating the bonded laminate between the first sectional surfaces, which have been bonded to each other, to obtain separated laminates.
2. The method according to claim 1 , further comprising:
after performing the bonded laminate forming step, cutting the bonded laminate to form second sectional surfaces that intersect the main surface and the first sectional surfaces.
3. The method according to claim 2 , wherein, in the separating step, the bonded laminate is separated either or both of between the first sectional surfaces and between the second sectional surfaces by moving a dividing jig relative to the bonded laminate along a main surface of the bonded laminate while pressing the dividing jig against the main surface of the bonded laminate.
4. The method according to claim 1 , wherein the bonded laminate forming step further includes:
after cutting the green mother laminate to form the first sectional surfaces and before pressing the green mother laminate, cutting the green mother laminate to form second sectional surfaces that intersect the main surface and the first sectional surfaces; and
pressing the cut green mother laminate to obtain the bonded laminates in which the first sectional surfaces are bonded to each other and the second sectional surfaces are bonded to each other.
5. The method according to claim 1 , wherein, in the separating step, the bonded laminate is separated between the first sectional surfaces, which have been bonded to each other, by moving a dividing jig relative to the bonded laminate along a main surface of the bonded laminate while pressing the dividing jig against the main surface of the bonded laminate.
6. The method according to claim 1 , further comprising:
a step of applying a functional member to either or both of the first sectional surfaces and second sectional surfaces intersecting the main surface of the mother laminate and the first sectional surfaces, of the laminates obtained by separating the bonded laminate in the separating step.
7. The method according to claim 6 , wherein
the laminates obtained in the separating step each include inner electrode layers and ceramic layers that are alternately stacked;
one of each pair of the inner electrode layers that are adjacent to each other in a stacking direction is exposed at one of a pair of the first sectional surfaces that oppose each other;
the other of the pair of the inner electrode layers that are adjacent to each other in the stacking direction is exposed at the other of the pair of the first sectional surfaces; and
the method further includes a step of applying an electrode material as the functional member to the pair of the first sectional surfaces.
8. The method according to claim 6 , wherein
the laminates obtained in the separating step each include inner electrode layers and ceramic layers that are alternately stacked;
one of each pair of the inner electrode layers that are adjacent to each other in a stacking direction is exposed at one of a pair of the first sectional surfaces that oppose each other;
the other of the pair of inner electrode layers that are adjacent to each other in the stacking direction is exposed at the other of the pair of the first sectional surfaces; and
all the inner electrode layers that are stacked are exposed at each of a pair of the second sectional surfaces that intersect the first sectional surfaces and that oppose each other; and
the method further includes a step of applying an insulating material as the functional member to the second sectional surfaces of the laminates.
9. The method according to claim 6 , wherein
the laminates obtained in the separating step each include inner electrode layers and ceramic layers that are alternately stacked;
the inner electrode layers are not exposed at the first sectional surfaces;
one of each pair of the inner electrode layers that are adjacent to each other in a stacking direction is exposed at one of a pair of the second sectional surfaces that oppose each other;
the other of the pair of the inner electrode layers that are adjacent to each other in the stacking direction is exposed at the other of the pair of the second sectional surfaces; and
the method further includes a step of applying an electrode material as the functional member to the second sectional surfaces of the laminates.