Manufacturing method for multilayer ceramic electronic component
A method for manufacturing a multilayer ceramic electronic component includes: forming a pair of side margin portions on side surfaces of each of a plurality of unfired laminates, respectively, by thermocompression bonding a ceramic sheet containing 10% by mass or more of a binder resin to one of the side surfaces of the laminate for forming each of the side margin portions, performing a first heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a first condition so as to remove a portion of the binder resin contained in the side margin portions; and thereafter, performing a second heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a second condition that is different from the first condition so as to remove a remaining binder resin from the side margin portions.
1. A method for manufacturing a multilayer ceramic electronic component, comprising:
forming a pair of side margin portions on side surfaces of each of a plurality of unfired laminates, respectively, by thermocompression bonding a ceramic sheet containing 10% by mass or more of a binder resin to one of the side surfaces of the laminate for forming each of the side margin portions, each of the laminates having a substantially rectangular parallelepiped shape and including a plurality of internal electrodes stacked in a first axis direction via ceramic layers interposed therebetween, side edges of the plurality of internal electrodes being exposed at the side surfaces of the laminate in a second axis direction perpendicular to the first axis direction before being covered by the side margin portions, respectively;
performing a first heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a first condition so as to remove a portion of the binder resin contained in the side margin portions; and
thereafter, performing a second heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a second condition that is different from the first condition so as to remove a remaining binder resin from the side margin portions.
2. The method according to claim 1 , wherein the first heat treatment is performed at a first temperature, and the second heat treatment is performed at a second temperature that is higher than the first temperature.
3. The method according to claim 1 ,
wherein the first heat treatment includes irradiating at least one of the pair of side margin portions of at least some of the plurality of the laminates having the pair of side margin portions formed thereon with light rays to locally heat the irradiated side margin portions so as to remove the portion of the binder resin from the irradiated side margin portions, and
wherein the second heat treatment includes heating the plurality of laminates having the pair of side margin portions formed thereon in a furnace so as to remove the remaining binder resin.
4. The method according to claim 1 , wherein the second heat treatment includes heating the plurality of laminates having the pair of side margin portions formed thereon in a state in which an intervening member is placed between the plurality of laminates arranged on a work surface that extends planarly.
5. The method according to claim 4 , wherein the work surface has the intervening member that extends planarly and that has a plurality of openings.
6. The method according to claim 5 , wherein the intervening member has a mesh structure.
7. The method according to claim 4 , wherein the intervening member includes a plurality of particles, and the second heat treatment includes heating the plurality of laminates having the pair of side margin portions formed thereon in a state in which the plurality of laminates are mixed with the plurality of particles on the work surface.
8. The method according to claim 4 , wherein the work surface has a plurality of protrusions as the intervening member.