Stage and substrate processing apparatus
A stage includes a plate having a top surface on which a substrate is to be placed and a bottom surface; a plurality of first tubes each extending toward different regions of the bottom surface and providing opening ends facing the bottom surface; a partition wall defining a plurality of spaces surrounding the respective first tubes, the spaces forming a plurality of flow passages through which a heat exchange medium discharged from the first tubes flows; and a plurality of second tubes connected to the partition wall to communicate with the respective flow passages. The stage further includes a plurality of adjusting mechanisms provided in the respective flow passages. Each of the adjusting mechanisms is configured to be deformed depending on the temperature of the heat exchange medium in the corresponding flow passage to adjust the conductance of the flow passage in accordance with the temperature.
1. A stage comprising:
a plate having a top surface on which a substrate is mounted and a bottom surface;
a plurality of first tubes extending toward different regions of the bottom surface, each of the first tubes having an opening end facing the bottom surface;
a partition wall defining a plurality of spaces, each of spaces surrounding a respective first tube, each of the spaces respectively forming a flow passage through which a heat exchange medium discharged from the respective first tube flows;
a plurality of second tubes connected to the partition wall, each of the second tubes configured to communicate with the respective flow passage; and
a plurality of adjusting mechanisms, each of the adjusting mechanisms provided in the respective flow passage and configured to be deformed depending on a temperature of the heat exchange medium in the respective flow passage to adjust a conductance of the flow passage in accordance with the temperature,
wherein each of the adjusting mechanisms includes:
a first annular plate provided between the first tube and the partition wall to be rotatable about a central axis of the first tube, the first annular plate having a first throughhole formed at a position radially spaced from the central axis by a predetermined distance;
a second annular plate fixed to face the first annular plate, the second annular plate having a second through-hole formed at a position radially spaced from the central axis by the predetermined distance; and
a deformation member configured to be deformed depending on a temperature of the heat exchange medium to rotate the first annular plate about the central axis such that a relative distance between the first through-hole and the second through-hole in a circumferential direction with respect to the central axis varies, wherein at least a part of the deformation member has a bimetal structure in which two plates having different thermal expansion coefficients are bonded.
2. The stage of claim 1 wherein the second annular plate further includes a third through-hole formed at a position radially spaced from the central axis by the predetermined distance,
wherein the second through-hole is disposed at one side in the circumferential direction with respect to a circumferential position of the first through-hole at a reference temperature, and
wherein the third through-hole is disposed at the other side in the circumferential direction with respect to the circumferential position of the first through-hole at the reference temperature.
3. A substrate processing apparatus comprising:
a processing chamber; and
a stage in the processing chamber, the stage comprising:
a plate having a top surface on which a substrate is mounted and a bottom surface;
a plurality of first tubes extending toward different regions of the bottom surface, each of the first tubes having an opening end facing the bottom surface;
a partition wall defining a plurality of spaces, each of spaces surrounding a respective first tube, each of the spaces respectively forming a flow passage through which a heat exchange medium discharged from the respective first tube flow;
a plurality of second tubes connected to the partition wall, each of the second tubes configured to communicate with the respective flow passage; and
a plurality of adjusting mechanisms, each of the adjusting mechanisms provided in the respective flow passage and configured to be deformed depending on a temperature of the heat exchange medium in the respective flow passage to adjust a conductance of the flow passage in accordance with the temperature,
wherein each of the adjusting mechanisms includes:
a first annular plate provided between the first tube and the partition wall to be rotatable about a central axis of the first tube, the first annular plate having a first throughhole formed at a position radially spaced from the central axis by a predetermined distance;
a second annular plate fixed to face the first annular plate, the second annular plate having a second through-hole formed at a position radially spaced from the central axis by the predetermined distance; and
a deformation member configured to be deformed depending on a temperature of the heat exchange medium to rotate the first annular plate about the central axis such that a relative distance between the first through-hole and the second through-hole in a circumferential direction with respect to the central axis varies, wherein at least a part of the deformation member has a bimetal structure in which two plates having different thermal expansion coefficients are bonded.