IP Library Granted Patent US 10,658,301
Granted Patent B2
US 10,658,301 · App. 15/645,572 · Granted May 19, 2020

Image pickup apparatus and camera module

Inventors: Masami Suzuki (Kanagawa, JP); Yoshihito Higashitsutsumi (Kanagawa, JP)
Assignee: Sony Corporation
H01L23/552H01L27/14618H01L27/14636H01L31/02325H04N5/2254H04N5/2257H04N5/369H01L2224/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,658,301
App. No.
15/645,572
Granted
May 19, 2020
Kind
B2
Abstract

An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Claims (46)

1. An image pickup apparatus, comprising:

a substrate having a front side that includes an optical element area and a back side, wherein the front side is configured to receive light and the back side is opposite to the front side;

a first electrode pad adjacent to the optical element area;

a sealing material above the optical element area, wherein the sealing material covers the first electrode pad;

an organic layer between the first electrode pad and the sealing material;

a second electrode pad on the substrate, wherein the organic layer is not between the second electrode pad and the sealing material; and

an electrode electrically connected to the first electrode pad,

wherein the first electrode pad is electrically connected to an external connection terminal via the electrode.

2. The image pickup apparatus according to claim 1 ,

wherein the organic layer is a moth eye structure, and

wherein at least an area of the organic layer opposed to the optical element area has a fine pattern.

3. The image pickup apparatus according to claim 1 , wherein at least an area of the organic layer opposed to the optical element area comprises a transparent film having a moth eye structure with a fine pattern.

4. The image pickup apparatus according to claim 1 , wherein the organic layer comprises at least one region that has a cut-out region, in a depth direction.

5. The image pickup apparatus according to claim 1 , wherein the sealing material is configured to protect the optical element area.

6. The image pickup apparatus according to claim 1 , wherein the organic layer is arranged in a region excluding an area opposed to the optical element area.

7. The image pickup apparatus according to claim 1 , wherein the second electrode pad is indirectly connected to the organic layer.

8. The image pickup apparatus according to claim 1 , wherein the first electrode pad is configured to connect to a fixed potential.

9. The image pickup apparatus according to claim 1 , wherein the sealing material is a glass.

10. The image pickup apparatus according to claim 1 , wherein the electrode electrically connected to the first electrode pad is a through silicon via (TSV) connection.

11. The image pickup apparatus according to claim 1 , wherein the first electrode pad is on the front side of the substrate.

12. The image pickup apparatus according to claim 1 , wherein the organic layer is in contact with the optical element area.

13. The image pickup apparatus according to claim 12 ,

wherein the sealing material is configured to protect the optical element area of an optical device,

wherein the organic layer is arranged on a surface of the sealing material, which is opposed to the optical element area.

14. A camera module, comprising:

at least one lens configured to form a subject image on an optical element area, and

an image pickup apparatus, comprising:

a substrate having a front side that includes the optical element area and a back side, wherein the front side is configured to receive light and the back side is opposite to the front side;

a first electrode pad adjacent to the optical element area;

a sealing material above the front side of the optical device, wherein the sealing material covers the first electrode pad;

an organic layer between the front side of the optical device and the sealing material;

a second electrode pad on the substrate, wherein the organic layer is not between the second electrode pad and the sealing material;

an electrode electrically connected to the first electrode pad,

wherein the first electrode pad is electrically connected to an external connection terminal via the electrode.

15. The camera module according to claim 14 , wherein the organic layer is a moth eye structure, and wherein at least an area of the organic material opposed to the optical element area shows optical characteristics with a fine pattern.

16. The camera module according to claim 14 , wherein at least an area of the organic layer opposed to the optical element area comprises a transparent film having a moth eye structure with a fine pattern.

17. The camera module according to claim 14 , wherein the organic layer comprises at least one region that has a cut-out region in a depth direction.

18. The camera module according to claim 14 , wherein the sealing material is configured to protect the optical element area.

19. The camera module according to claim 14 , wherein the organic layer fills a gap between the sealing material and the optical element area.

20. The camera module according to claim 14 , wherein the first electrode pad is on the front side of the substrate.

21. The camera module according to claim 14 , further comprising a first lens stacked on the sealing material.

22. The camera module according to claim 21 , wherein the first lens is connected to the sealing material by an adhesive.

23. The camera module according to claim 21 , further comprising a second lens stacked on the first lens.

24. The camera module according to claim 23 , further comprising a cover, wherein the cover covers the first lens, the second lens, and the sealing material.

25. The camera module according to claim 24 , wherein the cover covers at least a part of the optical element area.

26. The camera module according to claim 25 , wherein the image pickup apparatus is substantially cube shaped.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: SUZUKI, MASAMI; HIGASHITSUTSUMI, YOSHIHITO
To: SONY CORPORATION
Reel/Frame 052765/0790 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2020
From: SUZUKI, MASAMI; HIGASHITSUTSUMI, YOSHIHITO
To: SONY CORPORATION
Reel/Frame 051527/0869 →
Priority Claims (1)
JP 2011-176125 · Aug 11, 2011 · national
Continuity (3)
Continuation 15138887 · Apr 26, 2016
Continuation 13566401 · Aug 3, 2012
Related Publication 20170373018A1 · Dec 28, 2017
Cited By (1)
US 12,628,449