Granted Patent B2

US 12,628,449 · App. 18/118,264 · Granted May 12, 2026

Inventors: Mingzhu Wang (Zhejiang, CN); Takehiko Tanaka (Nara, JP); Lifeng Yao (Zhejiang, CN); Zhen Huang (Zhejiang, CN); Nan Guo (Zhejiang, CN); Xiaodi Liu (Zhejiang, CN); Zhenyu Chen (Zhejiang, CN)

Assignee: NINGBO SUNNY OPOTECH CO., LTD.

H10F39/804H10F39/024H10F39/026H10F39/806

Abstract

Claims (23)

1 . A method for manufacturing a photosensitive assembly, including the steps of:

(i) forming a plurality of isolation adhesive layers at a preset position of a chip wafer by a photolithography process, wherein the chip wafer has a plurality of photosensitive elements arranged in an array, and each photosensitive element is provided with the isolation adhesive layer in its non-photosensitive region;

(ii) covering at least one light transmitting element on at least one of the isolation adhesive layers;

(iii) cutting the chip wafer to form a plurality of the photosensitive modules;

(iv) conductively mounting at least one conductive member on the non-photosensitive region of the photosensitive element;

(v) arranging the photosensitive modules on a substrate in an array;

(vi) forming a molding body on the substrate through a molding process to encapsulate the photosensitive module and the conductive member;

(vii) mounting a circuit layer on the surface of the molding body on a light incident side, wherein the circuit layer is conductively connected to the conductive member, wherein the circuit layer has a plurality of light passing holes corresponding to the photosensitive paths of the photosensitive element, to form a photosensitive assembly jointed panel; and

(viii) cutting the photosensitive assembly jointed panel to form a plurality of photosensitive assemblies.

2 . The manufacturing method according to claim 1 , wherein the step (vii) further includes the steps of:

(vii.1) forming an extended wiring layer by a rewiring process on the surface of the molding body on the light incident side, wherein the extended wiring layer is conductively connected to the conductive member, wherein the extended wiring layer has a plurality of light passing holes corresponding to the photosensitive paths of the photosensitive element, to form the photosensitive assembly jointed panel.

3 . The manufacturing method according to claim 1 , wherein the step (vi) further includes the step of:

(vi.1) exposing the conductive member and the light transmitting element with respect to the molding body.

4 . The manufacturing method according to claim 1 , wherein the step (v) further includes the step of: providing at least one electronic component on the substrate, wherein an electrical connection surface of the electronic component is away from the substrate; in the step (vi), the molding body encapsulates the electronic component, the photosensitive module, and the conductive member; and in the step (vii), the circuit layer is electrically connected with the electrical connection surface of the electronic component.

5 . The manufacturing method according to claim 1 , wherein the step (vi) further includes the step of:

(vi.2) forming a first molding body integrally encapsulating the photosensitive module and the conductive member through a molding process to form a molding single body;

(vi.3) exposing the light transmitting element and the conductive member with respect to the first molding body;

(vi.4) turning over the molding single body and arranging in an array on the substrate so that the photosensitive surface of the photosensitive element faces the substrate;

(vi.5) providing at least one electronic component on the substrate, wherein the electrical connection surface of the electronic component contacts the substrate; and

(vi.6) integrally encapsulating the molding single body and the electronic component through a molding process to form a second molding body.

6 . The manufacturing method according to claim 1 , wherein the step (vii) further includes the steps of:

(vii.2) turning over the second molding single body so that the non-photosensitive surface of the photosensitive element faces the substrate, and the electrical connection surface of the electronic component is away from the substrate;

(vii.3) electrically connecting and mounting the circuit layer and the conductive member, the electrical connection surfaces of the electronic component, and the circuit layer has a plurality of light passing holes corresponding to the photosensitive paths of the photosensitive element to form the photosensitive assembly jointed panel.

Priority Claims (1)

Continuity (2)

References Cited (59)