IHS component cooling system
An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.
1. A component cooling system, comprising:
a component;
at least one fan in fluid communication with the component; and
a fan control system that is coupled to the component and the at least one fan, wherein the fan control system is configured to:
receive, during a heat generating operation of the component, a first current ambient temperature from a first temperature sensor coupled to the fan control system;
detect an ambient temperature change based on the first current ambient temperature and, in response, determine a first component target temperature that is associated with the first current ambient temperature; and
operate the at least one fan in order to reduce a component temperature of the component that was received from a second temperature sensor to the first component target temperature.
2. The system of claim 1 , further comprising:
a memory system that stores a plurality of component target temperatures that are each associated with a different ambient temperature, wherein the fan control system determines the first component target temperature that is associated with the first current ambient temperature using the plurality of component target temperatures each associated with a different ambient temperature in the memory system.
3. The system of claim 2 , wherein the plurality of component target temperatures that are each associated with a different ambient temperature in the memory system are provided in a continuous component target temperature function that is a function of ambient temperature.
4. The system of claim 2 , wherein the plurality of component target temperatures that are each associated with a different ambient temperature in the memory system are provided in a discontinuous component target temperature function that is a function of ambient temperature.
5. The system of claim 2 , wherein the plurality of component target temperatures include a first set of component target temperatures that are each associated with a first component property and a second set of component target temperatures that are each associated with a second component property.
6. The system of claim 1 , wherein in response to operating the at least one fan in order to reduce the component temperature to the first component target temperature, a total system power consumption is minimized, and wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the component.
7. The system of claim 1 , wherein the fan control system is configured to:
receiving a second current ambient temperature from the first temperature sensor subsequent to determining the first current ambient temperature, wherein the second current ambient temperature is different than the first current ambient temperature;
determine a second component target temperature that is associated with the second current ambient temperature in the memory system, wherein the second component target temperature is different than the first component target temperature; and
operate the at least one fan in order to reduce the component temperature of the component to the second IHS component target temperature.
8. An information handing system (IHS), comprising:
a chassis;
a processing system that is located in the chassis and that includes a first temperature sensor;
at least one fan located in the chassis and in fluid communication with the processing system;
a second temperature sensor; and
a fan control system coupled to the processing system, the at least one fan, and the second temperature sensor, wherein the fan control system is configured to:
receive, during a heat generating operation of the processing system, a first current ambient temperature from the second temperature sensor;
detect an ambient temperature change based on the first current ambient temperature and, in response, determine a first processing system target temperature that is associated with the first current ambient temperature; and
operate the at least one fan in order to reduce a processing system temperature of the processing system that was received from the first temperature sensor to the first processing system target temperature.
9. The IHS of claim 8 , further comprising:
a memory system that is coupled to the fan control system and that stores a plurality of processing system target temperatures that are each associated with a different ambient temperature, wherein the fan control system determines the first processing system target temperature that is associated with the first current ambient temperature from the plurality of processing system target temperatures associated with a different ambient temperature in the memory system.
10. The IHS of claim 9 , wherein the plurality of processing system target temperatures that are each associated with a different ambient temperature in the memory system are provided in a continuous processing system target temperature function that is a function of ambient temperature.
11. The IHS of claim 9 , wherein the plurality of processing system target temperatures that are each associated with a different ambient temperature in the memory system are provided in a discontinuous processing system target temperature function that is a function of ambient temperature.
12. The IHS of claim 9 , wherein the plurality of processing system target temperatures include a first set of processing system target temperatures that are each associated with a first processing system property and a second set of processing system target temperatures that are each associated with a second processing system property.
13. The IHS of claim 8 , wherein in response to operating the at least one fan in order to reduce the processing system temperature to the first processing system target temperature, a total system power consumption is minimized, and wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the processing system.
14. The IHS of claim 8 , wherein the fan control system is configured to:
receive a second current ambient temperature from the second temperature sensor subsequent to receiving the first current ambient temperature, wherein the second current ambient temperature is different than the first current ambient temperature;
determine a second processing system target temperature that is associated with the second current ambient temperature in the memory system, wherein the second processing system target temperature is different than the first component target temperature; and
operate the at least one fan in order to reduce the processing system temperature of the processing system to the second IHS component target temperature.
15. A method for cooling components, comprising:
receiving, by a fan control system during a heat generating operation of a component, a first current ambient temperature from a first temperature sensor;
detecting an ambient temperature change based on the first current ambient temperature and, in response, determining, by the fan control system, a first component target temperature that is associated with the first current ambient temperature; and
operating, by the fan control system, the at least one fan in order to reduce a component temperature of the component that was received from a second temperature sensor to the first component target temperature.
16. The method of claim 15 , wherein the first component target temperature is associated with the first current ambient temperature in a memory system that is accessible to the fan control system and that stores a plurality of component target temperatures that are each associated with a different ambient temperature.
17. The method of claim 16 , wherein the plurality of component target temperatures that are each associated with a different ambient temperature in the memory system are provided in a continuous component target temperature function that is a function of ambient temperature.
18. The method of claim 16 , wherein the plurality of component target temperatures that are each associated with a different ambient temperature in the memory system are provided in a discontinuous component target temperature function that is a function of ambient temperature.
19. The method of claim 15 , wherein in response to operating the at least one fan in order to reduce the temperature of the component to the first component target temperature, a total system power consumption is minimized, and wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the component.
20. The method of claim 15 , further comprising:
receiving, by the fan control system subsequent to determining the first current ambient temperature, a second current ambient temperature from the first sensor that is different than the first current ambient temperature;
determining, by the fan control system, a second component target temperature that is associated with the second current ambient temperature in the memory system, wherein the second component target temperature is different than the first component target temperature; and
operating, by the fan control system, the at least one fan in order to reduce the component temperature of the component to the second component target temperature.