Methods and devices for improved space utilization in wafer based modules
Techniques for constructing a wafer based module are provided herein. For example, the techniques include providing a substrate, forming a pattern of conductive material relative to at least one of a surface plane of the substrate and an internal location within the substrate with the pattern of the conductive material including at least an exposed portion, mounting at least one electronic module to the exposed portion of the pattern of the conductive material, orienting the substrate orthogonal relative to a planar mounting surface such that the surface plane of the substrate is substantially orthogonal to the planar mounting surface, mounting one or more additional electronic modules on the planar mounting surface; and forming the semiconductor device by encapsulating the substrate, including the pattern of conductive material, the at least one electronic module and the one or more additional electronic modules within a mold compound.
1. An electrical component device having high component density comprising:
a planar bottom surface;
a planar top surface, the planar top surface being substantially parallel to and located on an opposite side of the electrical component device relative to the planar bottom surface;
a mold compound disposed between the planar bottom surface and the planar top surface;
one or more electronic modules disposed within the mold compound and operatively connected to at least one of the planar bottom surface and the planar top surface, each electronic module having a substantially planar electrical interconnection surface oriented substantially parallel to at least one of the planar bottom surface and the planar top surface and having electrical contacts facing a direction parallel to the at least one of the planar bottom surface and the planar top surface; and
a component assembly disposed within the mold compound and operatively connected to at least one of the planar bottom surface and the planar top surface, the component assembly having a substantially planar electrical interconnection surface oriented substantially orthogonal to at least one of the planar bottom surface and the planar top surface, wherein the electrical component device further comprises traces that provide electrical coupling to the one or more electronic modules from two surfaces of the mold compound and at least a portion of the traces terminate on a side of the substrate opposite of the planar top surface.
2. The electrical component device of claim 1 , wherein the component assembly further comprises:
a substrate having a substrate interconnect surface that connects to at least one of the planar bottom surface and the planar top surface of the electrical component device; and
at least one additional electronic module having a substantially planar electrical interconnect surface that operatively couples to at least a portion of the substrate interconnect surface.
3. The electrical component device of claim 2 , wherein the substrate interconnect surface includes:
a pattern of conductive material formed to connect to the at least one of the planar bottom surface and the planar top surface of the electrical component device,
wherein the pattern of the conductive material includes at least an exposed portion.
4. The electrical component device of claim 3 , wherein the planar electrical interconnect surface of the at least one additional electronic module electrically couples to at least a portion of the pattern of conductive material to operatively couple the at least one additional electronic module to at least the portion of the substrate interconnect surface.
5. The electrical component device of claim 2 , wherein the substrate is a printed circuit board, and wherein the substrate interconnect surface comprises a pattern of conductive material.
6. The electrical component device of claim 1 , wherein the at least one electronic module includes at least one of a die, an integrated circuit (IC), and a passive component.
7. The electrical component device of claim 1 , wherein the at least one electronic module is a die, and wherein the at least one of the additional electronic modules is a MEMS sensor.
8. The electrical component device of claim 1 , further comprising:
at least one interconnect layer formed along at least one of the planar bottom surface and the planar top surface, wherein the one or more electronic modules disposed within the mold compound and the component assembly are each operatively connected to the at least one interconnect layer.