Semiconductor device and method of manufacture
An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.
1. A method of manufacturing a semiconductor device, the method comprising:
forming an opening within a first dielectric layer to expose a first conductive region and a second conductive region, the first conductive region being separated from the second conductive region by a second dielectric layer, wherein the opening comprises a via portion and a trench portion; and
reducing a surface potential difference between the first conductive region and the second conductive region.
2. The method of claim 1 , wherein the first conductive region is electrically connected to an active area of a semiconductor substrate and wherein the second conductive region is electrically isolated from the active area.
3. The method of claim 1 , wherein the reducing the surface potential difference reduces the surface potential difference to a value below an oxidation reduction potential of a material of the first conductive region.
4. The method of claim 3 , wherein the material of the first conductive region comprises copper.
5. The method of claim 1 , wherein the reducing the surface potential difference comprises applying a first treatment chemical with a conductivity of between about 0.005 μS/cm and about 40 μS·cm.
6. The method of claim 5 , wherein the first treatment chemical comprises hexane.
7. The method of claim 1 , further comprising cleaning the opening after the reducing the surface potential difference.
8. A method of manufacturing a semiconductor device, the method comprising:
forming a first via opening within a low-k dielectric layer;
forming a first trench opening within the low-k dielectric layer, wherein the forming the first trench opening extends the first via opening through the low-k dielectric layer;
applying a treatment chemical within the first via opening and the first trench opening, wherein the treatment chemical releases surface charges from within the first via opening and the first trench opening; and
performing a liner removal process after the forming the first trench opening and prior to the applying the treatment chemical.
9. The method of claim 8 , further comprising cleaning the first via opening and the first trench opening after the applying the treatment chemical.
10. The method of claim 9 , wherein the cleaning the first via opening and the first trench opening comprises applying a cleaning solution different from the treatment chemical.
11. The method of claim 10 , wherein the cleaning solution comprises:
an oxidant; and
an organic solvent.
12. The method of claim 8 , wherein the forming the first via opening forms a second via opening separated from the first via opening.
13. The method of claim 12 , wherein the first via opening exposes a conductive region electrically connected to an active area of a semiconductor substrate and wherein the second via opening exposes a conductive region electrically isolated from the active area of the semiconductor substrate.
14. A method of manufacturing a semiconductor device, the method comprising:
depositing a low-k dielectric layer over a substrate;
forming a first opening in the low-k dielectric layer;
performing a liner removal process after the forming the first opening;
applying a first treatment chemical, the first treatment chemical being volatile and having a low conductivity;
cleaning the first opening with a first cleaning solution different from the first treatment chemical, the cleaning the first opening being performed after a removal of the first treatment chemical;
after the cleaning the first opening, rinsing the first opening; and
filling the first opening with a conductive material.
15. The method of claim 14 , wherein the first treatment chemical comprises hexane.
16. The method of claim 14 , wherein the first treatment chemical comprises isopropyl alcohol.
17. The method of claim 14 , wherein the first treatment chemical comprises acetone.
18. The method of claim 14 , wherein the first cleaning solution comprises an oxidant.
19. The method of claim 14 , wherein the rinsing the first opening comprises rinsing the first opening with deionized water.
20. The method of claim 14 , wherein the first opening comprises a via portion and a trench portion.