IP Library Granted Patent US 10,700,173
Granted Patent B2
US 10,700,173 · App. 15/949,730 · Granted Jun 30, 2020

FinFET device with a wrap-around silicide source/drain contact structure

Inventors: Yi Qi (Niskayuna, NY); Hsien-Ching Lo (Clifton Park, NY); Hong Yu (Rexford, NY); Yanping Shen (Saratoga Springs, NY); Wei Hong (Clifton Park, NY); Xing Zhang (Clifton Park, NY); Ruilong Xie (Niskayuna, NY); Haiting Wang (Clifton Park, NY); Hui Zhan (Clifton Park, NY); Yong Jun Shi (Clifton Park, NY)
Assignee: GLOBALFOUNDRIES Inc.
H01L29/41791H01L21/02532H01L21/02614H01L21/02636H01L21/30604H01L29/0847H01L29/42376H01L29/45H01L29/665H01L29/66636H01L29/66795H01L29/7851H01L21/02576H01L21/02579H01L21/31053H01L29/165H01L29/6656H01L29/66545H01L29/7848
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Quick Facts
Patent No.
US 10,700,173
App. No.
15/949,730
Granted
Jun 30, 2020
Kind
B2
Abstract

One illustrative FinFET device disclosed herein includes a source/drain structure that, when viewed in a cross-section taken through the fin in a direction corresponding to the gate width (GW) direction of the device, comprises a perimeter and a bottom surface. The source/drain structure also has an axial length that extends in a direction corresponding to the gate length (GL) direction of the device. The device also includes a metal silicide material positioned on at least a portion of the perimeter of the source/drain structure for at least a portion of the axial length of the source/drain structure and on at least a portion of the bottom surface of the source/drain structure for at least a portion of the axial length of the source/drain structure.

Claims (24)

1. A FinFET device with a gate width direction and a gate length direction, said device comprising:

a source/drain structure that, when viewed in a cross-section taken through said source/drain structure in a direction corresponding to said gate width direction, comprises a perimeter and a bottom surface, said source/drain structure also comprising an axial length that extends in a direction corresponding to said gate length direction; and

a metal silicide material positioned around an entirety of said perimeter of said source/drain structure for at least a portion of said axial length of said source/drain structure and on at least a portion of said bottom surface of said source/drain structure for at least a portion of said axial length of said source/drain structure.

2. The device of claim 1 , wherein said metal silicide material is positioned on an entirety of said bottom surface of said source/drain structure.

3. The device of claim 2 , wherein said metal silicide material comprises a bottom portion positioned under said bottom surface of said source/drain structure, wherein at least part of said bottom portion of said metal silicide material has, when viewed in a cross-section taken through said source/drain structure in a direction corresponding to said gate length direction, one of a U-shape, a semi-circular shape, a partial elliptical shape portion or a shield shape cross -sectional configuration.

4. The device of claim 1 , wherein said source/drain structure comprises a doped epitaxial semiconductor material.

5. The device of claim 4 , wherein said source/drain structure abuts a first side of an original substrate fin and wherein said device further comprises a gate structure positioned around at least a portion of said original substrate fin.

6. The device of claim 1 , further comprising a conductive source/drain structure that conductively contacts at least a portion of said metal silicide material.

7. A FinFET device with a gate width direction and a gate length direction, said device comprising:

an original substrate fin;

a gate structure positioned around at least a portion of said substrate original substrate fin;

a source/drain structure comprised of a doped epitaxial semiconductor material, said source/drain structure abutting a first side of said original substrate fin, said source/drain structure, when viewed in a cross-section taken through said source/drain structure in a direction corresponding to said gate width direction, comprises a perimeter and a bottom surface, said source/drain structure also comprising an axial length that extends in a direction corresponding to said gate length direction; and

a metal silicide material positioned around an entirety of said perimeter of said source/drain structure for at least a portion of said axial length of said source/drain structure and on at least a portion of said bottom surface of said source/drain structure for at least a portion of said axial length of said source/drain structure.

8. The device of claim 7 , wherein said metal silicide material is positioned on an entirety of said bottom surface of said source/drain structure.

9. The device of claim 7 , wherein said metal silicide material extends along substantially an entirety of said axial length of said source/drain structure.

10. The device of claim 8 , wherein said metal silicide material extends along substantially an entirety of said axial length of said source/drain structure.

11. The device of claim 8 , wherein said metal silicide material comprises a bottom portion positioned under said bottom surface of said source/drain structure, wherein at least part of said bottom portion of said metal silicide material has, when viewed in a cross-section taken through said source/drain structure in a direction corresponding to said gate length direction, one of a U-shape, a semi-circular shape, a partial elliptical shape portion or a shield shape cross -sectional configuration.

12. A FinFET device with a gate width direction and a gate length direction, said device comprising:

a source/drain structure that, when viewed in a cross-section taken through said source/drain structure in a direction corresponding to said gate width direction, comprises a perimeter and a bottom surface, said source/drain structure also comprising an axial length that extends in a direction corresponding to said gate length direction; and

a metal silicide material positioned on at least a portion of said perimeter of said source/drain structure for at least a portion of said axial length of said source/drain structure and on an entirety of said bottom surface of said source/drain structure for at least a portion of said axial length of said source/drain structure.

13. The device of claim 1 , wherein said metal silicide material extends along substantially an entirety of said axial length of said source/drain structure.

14. The device of claim 12 , wherein said metal silicide material extends along substantially an entirety of said axial length of said source/drain structure.

15. The device of claim 14 , wherein said metal silicide material extends around an entirety of said perimeter of said source/drain structure.

16. The device of claim 15 , wherein said source/drain structure comprises a doped epitaxial semiconductor material.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2018
From: QI, YI; LO, HSIEN-CHING; HONG, WEI; ZHANG, XING; SHEN, YANPING; YU, HONG; ZHAN, HUI; WANG, HAITING; SHI, YONG JUN; XIE, RUILONG
To: GLOBALFOUNDRIES INC.
Reel/Frame 045495/0533 →
Continuity (1)
Related Publication 20190312117A1 · Oct 10, 2019