Array antenna apparatus and method of manufacturing the same
An array antenna apparatus includes: a wiring substrate having a plurality of fed patch antennas and a plurality of active element circuits electrically connected to the plurality of fed patch antennas, respectively; and a plurality of antenna substrates each having a parasitic patch antenna. The plurality of antenna substrates are joined onto one wiring substrate. Thereby, it becomes possible to provide an array antenna apparatus that can be reduced in size and has excellent antenna characteristics.
1. An array antenna apparatus comprising:
a wiring substrate; and
a plurality of antenna substrates,
the wiring substrate including a first substrate that has a first surface and a wiring layer that is provided on the first surface of the first substrate, the first substrate having a plurality of active element circuits provided on the first surface, each of the plurality of active element circuits being configured to perform at least one of transmission or reception of an electromagnetic wave, the wiring layer having a plurality of patch antennas and an electrical connection, and each of the plurality of patch antennas being electrically connected to each of the plurality of active element circuits by the electrical connection,
each of the plurality of antenna substrates including a second substrate that has a second surface and a third surface on an opposite side of the second surface, and at least one parasitic patch antenna that is provided on the second surface of the second substrate, wherein each of the plurality of patch antennas feeds a signal to the at least one parasitic patch antenna,
the plurality of antenna substrates being joined onto one wiring substrate, with a gap between adjacent antenna substrates, including the second substrate, of the plurality of antenna substrates, and
a distance between the plurality of patch antennas and the first surface is shorter than a distance between the plurality of patch antennas and the third surface.
2. The array antenna apparatus according to claim 1 , wherein
the first substrate is a semiconductor wafer, and the second substrate is a printed circuit board.
3. The array antenna apparatus according to claim 1 , wherein
the first substrate is one of an Si substrate, an SiGe substrate, a GaAs substrate, an InP substrate, a GaSb substrate, an SiC substrate, and a GaN substrate.
4. The array antenna apparatus according to claim 1 , wherein
the wiring layer further has an insulating layer, and
at least a part of the electrical connection is provided inside the insulating layer.
5. The array antenna apparatus according to claim 4 , wherein
the insulating layer contains resin.
6. The array antenna apparatus according to claim 1 , wherein
the wiring layer further has a ground conductor layer,
the ground conductor layer is provided between the plurality of active element circuits and the plurality of patch antennas, and
the ground conductor layer is one conductor layer extending in a region larger than a region in which the plurality of patch antennas are arranged.
7. The array antenna apparatus according to claim 1 , wherein
the third surface of each of the plurality of antenna substrates is joined onto the wiring layer of the wiring substrate, and
each of the plurality of antenna substrates has a thickness defined by a distance between the second surface and the third surface of each of the plurality of antenna substrates, the thickness being 100 μm or more and 1 mm or less.
8. The array antenna apparatus according to claim 1 , wherein
the wiring substrate includes an alignment mark, and each of the plurality of antenna substrates includes an alignment mark.
9. The array antenna apparatus according to claim 1 , wherein
the gap between the plurality of antenna substrates is 0.1 mm or more and 1.2 mm or less, and the gap is filled with air.
10. The array antenna apparatus according to claim 1 , wherein
the gap between the plurality of antenna substrates is 0.2 mm or more and 0.6 mm or less, and the gap is filled with air.
11. An array antenna apparatus comprising:
a wiring substrate; and
a plurality of antenna substrates,
the wiring substrate including a first substrate that has a first surface and a wiring layer that is provided on the first surface of the first substrate, the first substrate having a plurality of active element circuits provided on the first surface, each of the plurality of active element circuits being configured to perform at least one of transmission or reception of an electromagnetic wave, the wiring layer having a plurality of patch antennas and an electrical connection, and each of the plurality of patch antennas being electrically connected to each of the plurality of active element circuits by the electrical connection,
each of the plurality of antenna substrates including a second substrate that has a second surface and a third surface on an opposite side of the second surface, and at least one parasitic patch antenna that is provided on the second surface of the second substrate, wherein each of the plurality of patch antennas feeds a signal to the at least one parasitic patch antenna,
the plurality of antenna substrates being joined onto one wiring substrate, with a gap between adjacent antenna substrates, including the second substrate, of the plurality of antenna substrates,
a distance between the plurality of patch antennas and the first surface is shorter than a distance between the plurality of patch antennas and the third surface, and
a plurality of adhesive films are arranged between the third surface of each of the plurality of antenna substrates and the first surface of the wiring substrate,
wherein each of the plurality of antenna substrates are joined onto the first surface of the wiring substrate by a respective adhesive film of the plurality of adhesive films.
12. The array antenna apparatus according to claim 11 , wherein
the adhesive film contains resin.
13. The array antenna apparatus according to claim 11 , wherein
the adhesive film has a dielectric loss tangent of 0.005 or less.
14. The array antenna apparatus according to claim 1 , wherein
solder is arranged between the third surface of each of the plurality of antenna substrates and the wiring substrate, and
the plurality of antenna substrates are joined onto the wiring substrate with solder.
15. The array antenna apparatus according to claim 1 , wherein
the second substrate has a dielectric loss tangent of 0.003 or less.
16. A method of manufacturing an array antenna apparatus, the method comprising:
forming a wiring substrate;
forming a plurality of antenna substrates; and
joining the plurality of antenna substrates onto one wiring substrate,
the forming a wiring substrate including
forming a plurality of active element circuits on a first surface of a first substrate, each of the plurality of active element circuits being configured to perform at least one of transmission or reception of an electromagnetic wave, and
forming a wiring layer on the first surface of the first substrate, the wiring layer having a plurality of patch antennas and an electrical connection, and each of the plurality of patch antennas being electrically connected to each of the plurality of active element circuits by the electrical connection, and
the forming a plurality of antenna substrates including providing at least one parasitic patch antenna on a second surface of a second substrate wherein each of the plurality of patch antennas feeds a signal to the at least one parasitic patch antenna, wherein the plurality of antenna substrates being joined onto one wiring substrate, with a gap between adjacent antenna substrates, including the second substrate, of the plurality of antenna substrates, and
a distance between the plurality of patch antennas and the first surface is shorter than a distance between the plurality of patch antennas and the third surface.
17. The method of manufacturing an array antenna apparatus according to claim 16 , wherein
the joining the plurality of antenna substrates includes aligning the plurality of antenna substrates with the wiring substrate while observing a first alignment mark formed on the wiring substrate and a second alignment mark formed on each of the plurality of antenna substrates.
18. The method of manufacturing an array antenna apparatus according to claim 16 , wherein
the joining the plurality of antenna substrates includes
determining a center position of each of the plurality of patch antennas and a center position of the parasitic patch antenna of each of the plurality of antenna substrates, and
aligning each of the plurality of antenna substrates with the wiring substrate such that the center position of each of the plurality of patch antennas and the center position of the parasitic patch antenna are located to correspond to each other.
19. The method of manufacturing an array antenna apparatus according to claim 16 , wherein
the joining the plurality of antenna substrates includes
a first bonding of temporarily bonding an adhesive film onto the plurality of antenna substrates, and
a second bonding of substantially bonding the plurality of antenna substrates onto the wiring substrate by the adhesive film.
20. The method of manufacturing an array antenna apparatus according to claim 17 , wherein
the joining the plurality of antenna substrates includes
a first bonding of temporarily bonding an adhesive film onto the plurality of antenna substrates, and
a second bonding of substantially bonding the plurality of antenna substrates having the adhesive film onto the wiring substrate, and
in the first bonding, the adhesive film is temporarily bonded onto the plurality of antenna substrates so as to prevent the adhesive film from covering the second alignment mark on each of the plurality of antenna substrates.
21. The method of manufacturing an array antenna apparatus according to claim 19 , wherein
the second bonding includes
temporarily bonding the plurality of antenna substrates having the adhesive film onto the wiring substrate; and
a third bonding of using a heat pressing apparatus to press the plurality of antenna substrates temporarily bonded onto the wiring substrate collectively against the wiring substrate while heating the plurality of antenna substrates temporarily bonded onto the wiring substrate, to substantially bond the plurality of antenna substrates collectively onto the wiring substrate.
22. The method of manufacturing an array antenna apparatus according to claim 21 , wherein
the third bonding includes causing the plurality of antenna substrates and the wiring substrate to adsorb onto the heat pressing apparatus during a time period from before heating the plurality of antenna substrates temporarily bonded onto the wiring substrate until completion of substantial bonding of the plurality of antenna substrates collectively onto the wiring substrate.
23. The method of manufacturing an array antenna apparatus according to claim 16 , wherein
the joining the plurality of antenna substrates includes joining the wiring substrate and the plurality of antenna substrates to each other with solder.
24. The method of manufacturing an array antenna apparatus according to claim 16 , wherein
the joining the plurality of antenna substrates includes joining each of the plurality of antenna substrates to the one wiring substrate by a respective adhesive film of a plurality of adhesive films provided to each of the plurality of antenna substrates.