Granted Patent B2

US 12,418,116 · App. 18/536,773 · Granted Sep 16, 2025

Inventors: Chunyun Jian (Ottawa, CA); Martin Da Silveira (Ottawa, CA); Neil McGowan (Stittsville, CA)

Assignee: Telefonaktiebolaget LM Ericsson (Publ)

H01Q21/0087H01Q21/0025H01Q21/061

Abstract

Claims (10)

1. An antenna-filter array module, comprising:

a module printed circuit board, PCB, having a first side and a second side, the first side having first soldering structures and configured to be soldered to a low-temperature co-fired ceramic, LTCC, tile, the second side having second soldering structures, the second side configured to be coupled to a radio PCB; and

an LTCC tile having at least two antenna elements and corresponding filters, the LTCC tile being soldered to the first side of the module PCB at the first soldering structures, the LTCC tile being cuttable into reliability issue free, RIF, units, each RIF unit being of a size not greater than a predetermined largest reliable size.

2. The module of claim 1 , wherein a difference between a coefficient of thermal expansion, CTE, of the module PCB and a CTE of the radio PCB is chosen to be less than a predetermined amount.

3. The module of claim 1 , wherein the module PCB and the radio PCB are of the same material and have the same CTE.

4. The module of claim 1 , wherein a size of the module PCB is greater than an area of an LTCC tile.

5. The module of claim 1 , wherein the size of an RIF unit is a size of one antenna element.

6. The module of claim 1 , wherein the size of an RIF unit is a size of two rows of two antenna elements per row.

7. The module of claim 1 , wherein the size of an RIF unit is a size of an antenna element of the at least two antenna elements.

8. The module of claim 1 , wherein a module PCB has a size equal to the LTCC tile before cutting.

Assignments (1)

Continuity (2)

References Cited (16)