Plating bath solutions

1. A single plating solution for use as both an initial and a replenishment solution for the same plating bath, comprising, in defined concentrations:

a metal salt selected from a group where the metal consists of nickel, cobalt, and copper;

a complexer, said complexer selected from the group consisting of lactic acid, malic acid, maleic anhydride, glycine, citric acid, citrates, glycolic acid or salts, succinic acid or salts, beta-alanine, EDTA, ammonium carbonate, ammonium chloride, propionic acid, tetra potassium pyrophosphate, and boric acid;

a reducing agent;

at least one pH adjuster; and

at least one stabilizer for stabilizing a plating reaction;

wherein said plating solution is mixable with water to form said bath and is also usable in the same defined concentrations for replenishing said bath.

2. The plating solution of claim 1 , further comprising at least one type of particulate matter.

3. The plating solution of claim 2 , further comprising at least one type of particulate matter stabilizer.

4. The plating solution of claim 1 , wherein a pH of the bath formed using the initial solution is in a specified range and a pH of said bath is in the same range after replenishment.

5. The plating solution of claim 1 , wherein said stabilizer is selected from the group consisting of lead, bismuth, tin, copper, antimony, sulfur, and non-metal stabilizers.

6. The plating solution of claim 1 further comprising at least one selected from the group consisting of a brightener, a buffer, or an accelerator.

7. The plating solution of claim 1 , wherein the solution is conformant to RoHS, ELV, and WEEE regulations.

8. The plating solution of claim 1 , wherein a nickel concentration of the initial bath and the bath upon replenishment is six grams per liter or less.

9. The plating solution of claim 1 further comprising at least one of diamond, silicon carbide, boron nitride, PTFE, graphite, carbides, oxides, fluorides, and visually detectable particles, wherein said detectable particles include at least one of the group consisting of insoluble, fluorescent, or otherwise visually detectable particles, and said visual detectability is related to at least one from the group consisting of phosphorescent, fluorescent, chemically, and electronically detectable.

10. The plating solution of claim 1 , wherein said plating bath is an electroless nickel plating bath.

11. The plating solution of claim 1 , wherein said solution includes ammonium hydroxide.

12. The plating solution of claim 1 , wherein said at least one pH adjuster is selected from the group consisting of potassium carbonate, ammonium carbonate, potassium hydroxide, sodium hydroxide, or other ammonium, or hydroxide or carbonate compound.

13. The plating solution of claim 1 , wherein said plating solution is usable for at least 8 metal turn overs of said bath.

14. The plating solution of claim 1 , wherein said plating solution is not formed through regeneration of a plating bath.

15. The plating solution of claim 1 wherein said plating bath is directed to commercial use.

16. A plating solution concentrate for a replenishment plating process comprising, in defined concentrations:

a complexer;

at least one pH adjuster, said pH adjuster selected from the group consisting of potassium carbonate, ammonium carbonate, potassium hydroxide, sodium hydroxide, ammonium hydroxide, or carbonate compound; and

at least one stabilizer for stabilizing a plating reaction;

wherein said plating solution concentrate is mixable with at least one of the group consisting of a metal salt, and a reducing agent to form a plating bath, and said plating solution concentrate in the same defined concentrations is usable to replenish said plating bath, and said plating bath is used for plating objects.

17. The plating solution concentrate of claim 16 , wherein said complexer is selected from the group consisting of lactic acid, malic acid, maleic anhydride, glycine, citric acid, citrates, glycolic acid or salts, succinic acid or salts, beta-alanine, EDTA, ammonium carbonate, ammonium chloride, ammonium hydroxide, propionic acid, tetra potassium pyrophosphate and boric acid.

18. A plating solution concentrate for a replenishment plating process, comprising:

a complexer, selected from the group consisting of lactic acid, malic acid, maleic anhydride, glycine, citric acid, citrates, glycolic acid or salts, succinic acid or salts, beta-alanine, EDTA, ammonium carbonate, ammonium chloride, ammonium hydroxide, propionic acid, tetra potassium pyrophosphate, and boric acid;

at least one pH adjuster, said pH adjuster selected from the group consisting of potassium carbonate, ammonium carbonate, potassium hydroxide, sodium hydroxide, or other ammonium, or hydroxide or carbonate compound; and

at least one stabilizer for stabilizing a plating reaction;

wherein said plating solution concentrate is formed in defined concentrations, is mixable with at least one of the group consisting of a metal salt and a reducing agent in defined concentrations to form a plating solution, and wherein said plating solution is added to water to form an initial plating bath usable for plating objects and said plating solution is also usable in the same defined concentrations for replenishing said bath.

19. The plating solution concentrate of claim 18 further comprising at least one of diamond, silicon carbide, boron nitride, PTFE, graphite, carbides, oxides, fluorides, and visually detectable particles, wherein said detectable particles include at least one of insoluble, fluorescent or otherwise visually detectable particles, and said visually detectability is related to at least one from the group consisting of phosphorescent, fluorescent, chemically, and electronically detectable.