Imaging panel
An imaging panel includes an active matrix substrate having pixels each with a photoelectric conversion element, a scintillator provided on a surface of the active matrix substrate, a damp-proof material entirely covering the scintillator, and an adhesive layer bonding the damp-proof material to the scintillator and the active matrix substrate. The active matrix substrate includes a first flattening film that is configured as a photosensitive resin film and is provided inside and outside a pixel region, and a first inorganic film that is provided between the first flattening film and the scintillator, is overlapped in a planar view with an entire region of the scintillator, and is in contact with the first flattening film, at least outside the pixel region. At least partial region on the first inorganic film, outside the region overlapped in a planar view with the scintillator, is covered with the adhesive layer.
1. An imaging panel comprising:
an active matrix substrate having a pixel region provided with a plurality of pixels each including a photoelectric conversion element;
a scintillator provided on a surface of the active matrix substrate and configured to convert an X-ray to scintillation light;
a damp-proof material entirely covering the scintillator; and
an adhesive layer bonding the damp-proof material to the scintillator and the surface of the active matrix substrate; wherein
the active matrix substrate includes
a first flattening film provided inside and outside the pixel region and configured as a photosensitive resin film, and
a first inorganic film provided between the first flattening film and the scintillator, overlapped in a planar view with an entire region provided with the scintillator, and being in contact with the first flattening film, at least outside the pixel region, and
the first inorganic film has a region that is positioned outside the region overlapped in a planar view with the scintillator and is at least partially covered with the adhesive layer.
2. The imaging panel according to claim 1 , wherein the first inorganic film has a surface that is not facing the first flattening film and is in contact with the scintillator.
3. The imaging panel according to claim 1 , wherein
the active matrix substrate further includes an organic film that is in contact with a surface, not facing the first flattening film, of the first inorganic film, and is in contact with the scintillator, and
the organic film has an end covered with the adhesive layer.
4. The imaging panel according to claim 1 , wherein
the active matrix substrate further includes a second inorganic film provided on a surface, not facing the first inorganic film, of the first flattening film, inside and outside the pixel region, and
the second inorganic film is provided continuously from the pixel region to outside the pixel region.
5. The imaging panel according to claim 4 , wherein
the active matrix substrate further includes a second flattening film configured as a photosensitive resin film and provided to oppose the first flattening film with the second inorganic film being interposed therebetween, inside and outside the pixel region, and
the second flattening film covers the photoelectric conversion element in each of the pixels in the pixel region.
6. The imaging panel according to claim 5 , wherein the active matrix substrate further includes
a line provided in each of the pixels, and
a metal film provided between the second inorganic film and the second flattening film, outside the pixel region, and
the metal film is connected to the line via a contact hole.
7. The imaging panel according to claim 6 , wherein the line is provided between the second inorganic film and the second flattening film in the pixel region, and is connected to the photoelectric conversion element in a corresponding one of the pixels.