FinFET with reduced parasitic capacitance
A semiconductor device including at least one fin extending upward from a substrate and a gate on the substrate, wherein the gate includes outer sidewalls, wherein the fin extend through a width of the gate. A spacer material can be adjacent to the outer sidewalls of the gate, wherein a top surface of the spacer material is below the top surface of the gate and above the top surface of the fin. The semiconductor device can also include an epitaxial semiconductor layer over the fins on each side of the spacer material. A low-k dielectric material can be deposited above each epitaxial semiconductor layer. The semiconductor device also includes a dielectric top layer forming a top surface of the transistor, wherein the dielectric top layer seals an air gap between the top surface of the fins and the dielectric top layer.
1. A semiconductor device, comprising:
at least one fin on a substrate;
a gate on the substrate, wherein the gate includes outer sidewalls, wherein the at least one fin extends through a width of the gate;
spacer material adjacent to the outer sidewalls of the gate;
an epitaxial semiconductor layer over the at least one fin on each side of the spacer material;
a dielectric material above the epitaxial semiconductor layer, wherein the dielectric material is adjacent to the spacer material;
a dielectric top layer forming a top surface of the transistor; and
an air gap sealed between the dielectric top layer and a bottom surface, the bottom surface comprising a top surface of the at least one fin and a top surface of the spacer material in contact with the at least one fin, the air gap extending beyond a top surface of the gate.
2. The semiconductor device of claim 1 , wherein the air gap has a width of about 3 nm to about 10 nm.
3. The semiconductor device of claim 1 , wherein the air gap is continuous from the top surface of the at least one fin to a pinch-off region defined by the dielectric top layer that seals the air gap.
4. The semiconductor device of claim 1 , wherein the dielectric top layer includes nitrides.
5. The semiconductor device of claim 1 , wherein the dielectric top layer includes oxides.
6. The semiconductor device of claim 1 , further comprising a source region on a first side of the spacer and a drain region on a second side of the spacer.
7. The semiconductor device of claim 1 , wherein a bottom portion of the air gap extends below the top surface of the spacer material.
8. The semiconductor device of claim 1 , wherein a self-aligned contact cap directly contacts the top surface of the gate.
9. The semiconductor device of claim 1 , further comprising trench silicide regions in the dielectric material.
10. The semiconductor device of claim 9 , wherein the trench silicide regions are positioned above the epitaxial semiconductor layer.
11. A semiconductor device, comprising:
a plurality of fins on a substrate;
a gate on the substrate, wherein the gate includes outer sidewalls, wherein the plurality of fins extend through a width of the gate;
spacer material adjacent to the outer sidewalls of the gate;
an epitaxial semiconductor layer over the plurality of fins on each side of the spacer material;
a dielectric material above the epitaxial semiconductor layer, wherein the dielectric material is adjacent to the spacer material;
a dielectric top layer forming a top surface of the transistor; and
an air gap sealed between the dielectric top layer and a bottom surface, the bottom surface comprising a top surface of the plurality of fins and a top surface of the spacer material in contact with the plurality of the fins, the air gap extending beyond a top surface of the gate.
12. The semiconductor device of claim 11 , wherein the air gap has a width of about 3 nm to about 10 nm.
13. The semiconductor device of claim 11 , wherein the air gap is continuous from the top surface of the plurality of fins to a pinch-off region defined by the dielectric top layer that seals the air gap.
14. The semiconductor device of claim 11 , wherein the dielectric top layer includes nitrides.
15. The semiconductor device of claim 11 , wherein the dielectric top layer includes oxides.
16. The semiconductor device of claim 11 , further comprising a source region on a first side of the spacer and a drain region on a second side of the spacer.
17. The semiconductor device of claim 11 , wherein a bottom portion of the air gap extends below the top surface of the spacer material.
18. The semiconductor device of claim 1 , wherein a self-aligned contact cap directly contacts the top surface of the gate.
19. The semiconductor device of claim 11 , further comprising trench silicide regions in the dielectric material.
20. The semiconductor device of claim 19 , wherein the trench silicide regions are positioned above the epitaxial semiconductor layer.